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| 2012-04-04 | TI enables bare die IC programme TI's bare die programme enables the design of end equipment with smaller form factors by implementing multi-chip modules (MCM) or systems-in-package (SiPs). |
| 2011-12-07 | Wraparound chip resistor offers 230°C operation Vishay debuts a high-temperature, surface-mount, wraparound thick film chip resistor with an operating temperature range from –55°C to +230°C and a storage temperature range of –55°C to +245°C. |
| 2010-06-11 | SupIRBuck MCM Power QFN (PQFN) board mount SupIRBuck MCM Power QFN (PQFN) board mount |
| 2010-06-03 | SupIRBuck MCM power QFN (PQFN) inspection SupIRBuck MCM power QFN (PQFN) inspection |
| 2008-09-19 | Rugged PSUs meet military EMI standards XP Power has launched its MCM series of rugged, metal-cased convection cooled power supply units. |
| 2006-12-15 | PoP, SiP, MCM, MCP or SoC: Assessing the trade-offs PoP, SiP, MCM, MCP or SoC: Assessing the trade-offs |
| 0021-05-28 | PoP, SiP, MCM, MCP or SoC: Weighing the trade-offs PoP, SiP, MCM, MCP or SoC: Weighing the trade-offs |
| 2008-01-10 | NI develops sound, vibration tools for interactive DAQ NI's Sound and Vibration Measurement Suite 6.0 is the most comprehensive NI collection of analysis and signal processing tools for noise, vibration and harshness; machine condition monitoring (MCM); and audio test apps. |
| 2007-03-19 | MMIC power amps cover 6-13GHz range Hittite Microwave announced five GaAs PHEMT 1W and 2W MMIC power amplifiers that cover the 6-13GHz range for point-to-point and point-to-multi-point radios, test instrumentation, military and space applications. |
| 2007-01-11 | 16Mbit SRAM MCM suits space apps 16Mbit SRAM MCM suits space apps |
| 2005-09-27 | Multichip module broadens its dc-dc horizons Addressing the demand for higher current and higher frequency power solutions for dc-dc converters, Toshiba America's TB7001FL multichip module (MCM) combines a driver IC with a MOSFET and the company's MOSBD, a single-die combination of a power MOSFET and a Schottky barrier diode, in one package measuring just 8-by-8-by-0.85 mm. |
| 2001-04-01 | Back-end copper metallization for flip chip The IC industry's move toward the broad implementation of copper for back-end metallization is being driven by cost reduction that results from the use of an electroplating process. |
| 2001-04-15 | Solder flux jetting technology Advances in jetting technology improve film thicknesses and provide excellent edge definition in selective flux applications. |
| 2001-05-07 | EDI's x32 MCM-L SRAM family: Integrated memory solution for TMS320C3x DSPs EDI's x32 MCM-L SRAM family: Integrated memory solution for TMS320C3x DSPs |
| 2001-08-01 | Few-chip packaging: An MCM renaissance Few-chip packaging: An MCM renaissance |
| 2001-09-11 | MIL-PRF-19500 Qual chips versus MIL-PRF-38534 Qual chips This application note defines two qualification levels in purchasing discrete chips for use in highly reliable hybrid and MCM systems. |
| 2001-09-13 | Frost-free environment for the thermal testing of high performance MCMs with RF circuitry This application note describes a frost-free enclosure, with plug-and-play ATE interface, for the thermal testing of high-performance multichip module (MCM) with RF circuitry. |
| 2001-10-01 | Thin-film process enables low-cost MCPs This technical article describes a low-cost multi-chip packaging (MCP) technique with appropriate expansion that triples volume capacities. |
| 2002-01-16 | Making the leap to 4G wireless While 3G has not quite arrived, designers are already thinking about 4G technology. With it comes challenging RF and baseband design headaches. |
| 2004-06-16 | Module approach ups 5GHz WLAN front-end integration This article describes a single-package 5GHz WLAN RF module comprising a BiCMOS IC, commercial GaAs PA and Tx/Rx switch, high-quality integrated RF filters and a patch antenna. |
| 2004-10-01 | Ensuring structural integrity in hybrid modules and MCMs The structural integrity of hybrid circuits and MCM modules is critical to their long-term reliability since they are often used in harsh environments. |
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