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2012-04-12 10x10mm GPS receiver touts low 15mW power usage
OriginGPS unveils the ORG1410, touted as the world's smallest complete GPS receiver that offers high levels of integration and sensitivity, low power consumption and an ultra-compact footprint.
2012-03-07 NFC sol'n ups wireless data throughput
NXP's PN547 enhances wireless data throughput, doubles the RF range, reduces footprint by half and lowers power consumption by 50 percent compared to its previous solution.
2012-02-21 A look at Micro SMDxt wafer level CSP
Here's a comprehensive discussion on Micro SMDxt wafer level chip scale package.
2012-02-02 Telit opts Calixto as India competence centre
With this, Telit aims to expand its footprint in India and target markets such as AMR, telematics and remote monitoring.
2012-01-27 Integrated converters boast best power use
ZMDI's ZSPM401x line of power management DC/DC converters were designed to simplify design, minimise part count, and cut product footprint.
2012-01-27 Open frame power supply boasts compact size
GE's 200W, 12Vdc single-output CLP0212 open frame power supply offers 80 PLUS Gold energy efficiency and 18W/in3 power density in a compact 50.80mm x 101.60mm (2 x 4inch) footprint.
2011-12-01 MOSFET series extends package footprint options
MOSFET series extends package footprint options
2011-11-10 Bus port protection comes in LLP2510 package
Vishay launches the VBUS54ED-FBL, a 4-line bus port protection array that features a compact 2.5x1mm footprint and ultra-low profile of 0.55mm.
2011-10-31 e-cars look to gain perfect sound experience
Volvo Car Corp. looks to find the right acoustic profile for the Volvo V60 Plug-in Hybrid to gain a seamless, pleasant sound experience.
2011-10-07 Performance, design of LM5046 reference board
Learn about the performance and operations of LM5046 reference board, which is designed in the telecom industry standard one-eighth brick footprint based on the phase-shifted full-bridge topology.
2011-09-20 LLC power supply ICs save space, cut system cost
Power Integrations unleashes HiperLCS, a high-frequency LLC converter IC family that maximises power supply efficiency, minimises footprint.
2011-09-14 LIN transceivers save 75% PCB area
Atmel launches ATA6670 and ATA6663, claimed as first local interconnect network (LIN) transceiver ICs in smaller DFN packages to enable smaller footprint.
2011-09-05 10.5mm3 3-axis gyroscope touts high accuracy
STMicroelectronics unveils the L3G3250A, a small high-performance three-axis analogue gyroscope with a 10.5mm3 footprint, a reduction of 40 per cent.
2011-09-01 Lambda sensor touts high temperature resistance
Bosch Group reveals the LSF Xfour lambda sensor that touts smaller footprint, more accurate measurement and 2x faster response time.
2011-08-25 Designing with PowerQUICC II Pro MPC8309 processor
Learn about generally recommended connections for new designs based on Freescale's MPC8309 processor.
2011-08-08 DC-DC converters reduce power loss up to 50%
GE Energy unveils hammerhead series of DC-DC converters that offer wide input range, extreme temperature tolerance, and DOSA standard footprint for multiple industrial applications.
2011-07-18 4A buck regulator touts ultra-small 200mm2 size
Semtech reveals the SC286 touted as the smallest 4A, dual-channel regulator for point-of-load (POL) applications with a compact, overall design footprint of less than 200mm2.
2011-07-05 SolarMagic SM73201 DC Arc detection evaluation board
The SolarMagic reference design kit RD-195 includes the SM73201-ARC-EV PCB which is a UL1699B compliant Photo-Voltaic Arc Detect System with a footprint of less than 50mm x 30mm.
2011-06-27 Tilera's 64bit cloud processors tout low power use
Tilera says its 64bit cloud processor family delivers a ten-fold performance-per-watt advantage over Intel's SandyBridge processor family with its lower system power consumption and footprint offer.
2011-06-13 IBM expands with office in Coimbatore
IBM opens its new branch office in Coimbatore, Tamil Nadu as part of its operation expansion to more than 40 cities across India by 2013.
2011-06-08 RIM unit licenses Cortus security core
Certicom has licensed Cortus' APS3 32bit RISC, a compact 32bit processor designed for low transistor count and offering 32bit performance on a silicon footprint that is the same as an 8bit 8051.
2011-06-07 Flextronics grows in India, Turkey
Flextronics expands its markets in Mumbai and Istanbul to broaden its competitive footprint in India and add a new service zone for the Mediterranean Rim, Middle East and Africa.
2011-05-20 Optocouplers boast 50% smaller package size
Avago debuts the ACPL-P34x and ACPL-W34x gate drive optocouplers that enable higher output current drive with rail-to-rail capability in stretched SO6 package that is 50 per cent smaller than the DIP package.
2011-05-04 Watchdog device offers high-risk functional safety
Infineon debuts the Signature Watchdog CIC61508, a watchdog offering high-risk functional safety compliance with the IEC61508 and ISO26262 automotive industry standards in a TSSOP-38 footprint.
2011-05-02 80mm2 buck regulator targets portable power mgmt
Semtech reveals the SC197, a 500mA, dual-output, point-of-load (POL) regulator, combining two PWM DC/DC regulators with an overall design solution footprint of 80mm2.
2011-04-07 60A regulator claims 95% peak efficiency
IR introduces the IR3550 offering small footprint, simplified DC/DC converter design, enhanced efficiency and performance aimed at next-generation high performance servers, storage and communication systems.
2011-03-31 DSP core targets cellular base band
Aimed at cellular base bands, Tensilica's Xtensa LX4 boasts lower power and a smaller footprint, reaching speeds of more than 1GHz in a high-performance 45nm process with an area of only 0.044mm2.
2011-02-24 Energy-friendly MCUs save space
Energy Micro's EFM32 Gecko and Tiny Gecko 48-pin ARM Cortex-M3 based microcontrollers enable manufacturers to take device footprint down to 7 x 7mm at a pin pitch of 0.5mm.
2011-02-02 SIP POL converters target PCB-mounted apps
Bel Power adds to its VRPx series of single inline package (SIP) footprint point-of-load (POL) converters to include 30A, 90A, 100A, 110A and 120A modules targeted at PCB-mounted applications.
2011-01-25 Power conversion IC achieves <60mW no-load up to 65W
Power Integrations' 12-pin package measuring 119sq mm footprint eliminates heatsink and achieves <60mW no-load in power supplies up to 65W.
Max's Cool Beans

Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

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