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| 2012-05-25 | Kontron rugged computer system targets military apps Kontron unveils the ApexVX, its new multi-mission rugged computer system specifically designed for the rapid deployment of a broad range of military and avionics applications. |
| 2012-05-07 | Employ modelling for power integrity simulation in 3D-IC design Learn how analysis based on a chip macro-model can yield the same results as concurrent full-chip analysis, resulting in significant runtime benefits. |
| 2012-04-27 | TI's multi-core DSPs implement JPEG 2000 codec TI's multi-core DSPs implement JPEG 2000 codec |
| 2012-05-09 | R&S TV analyser geared for DTV transmitters R&S ETC is a mid-range, multi-standard TV analyser that supports the ISDB-T, DVB-T and DVB-T2 digital terrestrial standards. |
| 2012-05-04 | Stepper motor drive targets multi-axis apps Stepper motor drive targets multi-axis apps |
| 2012-04-19 | Toshiba buys IBM's retail POS solution biz IBM's Retail Store Solutions (RSS) business gets acquired by Japan's point-of-sale systems firm, Toshiba Tec to tap into the growing demand for multi-channel commerce. |
| 2012-04-16 | PCT screens offer rugged durability Dawar's new multi-touch projected capacitive touch (PCT) screen technology touts the optimum combination of functionality, sensitivity and advanced optics in an all-glass solution. |
| 2012-04-16 | IC supports multi-RF links with shared antenna IC supports multi-RF links with shared antenna |
| 2012-04-11 | USB DAQ modules have dedicated 16bit A/D Data Translation offers a series of USB multi-function data acquisition modules that allow simultaneous measurement of different signals on multiple channels. |
| 2012-04-04 | TI enables bare die IC programme TI's bare die programme enables the design of end equipment with smaller form factors by implementing multi-chip modules (MCM) or systems-in-package (SiPs). |
| 2012-04-02 | Will machines have super-human intelligence? A Multicore DevCon panel pondered over the question of whether many-core processors would enable machines with super-human intelligence driven by their rapidly increasing processing power. |
| 2012-04-02 | Transceiver IC provides multi-band LTE support Transceiver IC provides multi-band LTE support |
| 2012-03-22 | Platform boosts positioning in smartphones Broadcom's smartphone location platform is said to deliver 10x improved acquisition performance with advanced indoor positioning support. |
| 2012-03-22 | Resolve concurrency errors in multi-core design Resolve concurrency errors in multi-core design |
| 2012-03-13 | 'Hornet': A system that simulates 1000 core chip MIT has created 'Hornet' simulation system to evaluate multi-core chip design faults. |
| 2012-03-16 | Multi-master comm using RIIC in RX610 Multi-master comm using RIIC in RX610 |
| 2012-03-15 | Multi-master comm using RIIC in RX62T Multi-master comm using RIIC in RX62T |
| 2012-03-13 | Multi-master comm using RIIC in RX62N, RX621 Multi-master comm using RIIC in RX62N, RX621 |
| 2012-03-07 | Touch devices support shieldless sensor design Atmel's automotive-qualified maXTouch devices support shieldless sensor designs, reduce system complexity, and enable multi-touch gestures including gloved finger operation. |
| 2012-03-05 | 28nm device architecture targets wireless apps TI's scalable KeyStone II architecture includes support for both TMS320C66x DSP generation cores and multiple cache coherent quad ARM Cortex-A15 clusters, for a mixture of up to 32 DSP and RISC cores. |
| 2012-02-29 | Sensor with multi-touch taps low-cost markets Sensor with multi-touch taps low-cost markets |
| 2012-02-27 | Cos develop multi-standard mobile modem Cos develop multi-standard mobile modem |
| 2012-02-24 | Official: Tegra 3 is now '4-Plus-1' Nvidia has renamed Tegra 3 as the 4-Plus-1 quad-core architecture, and is trademarking the name. |
| 2012-02-15 | 2.5GHz multi-core processors boost performance 2.5GHz multi-core processors boost performance |
| 2012-02-14 | Silicon ESD devices offer low-capacitance sol'n TE Circuit Protection's single-channel and multi-channel silicon ESD (SESD) protection devices boast the lowest capacitance, highest ESD protection and smallest size package. |
| 2012-02-14 | Multisensor module with 9DoF enhances accuracy ST's INEMO-M1 touts 9 degrees of freedom enabling users to precisely detect their direction, orientation and movements in all three dimensions. |
| 2012-02-01 | Sensors to control spacecraft soon Researchers have developed a system based on multi-core technologies that allow spacecraft to be piloted and positioned with pinpoint accuracy. |
| 2012-02-01 | Controller IC enhances car-window operation ST's L99DZ80 is a multi-functional door-zone driver with an integrated electric-window control that enhances car-window operation. |
| 2012-01-31 | Tilera 64bit chips claim enhanced performance Tilera's TILE-Gx36 and TILE-Gx16 64bit processors can deliver up to 40Gbps of L2/L3 packet forwarding performance across small and large packet sizes while consuming less than 25W of power. |
| 2012-01-30 | SI simulation sol'n boasts up to 3x speed-up Synopsys and Sigrity collaborate to unveil the HSPICE 2011.09 signal integrity simulation solution offering up to 3x faster simulation of signal and power integrity analysis of multi-gigahertz designs. |
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