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| 2012-01-04 | Heatsinks target TO-220,TO-247 components Ohmite's R2 series of heatsinks are available in degreased and black anodized finishes and attaches with a camming clip instead of a screw. |
| 2011-06-17 | Thermal dissipation and design of a heatsink Thermal dissipation and design of a heatsink |
| 2011-05-11 | Audio SoC supports up to 50W, cuts external heatsink Audio SoC supports up to 50W, cuts external heatsink |
| 2011-01-25 | Power conversion IC achieves <60mW no-load up to 65W Power Integrations' 12-pin package measuring 119sq mm footprint eliminates heatsink and achieves <60mW no-load in power supplies up to 65W. |
| 2010-12-23 | PCB thermal tech packs copper heatsink within board PCB thermal tech packs copper heatsink within board |
| 2010-09-06 | LED North America licenses cooling tech from ORNL Department of Energy's Oak Ridge National Laboratory (ORNL) has developed graphite foam technology which passively cools components in LED lamps and has exclusively licensed the same to LED North America. |
| 2009-04-14 | DC/DC modules designed for industrial apps Powersolve has introduced the TEP-100 family of 100W isolated high performance DC/DC converter modules. |
| 2007-08-14 | Understand the evolving motion-control requirements for PC fans Increasing heat dissipation requires advanced cooling techniques and consideration, for noise control and efficiency. |
| 2006-02-14 | High-power white LED achieves 150 lumens Plus Opto has announced a range of high power LEDs that can achieve 150 lumens at 350mA drive current and is constructed in a robust 8-pin package with integral heatsink for efficient thermal management. |
| 2006-02-08 | maxiFLOW heatsinks cool BGAs in low air flow Advanced Thermal Solutions has introduced maxiFLOW heatsinks for cooling BGAs and other hot components in restricted air-flow conditions. Available in a wide range of sizes, these heatsinks are said to reduce device junction temperatures by more than 40 per cent below temperatures achieved by using other heatsinks. |
| 2001-08-20 | Calculation of junction temperature This application note presents systematic computational techniques in getting the junction temperature of transistors. |
| 2001-08-20 | Heatsink issues for IGBT modules Heatsink issues for IGBT modules |
| 2005-09-13 | Heatsink delivers optimal cooling Heatsink delivers optimal cooling |
| 2001-08-21 | Formulating technical enquiries This application note presents some guidelines on how to formulate technical inquiries for thyristors, rectifiers or heatsink assemblies. |
| 2002-05-10 | Mechanical support components for S.E.C. cartridge processors This application note provides procedures to exactly copy the design Intel is enabling through a set of mechanical specifications for a set of mechanical support components used for the Pentium II processor. |
| 2003-06-20 | Mounting Guidelines for the SUPER-220 This application note outlines the thermal options available to designers with regard to interface materials, clip types and the contact forces required to give good thermal contact and performance. |
| 2003-06-20 | Mounting Considerations for International Rectifier's Power Semiconductor Packages. This application note discusses the proper practice/procedure in mounting power semiconductors packages. |
| 2003-06-27 | ADD-A-Pack Module Mounting Instructions This application note discusses the recommended procedure of mounting the ADD-A-Pack module. |
| 2003-06-30 | Mounting Guidelines for the SUPER-247 This application note discusses the procedures involved in clip mounting the SUPER-247 to heatsinks. |
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