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| 2011-09-09 | Solder soln's boost reliability, stability Nihon Superior presents a new range of SN100C products at the upcoming Productronica India 2011 exhibition, scheduled to take place September 13-16, 2011 at the Pragati Maidan, New Delhi, India. |
| 2010-02-05 | Automotive MOSFETs boast 0.7mΩ RDS(on) International Rectifier rolls out the AUIRF7739L2 and AUIRF7665S2 automotive DirectFET2 power MOSFETs that are entirely lead-free and offer overall system level size and cost reduction. |
| 2009-10-26 | Guidelines for using Fairchild's Power56 This note will examine techniques for mounting the Power56 in both prototype and manufacturing environments using eutectic and lead-free solder pastes. |
| 2009-02-16 | Reflow soldering of Pb-free packages SHORT DESCRIPTION |
| 2008-09-15 | New techniques lower solar concentrators cost Arch developed solar mirror manufacturing techniques that deliver more efficient concentrator photovoltaic units. |
| 2006-10-09 | Mitigating PCB RoHS concerns for reliable electronics This article discusses possible solutions to major concerns relating to PCB assembly failure due to RoHS conversion. |
| 2007-01-08 | The RoHS aftermath Before July 1, 2006, the consequences of RoHS implementation were not easy to forecast. Tom Adams examines the impact post implementation. |
| 2008-05-12 | When SnPb meets lead-free When SnPb meets lead-free |
| 2008-05-05 | GbE switches go 'green' for SMBs Broadcom announces first lead-free 65nm single-chip GbE switch products for SMB applications. |
| 2007-05-24 | Pb-free Intel processors in future Intel informed that its future processors, which include its entire family of 45nm, high-k and metal gate devices, are going 100-per cent lead-free. |
| 2007-01-25 | Xilinx announces dev platform for medical, video apps Xilinx has announced immediate availability of its lead-free, RoHS compliant ML410 development platform. |
| 2006-12-21 | AMD licenses Amkor's Pb-free bumping tech Advanced Micro Devices Inc. (AMD) has entered into an agreement to license Amkor Technology's Pb-free electroplated wafer bumping technology. Terms of the license agreement were not disclosed. |
| 2006-11-07 | Matsushita removes lead from its PDPs Matsushita Electric Industrial Co. Ltd has eliminated lead from all its plasma display panels, making it the first panel maker to comply with new environmental guidelines. |
| 2006-08-24 | Manufacturers face threat of disrupted revenue due to RoHS, WEEE directives Manufacturers now face a real possibility of lost or at the very least, disrupted revenue, with the implementation of RoHS and WEEE directives, according to M-Cubed. |
| 2006-08-11 | BGA to BGA adapter resolves soldering issues Aries Electronics is now offering a BGA-to-BGA adapter which resolves soldering issues when BGA devices with RoHS-compliant solder balls are assembled with other devices whose connections are not lead-free. |
| 2006-07-27 | Becoming environmentally conscious with green packaging Driven by EU regulatory initiatives, the momentum behind "green" manufacturing has increased. IDT's Anne Katz describes the challenges and her company's ongoing efforts in that direction. |
| 2006-07-17 | Testing solder joints for Pb-free connectors Manufacturers have been rapidly replacing tin-lead finishes on components and tin-lead solder in interconnects with lead-free finish and solder. This article details reliability testing of solder joints for Pb-free connectors. |
| 2006-06-09 | SG announces socket boards to support Pb-free packages System General Corp. has announced its latest socket boards that fully support TSOP48 Pb-free packaging specifications. |
| 2006-05-10 | Resin-sealed bolt-in EMI filters are RoHS compliant Spectrum Control Inc. is offering RoHS/lead-free versions of its resin-sealed bolt-in EMI filters. |
| 2006-05-04 | Vishay announces low impedance aluminium capacitors Vishay Intertechnology Inc. has announced a family of surface-mount aluminium capacitors with very low impedance, high ripple current and solderability under lead-free conditions. |
| 2006-04-05 | ON Semi offers clock management devices in 32-pin QFN package ON Semiconductor has announced that several of its clock management products are available in a lead-free, 32-pin QFN package. |
| 2006-01-24 | ON Semi shrinks audio analogue switch size Touted to be the industry's smallest audio analogue switches, ON Semi's new switches are offered in lead-free thin QFN/thin DFN packages. |
| 2006-01-01 | Adapting in-circuit test to lead-free PCB finishes Adapting in-circuit test to lead-free PCB finishes |
| 2005-10-04 | ST's latest acceleration sensors STMicroelectronics extended its range of dual-axis acceleration sensors with the introduction of two new devices housed in the tiny, lead-free LGA (Land Grid Array) package measuring 5-by-5-by-1.5mm. |
| 2005-08-05 | Agilent, Speedline partner on lead-free research experiments Agilent, Speedline partner on lead-free research experiments |
| 2005-08-22 | New camera module socket from SMK meets SMIA standard SMK's new lead-free socket accepts Standard Mobile Imaging Architecture (SMIA) specifications for the 9.5-by-9.5mm camera module known as SMIA95. |
| 2005-10-05 | NKK's pushbutton switches meet RoHS requirements Constructed with heat-resistant material, the new LP01 series of pushbutton switches from NKK Switches can withstand lead-free soldering. |
| 2005-10-21 | AVX tantalum capacitors available for RoHS-exempt apps AVX developed a tin-lead finish version of its conformally-coated tantalum radial leaded capacitor, which was initially introduced as the first lead-free component of its kind in January 2005. |
| 2005-11-08 | Philips Semiconductors completes RoHS conversion program Royal Philips Electronics has announced that the conversion to RoHS compliant/lead-free semiconductor products has been completed well ahead of European legislation mandating the manufacture of lead-free electronic products by July 1, 2006 |
| 2001-06-07 | Lead-free soldering for the attachment of µBGA packages Lead-free soldering for the attachment of µBGA packages |
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