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2012-05-21	Amkor plans chip packaging facility in Korea Amkor will invest Rs.1,832.46 crore in its new centre, which will focus on the design, development and full scale production of semiconductor packaging and test services.
2012-03-23	IC manufacturing spending to decline in 2012 IC manufacturing spending to decline in 2012
2012-02-13	Imec develops 300mm fab-compatible DSA process line Imec develops a directed self-assembly manufacturing process to improve both optical and extreme ultraviolet lithography.
2012-01-27	Intel, Samsung boost semiconductor capex Intel, Samsung boost semiconductor capex
2012-01-24	TI to shut two factories, cut 1000 jobs Texas Instruments plans to close its manufacturing units in Japan and Texas in order to save Rs.510.20 crore ($100 million) annually.
2012-01-17	Smartphones: A good bet for Asia in 2012 The mobile consumer market will add Rs.15.77 lakh crore ($309 billion) to the semiconductor market by 2015, and much of this growth will be spurred by innovations within the power management sector.
2011-12-02	Toshiba to shut three chip plants Toshiba is consolidating its semiconductor facilities in Japan and cutting production at the same time.
2011-07-18	Researchers use liquid process to grow nanomaterials MIT researchers showcase a liquid-based technique to grow submicroscopic wires in water that has opened up possibilities for entire electronic devices to be grown through a liquid-based process.
2011-07-07	TSMC ahead of Intel in 3D chip delivery? According to TAITRA, Taiwan Semiconductor Manufacturing Co. (TSMC) is likely to beat Intel Corp. in offering the first 3D chips by the end of 2011.
2011-06-29	Ad calls on investors for India fab setup The Empowered Committee has created an advertisement heralding India's strong chip design infrastructure in hopes of convincing investors and technology providers to build wafer fabs in the country.
2011-06-02	India invites chip firms to build fabs A government-formed committee tasked to spearhead India's chip manufacturing efforts has formally invited semiconductor firms to set up wafer facilities in the sub-continent.
2011-04-27	India plans Rs.22,000 crore fab construction India recently unfolded a new blueprint for the construction of two local wafer facilities in support of efforts to build up an Indian electronic hardware industry.
2011-02-04	Foundry service for R&D launched Semiconductor Support Services Co. has launched an R&D manufacturing service aimed at working with discrete manufacturers, foundries, universities and fabless design houses.
2011-02-01	Karnataka semiconductor policy 2010 fosters growth Karnataka semiconductor policy 2010 fosters growth
2011-01-24	NetLogic tapes-out 28nm, targets network apps NetLogic Microsystems Inc. tapes-out advanced 28nm silicon targeting next-generation network infrastructure applications, at Taiwan Semiconductor Manufacturing Co.
2011-01-19	IBM puts Ramtron FRAM alliance on hold IBM Corp.'s plans to install Ramtron's F-RAM semiconductor process technology in its Burlington, Vermont advanced wafer manufacturing facility have so far failed to materialise.
2011-01-11	Cypress boosts touchscreen controller manufacturing Cypress boosts touchscreen controller manufacturing
2011-01-11	ARM announcements indicate significant impact Significant implications for the electronics industry are indicated with the recent Windows-on-ARM and ARM chips from Nvidia announcements.
2010-12-21	Laser emissions attempt IC feature size reduction A group from Purdue University is working on an intense 13.5nm extreme UV light source that they say can etch finer lines onto a wafer and reduce feature size by up to an order of magnitude.
2010-12-10	Sematech, SRC, SIA drive 3-D chip standards Sematech, SRC and SIA are driving industry 3-D chip standards to bring down the barriers to integrating chips from different suppliers for adoption of 3-D technologies in high volume manufacturing.
2010-12-01	IBM leans towards research heavy, fab-lite IBM's semiconductor capital expenditure analysis reveals that IBM is not investing heavily in manufacturing while leaning towards becoming research heavy and fab-lite.
2010-11-23	Cyclical downturn: Passing phase for the semicon industry? The semiconductor equipment industry was hard hit by the global recession and is struggling to cope up with the present uncertain economic conditions.
2010-11-10	ISMI programme to aid old fabs ISMI sets up a ''Mature Fabs'' programme that assists with challenges faced by semiconductor companies with older fabs.
2010-10-28	Atrenta, TSMC join forces on synthesisable IP Atrenta Inc. and Taiwan Semiconductor Manufacturing Co. Ltd are cooperating to improve the quality of delivered synthesisable IP using Atrenta's SpyGlass platform.
2010-10-18	Tower adopts memory from Crocus for 130nm CMOS Tower Semiconductor has adopted a thermally assisted switching magnetic random access memory from Crocus Technology into its 130nm CMOS manufacturing process.
2010-10-18	Semi market indicates signs of oversupply Semiconductor inventory levels are starting to show signs of an oversupply marking a turnaround from the lean inventories and part shortage seen for most of the year, according to iSuppli Corp.
2010-09-24	CPLD packaging goes green Lattice Semiconductor Corp. has taken out halogen and lead from packages for its popular programmable logic solution for high-volume consumer electronics to better conforms to environmental standards.
2010-09-23	Opinion: e-beam critical to semiconductor manufacturing Opinion: e-beam critical to semiconductor manufacturing
2010-08-03	Renesas plans to outsource foundry Renesas Electronics Corp., unveils plans to construct a strategic "fab network" including outside foundries and streamline about 5,000 jobs.
2010-07-26	Hynix speeds up 40nm DRAM migration Hynix Semiconductor Inc. reported record sales for Q2 2010 and disclosed that it will be focusing on accelerating migration to the 40nm-class process in its DRAM business.

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