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| 2010-07-09 | TI adopts new packaging tech for 45nm devices TI adopts new packaging tech for 45nm devices |
| 2007-10-18 | Program addresses novel IC packaging issues Program addresses novel IC packaging issues |
| 2007-10-11 | Thermal tech addresses power mgmt issues in IC packaging Thermal tech addresses power mgmt issues in IC packaging |
| 2007-03-16 | Address SI issues in high-speed board design This article discusses some of the SI challenges and the factors associated with high-speed interface designs that are enabled with key features of a RapidIO switch. |
| 2006-02-14 | FlipChip starts constructing bumping facility FlipChip International LLC has announced that it started construction of an advanced bumping facility for a joint venture in China with Millennium Microtech (Shanghai) Co. Ltd. |
| 2006-01-25 | Amkor packaging aids wirebond-to-flip chip transition Amkor packaging aids wirebond-to-flip chip transition |
| 2005-09-21 | IDT offers network engines in RoHS-compliant flip-chip packaging IDT offers network engines in RoHS-compliant flip-chip packaging |
| 2001-08-01 | Few-chip packaging: An MCM renaissance Few-chip packaging: An MCM renaissance |
| 2001-09-16 | Improving compression-type flip-chip bonding Improving compression-type flip-chip bonding |
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