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| 2012-04-20 | Renesas taps Synopsys' litho verification sol'n Renesas adopts Synopsys' Proteus LRC as a comprehensive lithographic verification solution offering high accuracy and low cost of ownership. |
| 2012-03-12 | PDK available for 14nm logic chips Imec's early-version PDK for 14nm logic chips targets the introduction of a number of new key technologies, such as FinFET technology and EUV lithography. |
| 2012-02-15 | CEA-Leti showcases 22nm maskless lithography CEA-Leti showcases 22nm maskless lithography |
| 2012-02-13 | Imec develops 300mm fab-compatible DSA process line Imec develops a directed self-assembly manufacturing process to improve both optical and extreme ultraviolet lithography. |
| 2011-10-24 | Glass used to stamp lab-on-chip nanosensors Researchers from MIT showcase an engraving technique that uses glass instead of polymer for low-cost lithography. |
| 2011-07-08 | E-beam lithography touts smaller chips E-beam lithography touts smaller chips |
| 2011-03-07 | Nano-imprint litho tool vendors optimistic Nano-imprint lithography has steadily made its mark in the IC domain as nano-imprint litho tool vendors achieve good defect density levels claiming that many tool platforms have shipped in the past year. |
| 2011-01-20 | IBM, Toppan focus on ArF immersion litho for 14nm IBM and Toppan Printing Co. Ltd of Japan will focus their joint development efforts on ArF immersion lithography for the 14nm logic technology node. |
| 2011-01-13 | Nissan Chemical, Sematech join forces on EUV research Nissan Chemical and Sematech have joined forces to cooperate on advanced adhesion enhancing materials in extreme UV lithography for 22nm chips. |
| 2010-12-23 | IBM, AZ research next-gen litho pattern techniques IBM Research-Almaden is working with AZ Electronic Materials (AZ) on the development of materials based on block copolymers aimed at Directed Self-Assembly (DSA) processes. |
| 2010-11-02 | Intel to split 22nm litho buy between Nikon, ASML Holding Nikon Corp. was Intel's sole lithography vendor for the 32nm node, but it is expected to share the 22nm business with ASML Holding NV., according to Barclays Capital. |
| 2010-10-26 | E-beam litho system features mask, direct-write apps Vistec Electron Beam GmbH presents its electron-beam lithography system that features both mask writing and direct-write applications. |
| 2010-09-30 | Photomask etcher designed for 22nm lithography Photomask etcher designed for 22nm lithography |
| 2010-09-23 | Opinion: e-beam critical to semiconductor manufacturing D2S Inc. CEO Aki Fujimura discusses the role of electron beam lithography in the future of semiconductor manufacturing and is of the opinion that all leading-edge designs will require e-beam technology. |
| 2010-08-25 | Harari's take on storage industry Eli Harari, founder, chairman and chief executive of SanDisk Corp., reflects on lithography, NAND and the post-NAND era during an interview with EE Times. |
| 2010-07-21 | Uncertainty clouds advanced lithography Uncertainty clouds advanced lithography |
| 2010-07-13 | EVG, IME partner on TSV process for 3D IC This joint development is set to enhance IME's 3D IC research and development capabilities in wafer bonding, lithography and chip stacking for 200-mm and 300-mm through-silicon via (TSV) process development. |
| 2010-06-28 | Stanford dean provides CMOS, education outlook James Plummer, dean of Stanford's school of engineering talks about the outlook for CMOS, engineering, education and globalisation. |
| 2010-06-25 | Nikon plans to revive fab tool business Nikon has formulated a three-year medium term management plan that will run from fiscal 2011 to 2013. One of the goals is to bring the fab tool business back in the black. |
| 2010-06-14 | EUV litho for 22nm unlikely to take-off EUV comes closer to the technical specifications that would allow high volume manufacturing but its arrival time is unlikely to benefit the mass production of the 22nm node. |
| 2010-06-04 | Industry favours 193nm immersion, EUV litho in survey A survey of technologists attending the Sematech Litho Forum revealed industry hails 193nm immersion double patterning and EUV as technologies to consider for manufacturing at 32nm and beyond. |
| 2010-04-28 | EUV light source achieves breakthrough output Japan's Extreme Ultraviolet Lithography System Development Association (EUVA) claims to have achieved the highest output for EUV light source at 104W. |
| 2010-04-27 | Novellus' CEO: IC market rebounds on real demand The IC industry is set for a new and healthy three-to-four year growth cycle, according to Novellus CEO Rick Hill. |
| 2010-04-26 | 3D patterning tech has an edge over e-beam litho IBM Research plans to use the 3D patterning technique for prototyping nanoscale CMOS electronics, optical components and meta-materials. |
| 2010-04-15 | TSMC moves from 28nm to 20nm half-node Taiwan Semiconductor Manufacturing Co. Ltd will give the 22nm "full node" a miss by moving on directly to the 20nm "half node" from the 28nm node. |
| 2010-04-12 | IBM: Expect design rule explosion beyond 22nm IBM researcher Kevin Nowka described the physical design challenges beyond the 22nm node, emphasizing that sub-wavelength lithography has made silicon image fidelity a serious challenge. |
| 2010-04-08 | EUV hits another hurdle in inspection tools EUV has hits another hurdle in the form of inspection tools as Sematech researcher Bryan Rice confessed that the industry still does not have them despite a lengthy R&D effort. |
| 2010-03-25 | Was EUV the wrong bet for the industry? If so, what should it be working on instead? And who will benefit in the long run? Litho experts and executives deliberate on these hot questions. |
| 2010-03-24 | IC forecasts: 10 reasons to cheer or fear Although the chip sector seems to be on the up this year, there are still some concerns. Here are 10 reasons to cheer—and fear—about 2010. |
| 2010-03-23 | Analyst: ASML, Nikon to share 22nm litho biz At 22nm, Intel will continue to use 193nm immersion lithography from two suppliers as per Arete Research analyst Jagadish Iyer. |
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