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| 2010-09-22 | 15A DC/DC µModule regulator packs remote sensing Linear Technology unveils the LTM4627, a 15A DC/DC µModule regulator with onboard inductors, MOSFETs and supporting components in a 2.6g, 15 x 15mm and grid array (LGA) package. |
| 2009-03-05 | DC/DC systems housed in tiny LGA packages DC/DC systems housed in tiny LGA packages |
| 2009-02-10 | Solder, mount LGA sensor to PCB Solder, mount LGA sensor to PCB |
| 2009-01-15 | Evaluate LGA package's integrity Evaluate LGA package's integrity |
| 2008-11-20 | Smallest isolator includes LGA terminals Smallest isolator includes LGA terminals |
| 2008-06-13 | Gyroscope sensors provide reduced standby power ST has introduced a surface-mount MEMS single-axis yaw gyroscope for angular rate sensing up to 300°/s. |
| 2008-04-08 | LGA socket accommodates IC packages LGA socket accommodates IC packages |
| 2007-09-21 | Kontron 1.3 SHB fields Intel remote mgmt engine Kontron introduced the new Kontron PCI-760 PICMG 1.3 System Host Board featuring the latest Intel Q35 GMCH chipset and LGA-775 socket-based Intel processors. |
| 2007-06-28 | DC/DC 4A regulator achieves 93% efficiency Linear Technology Corp. has introduced a complete 4-A regulator system with onboard controller, power switches, inductor and bypass capacitors housed in a 9-by-15mm LGA package. |
| 2007-01-18 | Test, burn-in sockets accept 0.40mm pitch devices Aries Electronics has announced that all sizes of its CSP/Micro BGA test and burn-in sockets accept devices with pitches as low as 0.40mm. These sockets can be used for manual testing of DSP, LGA, SRAM, DRAM and flash devices. |
| 2006-10-03 | Motor controller IC improves battery life in consumer apps STMicroelectronics' L7208 motor controller IC for 1.8-inch and sub-1.8-inch HDDs, in an ultrathin LGA package integrates its power FETs and all of the circuitry for driving the spindle motor and voice coil actuator. |
| 2006-06-27 | LGA caps deliver 'extremely low' ESL LGA caps deliver 'extremely low' ESL |
| 2005-10-04 | ST's latest acceleration sensors STMicroelectronics extended its range of dual-axis acceleration sensors with the introduction of two new devices housed in the tiny, lead-free LGA (Land Grid Array) package measuring 5-by-5-by-1.5mm. |
| 2001-04-01 | Power distribution for high-performance processors A new architecture not only addresses issues such as rising current transients, but also considers the limited space available for semiconductor devices and their associated power delivery systems. |
| 2001-06-07 | Land grid array (LGA) handling, mounting and thermal considerations Land grid array (LGA) handling, mounting and thermal considerations |
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