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| 2010-08-20 | Air gaps migrate from chip- to PCB-level The Semiconductor Research Corp. (SRC) says that the holy grail of low-k dielectrics—air-gap interconnections—will migrate from chip-level to board-level. |
| 2008-11-18 | Applied drops efforts to acquire ASMI Applied and Francisco Partners have terminated their efforts to buy the front-end operations of ASMI. |
| 2008-06-12 | Applied's ASMI bid suggest interest in Intel Applied Materials has made an unsolicited bid to acquire a chunk of ASMI. |
| 2007-08-03 | Qualcomm tapes out first chip on 45nm process Qualcomm has taped out its product on a low power-optimised 45nm process that uses advanced immersion lithography and very low k inter-metal dielectrics features. |
| 2007-06-18 | IBM pitches air gaps as 'ultimate' dielectric IBM Corp. has vowed to commercialise the ultimate dielectric?a pure vacuum?between metal lines of its 32nm chips, thereby reducing parasitic capacitance on interconnection layers by 36 per cent. |
| 2006-12-14 | ASML bags 45nm lithography deal IBM Corp. and Advanced Micro Devices Inc. (AMD) presented papers describing the use of immersion lithography, ultra-low-k dielectrics, and multiple enhanced transistor strain techniques for 45nm microprocessor designs at the International Electron Devices Meeting. |
| 2006-01-31 | Intel discloses details of 45nm process Intel Corp. has disclosed the initial details of its 45nm process. Dubbed P1266, the process incorporates copper interconnects, low-k dielectrics, strained silicon and other features. |
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