What is stream processor?
| Stream processing allows parallel processing at never-before-seen efficiency with minimal effort. Compared to existing architectures, stream processors are said to provide up to 20X the performance at the same power dissipation and die size. |
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| 2012-05-21 | Samsung starts mass production of 20nm DRAM chips Korean giant Samsung has begun producing 4 GB low power DDR2 (LPDDR2) memory using its 20nm-class process node. |
| 2012-05-21 | Getting closer to the peak of simulation-driven design Discover what it takes to design for reliability nowadays. |
| 2012-05-08 | Boost automotive electronics documentation, troubleshooting Read about software tools that may be used to improve the process of both documentation and troubleshooting in automotive electronics. |
| 2012-05-04 | TSMC demos 28nm 3.1GHz ARM Cortex-A9 chip TSMC said its 28nm HPM process node has been able to fab ARM Cortex A9 dual-core chip that runs at 3.1GHz. |
| 2012-04-26 | Intel debuts 22nm quad-core processors Intel debuts the first processors developed on 22nm manufacturing process using innovative 3D tri-gate transistor technology and a new graphics architecture |
| 2012-05-08 | COM Express modules based on Ivy Bridge debut MSC Vertriebs' COM Express modules are based on Intel 'Ivy Bridge' processor family that uses advanced 22nm process technology with three-dimensional transistors for higher performance at lower power. |
| 2012-04-17 | Implement POSIX IPC on Cortex-M architectures Know how to implement the system components required to send and receive POSIX-style signals—a form of IPC—between concurrently running tasks on the Cortex-M architecture and then specifically with the Cortex-M3. |
| 2012-04-11 | Fundamentals of 3D authoring (Part 1) This two-part series describes the process of 3D graphics design, with tips and techniques for creating high-quality models suitable for use in a variety of embedded designs. |
| 2012-03-30 | 3D IC test vehicle ensures performance, yield Heterogeneous 3D IC test vehicle debuts as a combined effort by Altera and TSMC's Chip-on-Wafer-on-Substrate process. |
| 2012-03-23 | Altera, TSMC develop 3D IC test vehicle Altera uses TSMC's Chip-on-Wafer-on-Substrate integration process for development of the 3D devices. |
| 2012-03-20 | Twin Creeks claims 50% lower solar cell cost Twin Creeks boasts a new ultra-thin manufacturing process targeted at advanced production of LEDs and CMOS image sensors that claims to greatly reduce silicon and other substrate material costs. |
| 2012-03-19 | Synopsys, Applied Materials to develop new TCAD models The new TCAD models will enable customers to speed up process development for 14nm and 11nm logic and new memory chip technologies. |
| 2012-03-12 | PDK available for 14nm logic chips Imec's early-version PDK for 14nm logic chips targets the introduction of a number of new key technologies, such as FinFET technology and EUV lithography. |
| 2012-03-09 | Cadence digital flow accelerates 20nm design Cadence's latest RTL-to-GDSII design, implementation and signoff flow enables efficient power-performance-area trade-offs that support complex designs at advanced process nodes. |
| 2012-03-05 | Samsung's 20 nm DFM based on Mentor's Calibre platform The DFM sign-off solution is available for consumer and telecommunications designs targeting advanced process nodes. |
| 2012-02-23 | Intel to make chips for FPGA start-up Tabula Intel will use its 22nm manufacturing process featuring 3-D Tri-Gate transistors to manufacture Tabula's 3PLD products. |
| 2012-02-15 | CEA-Leti showcases 22nm maskless lithography CEA-Leti demos a maskless lithography technology that meets the industry requirement for 14nm and 10nm process nodes. |
| 2012-02-13 | Imec develops 300mm fab-compatible DSA process line Imec develops 300mm fab-compatible DSA process line |
| 2012-01-30 | Embedded s/w dev't process addresses security Embedded s/w dev't process addresses security |
| 2012-01-24 | Open-Silicon achieves 28nm Interlaken IP core Open-Silicon reports that its Interlaken IP core which has been used in over 30 chip-to-chip networking applications has achieved silicon success at the 28nm process node. |
| 2012-01-23 | Towards the realm of app-specific solutions Altera feels the demands of new technology nodes are beginning to reach beyond the level of circuit design, requiring collaborative approach to find improvements in performance and energy efficiency. |
| 2012-01-04 | Platform touts 0.11µm aluminium BEoL process Platform touts 0.11µm aluminium BEoL process |
| 2012-01-04 | UMC intros 0.11µm aluminium BEOL process UMC intros 0.11µm aluminium BEOL process |
| 2011-12-29 | EMS operation gains paperless environment The Aegis iLaunch and iView Manufacturing Operation Software modules provide a distributed, paperless environment for Spectrum's Electronics Manufacturing Services (EMS) operation. |
| 2011-12-12 | 128Gb NAND device touts 1Tb data storage Intel and Micron jointly develop a 20nm 128Gb, multi-level-cell (MLC) device that is said to enable a terabit of data storage in a fingertip-size package by using just eight die. |
| 2011-12-16 | Shift from FPGAs for prototype to ASICs for production The idea of migrating an FPGA design into an ASIC can be overwhelming to a design team, but careful planning can significantly ease the process. |
| 2011-12-09 | Researchers use ink-jet to print MEMS switches Researchers describe the process of printing of MEMS switches using an ink-jet printer that they say will aid flexible display backplanes and have the potential to create large-area systems on glass. |
| 2011-12-08 | Signal conditioners allow multiple photodiodes Vishay's VSOP383.. and VSOP584.. signal conditioning ICs have the ability to process continuous data transmission for IR remote control signals from discrete photodiodes. |
| 2011-12-05 | Imec 'IBC' Si solar cells exceed 23% efficiency Imec develops a high-efficiency baseline process for small-area interdigitated back contacts cells that aims at increasing the efficiency well above 20%. |
| 2011-12-05 | IBM, Micron to produce 3D memory chips IBM's TSV chip-making process will enable Micron's hybrid memory cube to achieve speeds 15 times faster than today's technology. |
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