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| 2012-04-09 | Top 5 most counterfeited chips Top 5 most counterfeited chips |
| 2012-03-12 | PDK available for 14nm logic chips PDK available for 14nm logic chips |
| 2010-12-02 | Silicon etch system possesses 8 process chambers Applied Materials debuts its Centris Etch system for advanced memory and logic chip manufacturing which boasts of twice the speed and 30% reduction in CO2 emissions. |
| 2009-03-03 | IBM, Applied, NanoCollege to co-develop 22nm process modelling IBM Corp. and Applied Materials Inc. will be working with the College of Nanoscale Science and Engineering (CNSE) of the University at Albany on process modelling technology for the manufacture of 22nm logic and memory chips. |
| 2009-02-05 | Samsung, Xilinx partner for 45nm FPGAs Xilinx has chosen Samsung Electronics as its foundry partner for manufacturing 45nm programmable logic chips. |
| 2008-11-19 | TSMC ramps 40nm volume production TSMC has announced the volume production of its semiconductor foundry 40nm logic manufacturing process. |
| 2008-02-07 | Hawkins: Future chips will mimic human brain Hawkins: Future chips will mimic human brain |
| 2007-07-09 | FPGA-based module eases embedded system design Advanced Knowledge Associates' new logic module combines a 32bit ARM9-based MCU and high-density Xilinx Spartan 3E Series FPGA fabric, as well as all associated interfaces and power circuitry to facilitate accelerated advanced embedded system design. |
| 2007-07-09 | OPTi sues 8 companies over Compact ISA-Bus patent OPTi Inc. has filed a patent infringement lawsuit against eight companies for making, selling and offering products related to two U.S. patents entitled, "Compact ISA-Bus Interface". |
| 2007-06-21 | Fujitsu unveils platform tech for 45nm logic chips Fujitsu unveils platform tech for 45nm logic chips |
| 2007-04-11 | TSMC starts 45nm process TSMC has rolled out its 45-nm process technology for foundry customers, with plans to enter production as early as September 2007. |
| 2007-02-16 | Designing low-power multi-processor chips Designing low-power multi-processor chips |
| 2007-02-02 | Cadence develops 'first' complete low-power solution Cadence Design Systems has announced that it has developed a low-power solution, the industry's first fully integrated flow for logic design, verification and implementation of low-power chips. |
| 2007-01-31 | IBM tips high-k dielectrics, metal gates for logic apps IBM tips high-k dielectrics, metal gates for logic apps |
| 2006-12-05 | Winbond invests in EMLSI Winbond Electronics announced that it invested Rs.71.47 crore ($15.7 million) in Emerging Memory & Logic Solution Inc. (EMLSI), via its overseas subsidiary and received one seat on EMLSI's Board of Directors. |
| 2006-01-01 | Debug OCP designs with on-chip instrumentation Debug analysis and on-chip instrumentation are evolving to support more complex chips, addressing issues such as bus-level debug. |
| 2005-12-08 | LSI Logic offers ATSC-compatible DVD chips LSI Logic offers ATSC-compatible DVD chips |
| 2005-08-18 | IBM, AMD extend IC technology alliance Expanding their alliance in semiconductors, IBM Corp. and Advanced Micro Devices Inc. (AMD) have extended their joint development efforts through 2011, according to the San Jose Mercury News. |
| 2005-10-13 | Programming tool spins code for audio-over-Ethernet chips Programming tool spins code for audio-over-Ethernet chips |
| 2001-05-29 | Drivers for GaAs FET switches and digital attenuators This application note provides information on M/A-COM's SW-109 and SWD-119 drivers and other commercially available digital logic chips for control of switches and digital attenuators. |
| 2001-06-01 | Single-mask simplicity needed for SoC The move to multimillion-gate chips made it necessary to adopt design-reuse strategies for new SoC devices. |
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