What is CAM (Computer-Aided Manufacturing)?
| CAM is electronic automation applied to the manufacturing process. It involves the planning, scheduling, simulation and control of advanced manufacturing systems. |
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| 2012-05-25 | LED equipment vendors face tough ride An over-investment in LED manufacturing equipment over the past two years will have LED equipment vendors facing a tough ride this year, says Yole Développement. |
| 2012-05-23 | Uniquify becomes TSMC DCA partner In order to support TSMC's customers, Uniquify provides SoC integration, interface IP and manufacturing service. |
| 2012-05-21 | Amkor plans chip packaging facility in Korea Amkor will invest Rs.1,832.46 crore in its new centre, which will focus on the design, development and full scale production of semiconductor packaging and test services. |
| 2012-05-16 | Electronics market to reach Rs 20 lakh crore by 2020 However, ASSOCHAM believes if local production continues to grow at a similar pace, the market will fall short of Rs 15 lakh crore during the same period. |
| 2012-05-11 | Applied Materials to shift solar wafer manufacturing to Asia Applied Materials to shift solar wafer manufacturing to Asia |
| 2012-04-26 | Intel debuts 22nm quad-core processors Intel debuts the first processors developed on 22nm manufacturing process using innovative 3D tri-gate transistor technology and a new graphics architecture |
| 2012-04-25 | Nokia builds mobile manufacturing unit in Vietnam Nokia builds mobile manufacturing unit in Vietnam |
| 2012-04-20 | Electronics policy to be approved soon: Sibal To showcase the government's increasing focus on the electronics sector, Department of Information Technology has been officially renamed as Department of Electronics and IT. |
| 2012-03-30 | 3D IC test vehicle ensures performance, yield Heterogeneous 3D IC test vehicle debuts as a combined effort by Altera and TSMC's Chip-on-Wafer-on-Substrate process. |
| 2012-04-02 | Recognising density requirements at 28 nm Density has transitioned from a back-end manufacturing concern that was of little interest to designers to an issue that affects the layout of standard cell libraries. |
| 2012-03-23 | IC manufacturing spending to decline in 2012 IC manufacturing spending to decline in 2012 |
| 2012-03-20 | Twin Creeks claims 50% lower solar cell cost Twin Creeks boasts a new ultra-thin manufacturing process targeted at advanced production of LEDs and CMOS image sensors that claims to greatly reduce silicon and other substrate material costs. |
| 2012-03-20 | Budget 2012: Industry Speaks Let's check out who all are happy and who are not with Pranab Mukherjee's 'Budget 2012'... |
| 2012-03-16 | GST network rollout positive for MSMEs: IndiaMART.com The move to raise the turnover limit for compulsory tax audit for SMEs to Rs.1 crore from Rs.60 lakh would also bring relief to many SMEs, says IndiaMART CEO Dinesh Agarwal. |
| 2012-03-16 | Highlights: Budget 2012 EE Times India highlights a list of announcements focussed on tax reforms, corporate tax policy, India's manufacturing sector... |
| 2012-03-05 | Samsung's 20 nm DFM based on Mentor's Calibre platform The DFM sign-off solution is available for consumer and telecommunications designs targeting advanced process nodes. |
| 2012-03-01 | Toshiba buys WD's 3.5inch HDD equipment In return, Toshiba will sell its hard disc drive manufacturing facility in Thanland to Western Digital. |
| 2012-03-02 | An introduction to natural user interface Mouse-and-keyboard-based GUI used in the manufacturing industry could soon be replaced by natural user interfaces supporting eye scans, fingerprint scans and gesture recognition. |
| 2012-02-23 | Intel to make chips for FPGA start-up Tabula Intel will use its 22nm manufacturing process featuring 3-D Tri-Gate transistors to manufacture Tabula's 3PLD products. |
| 2012-02-21 | Indian languages needed to promote manufacturing Indian languages needed to promote manufacturing |
| 2012-02-13 | Imec develops 300mm fab-compatible DSA process line Imec develops a directed self-assembly manufacturing process to improve both optical and extreme ultraviolet lithography. |
| 2012-02-10 | Common Platform cos to discuss next-gen chip Three chip-making giants will discuss innovations beyond 14nm and 450mm wafer manufacturing at 2012 Common Platform Technology Forum. |
| 2012-02-09 | Nokia to shift phone assembly to Asia The handset maker is laying off 4,000 jobs, as it plans to shifts its phone manufacturing to Asia. |
| 2012-02-08 | India wafer fab plans in the works Sachin Pilot, minister of state for communications and information technology, said a decision will likely be made in the next few months, and at the latest, by the year-end. |
| 2012-02-07 | Cadence, Samsung collaborate on DFM solution They have partnered to develop a world-class design-for-manufacturing infrastructure for ASIC and SoC design. |
| 2012-02-07 | ELCINA to set-up electronics cluster in India The first electronic product and component manufacturing cluster is proposed to be located in Delhi. |
| 2012-02-03 | RF interconnects offer customisable design TE Connectivity's KOAXXA RF interconnects supplement traditional devices by providing SMA connectors for large-scale manufacturing and assembly automation that enables mass customisation. |
| 2012-01-31 | Holst, imec embark on joint OLED research The Holst Centre and imec announce a research programme to develop an economically scalable route to high-volume manufacturing of flexible active-matrix OLED displays. |
| 2012-01-31 | Disposable Si photonics biosensor ICs developed The biosensors chips, jointly developed by Imec and Genalyte, claim to allow for high levels of multiplexed biosensing. |
| 2012-01-27 | Intel, Samsung boost semiconductor capex Intel, Samsung, and TSMC are forecast to account for about half of the total semiconductor capex spending in 2012. |
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