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2012-04-26	Intel debuts 22nm quad-core processors Intel debuts the first processors developed on 22nm manufacturing process using innovative 3D tri-gate transistor technology and a new graphics architecture
2012-03-30	3D IC test vehicle ensures performance, yield Heterogeneous 3D IC test vehicle debuts as a combined effort by Altera and TSMC's Chip-on-Wafer-on-Substrate process.
2012-03-20	Twin Creeks claims 50% lower solar cell cost Twin Creeks boasts a new ultra-thin manufacturing process targeted at advanced production of LEDs and CMOS image sensors that claims to greatly reduce silicon and other substrate material costs.
2012-03-05	Samsung's 20 nm DFM based on Mentor's Calibre platform The DFM sign-off solution is available for consumer and telecommunications designs targeting advanced process nodes.
2012-02-23	Intel to make chips for FPGA start-up Tabula Intel will use its 22nm manufacturing process featuring 3-D Tri-Gate transistors to manufacture Tabula's 3PLD products.
2012-02-13	Imec develops 300mm fab-compatible DSA process line Imec develops 300mm fab-compatible DSA process line
2012-01-23	Towards the realm of app-specific solutions Altera feels the demands of new technology nodes are beginning to reach beyond the level of circuit design, requiring collaborative approach to find improvements in performance and energy efficiency.
2012-01-04	Platform touts 0.11µm aluminium BEoL process Platform touts 0.11µm aluminium BEoL process
2011-12-29	EMS operation gains paperless environment The Aegis iLaunch and iView Manufacturing Operation Software modules provide a distributed, paperless environment for Spectrum's Electronics Manufacturing Services (EMS) operation.
2011-07-18	Researchers use liquid process to grow nanomaterials Researchers use liquid process to grow nanomaterials
2011-06-02	Reference flow enhances TSMC 28nm design Synopsys rolls out TSMC Reference Flow 12.0 offering enhanced design for TSMC's 28nm process technology, integrated manufacturing compliance and an advanced system-level prototyping solution.
2011-05-17	TSMC collaborates with Sematech for IC process tech TSMC collaborates with Sematech for IC process tech
2011-05-19	Manufacturing with 73M2901CE V.22 bis single chip modem Manufacturing with 73M2901CE V.22 bis single chip modem
2011-04-26	Toshiba-SanDisk leap into 19nm NAND SanDisk Corp. and Toshiba Corp., which share a manufacturing venture in Japan claim to have fabricated NAND flash memories with 19nm process technology overtaking Intel-Micron duo's 20nm process.
2011-04-19	Intel, Micron JV ramps up 20nm NAND IM Flash Technologies LLC (IMFT), Intel Corp. and Micron Technology Inc.'s NAND flash joint venture has ramped up the development of a new 20nm process technology for manufacturing NAND flash memory.
2011-02-23	Intel invests in new 300mm fab Intel Corp. has revealed that it will invest more than Rs.22,933.09 crore ($5 billion) to build a new fab at its site in Arizona, United States to process wafers at the 14nm node that is expected to be completed in 2013.
2011-01-24	NetLogic tapes-out 28nm, targets network apps NetLogic Microsystems Inc. tapes-out advanced 28nm silicon targeting next-generation network infrastructure applications, at Taiwan Semiconductor Manufacturing Co.
2011-01-20	IBM, Toppan focus on ArF immersion litho for 14nm IBM and Toppan Printing Co. Ltd of Japan will focus their joint development efforts on ArF immersion lithography for the 14nm logic technology node.
2011-01-19	IBM puts Ramtron FRAM alliance on hold IBM Corp.'s plans to install Ramtron's F-RAM semiconductor process technology in its Burlington, Vermont advanced wafer manufacturing facility have so far failed to materialise.
2010-12-14	Software streamlines design to manufacture process Software streamlines design to manufacture process
2010-12-02	Silicon etch system possesses 8 process chambers Silicon etch system possesses 8 process chambers
2010-11-12	65nm embedded flash process SoCs on the anvil 65nm embedded flash process SoCs on the anvil
2010-11-10	Elpida, Intermolecular strengthen DRAM R&D ties Elpida Memory Inc. extends collaborative development programme with R&D specialist Intermolecular Inc. aimed at the development for DRAM technologies between 20nm and 30nm.
2010-10-27	Sustainable manufacturing process devised for flexible ICs Sustainable manufacturing process devised for flexible ICs
2010-10-18	Tower adopts memory from Crocus for 130nm CMOS Tower Semiconductor has adopted a thermally assisted switching magnetic random access memory from Crocus Technology into its 130nm CMOS manufacturing process.
2010-09-24	IMEC-led project characterizes ARM926 core Rs.27.08 crore IMEC-led project called “Reality” has conducted a characterisation of an ARM926 core for the statistical variability that is inherent at the 32nm manufacturing process node.
2010-09-07	64GB NAND flash uses 24nm CMOS technology Toshiba has launched mass production of 2bit per cell 64GB NAND flash memories using a 24nm CMOS manufacturing process technology.
2010-07-26	Hynix speeds up 40nm DRAM migration Hynix Semiconductor Inc. reported record sales for Q2 2010 and disclosed that it will be focusing on accelerating migration to the 40nm-class process in its DRAM business.
2010-06-28	IBM "fab club" synchronises 28nm process IBM "fab club" synchronises 28nm process
2010-06-21	GlobalFoundries CEO calls for concerted effort in EDA Design Automation Conference (DAC) keynoter and GlobalFoundries CEO Doug Grose believes that IC design firms need to redefine relationships with manufacturing partners, and foundries must create new model that brings manufacturing and design into an integrated process.

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