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| 2011-01-20 | IBM, Toppan focus on ArF immersion litho for 14nm IBM, Toppan focus on ArF immersion litho for 14nm |
| 2010-06-04 | Industry favours 193nm immersion, EUV litho in survey Industry favours 193nm immersion, EUV litho in survey |
| 2010-03-23 | Analyst: ASML, Nikon to share 22nm litho biz At 22nm, Intel will continue to use 193nm immersion lithography from two suppliers as per Arete Research analyst Jagadish Iyer. |
| 2010-03-10 | ASML, Nikon lock horns on Intel 22nm litho biz ASML Holding NV and Nikon Corp. have locked horns on the 22nm lithography business at Intel Corp. |
| 2010-02-25 | Intel delays EUV litho Intel Corp.'s yet again delays it extreme ultraviolet (EUV) plans in favour of extending its 193nm immersion to the 11nm logic node. |
| 2010-01-08 | Is TSMC switching to Nikon? In a surprise move, TSMC has procured a new 193nm immersion lithography scanner from rival Nikon Corp., according to sources. |
| 2009-09-23 | Soaring prices hinder Canon's litho dreams The end could be near for Canon Inc.'s lithography efforts, as the company is reportedly mulling plans to cease future, high-end scanner development, according to sources. |
| 2009-06-23 | Intel takes 193nm litho to 15nm Intel claims that it has pushed 193nm immersion lithography down to 15nm—at least in the lab. |
| 2008-11-27 | UMC validates high-k process at 45nm UMC has validated its high-k metal gate process with a test SRAM design run at the 45nm node. |
| 2007-10-08 | Toshiba explores 450mm fab, EUV litho tech Apart from exploring several new chip-production tech, Toshiba is also in talks with lithography partner Nikon and ASML Holding NV about the EUV technology. |
| 2007-08-03 | Qualcomm tapes out first chip on 45nm process Qualcomm has taped out its product on a low power-optimised 45nm process that uses advanced immersion lithography and very low k inter-metal dielectrics features. |
| 2007-06-15 | ST unveils low-power 45nm CMOS platform STMicroelectronics has unveiled details of its 45nm CMOS design platform that has already been used to tape-out the design of a highly integrated 45nm demonstrator SoC device. |
| 2007-04-16 | Litho woes pulling down semicon industry The lithography world has suddenly turned upside-down as the industry gets socked by a double whammy: The window of opportunity is slowly closing on EUV lithography for IC production, but the most likely alternative—a version of 193nm immersion—is proving expensive. |
| 2007-02-27 | IBM extends immersion lithography to 22nm IBM extends immersion lithography to 22nm |
| 2007-01-25 | NEC unveils CB-55L platform for cell-based ICs NEC Electronics Corp. has started offering its CB-55L platform for cell-based ICs developed on its UX7LS 55nm process technology. When NEC Electronics announced its UX7LS in November 2005, the company said immersion lithography technology would be used for critical processes. |
| 2006-12-14 | AMD, IBM announce results of 45nm IC project IBM and AMD have announced the early results of the use of immersion lithography, ultralow-K interconnect dielectrics and multiple enhanced transistor strain techniques on 45nm microprocessor process generation, at the International Electron Device Meeting early this week. |
| 2006-12-14 | ASML bags 45nm lithography deal ASML bags 45nm lithography deal |
| 2006-11-20 | EUV lithography makes slow progress, reports Intel EUV lithography makes slow progress, reports Intel |
| 2006-09-20 | Software designed for immersion lithography at 45nm Software designed for immersion lithography at 45nm |
| 2006-08-10 | Lithography research stalls at 32nm Lithography research stalls at 32nm |
| 2006-06-26 | NEC, NEC Electronics unveil high-k CMOS tech NEC Electronics and NEC have introduced a CMOS technology for system LSIs using design rules for 55nm and below. |
| 2006-02-24 | Immersion lithography 'nearly ready Immersion lithography 'nearly ready |
| 2005-12-07 | NEC's 55nm process reduces power consumption NEC has developed a 55nm node process named UX7LS that will employ immersion lithography and higher dielectric constant (high-k) material. |
| 2005-08-16 | ASML debuts hyper NA immersion ASML debuts hyper NA immersion |
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