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| 2012-02-13 | Imec develops 300mm fab-compatible DSA process line Imec develops 300mm fab-compatible DSA process line |
| 2011-11-22 | Tower targets India's semiconductor market Tower targets India's semiconductor market |
| 2011-07-18 | Researchers use liquid process to grow nanomaterials Researchers use liquid process to grow nanomaterials |
| 2011-06-22 | Purified nanotubes cut health hazard Methods to offer pre-screened purified nanotubes which have already had the filtration process applied to them are said to avoid adverse health effects. |
| 2011-05-31 | Imec, Altera collaborate on advanced CMOS scaling Imec and Altera enter a three-year research collaboration to work on advanced complementary metal-oxide semiconductor (CMOS) scaling technologies with the initial focus on 3D process development. |
| 2011-03-09 | RFMD fabricates dual-junction PV cells RFMD announces the successful fabrication of dual-junction PV cells that combine gallium arsenide (GaAs) and indium gallium phosphide (InGaP) PV junctions based in a compound semiconductor-based process. |
| 2011-01-24 | NetLogic tapes-out 28nm, targets network apps NetLogic Microsystems Inc. tapes-out advanced 28nm silicon targeting next-generation network infrastructure applications, at Taiwan Semiconductor Manufacturing Co. |
| 2011-01-19 | IBM puts Ramtron FRAM alliance on hold IBM Corp.'s plans to install Ramtron's F-RAM semiconductor process technology in its Burlington, Vermont advanced wafer manufacturing facility have so far failed to materialise. |
| 2011-01-17 | IBM, Samsung team on semiconductor research IBM, Samsung team on semiconductor research |
| 2010-12-15 | Speculations cast on semiconductor technology roadmaps Speculations cast on semiconductor technology roadmaps |
| 2010-10-18 | Tower adopts memory from Crocus for 130nm CMOS Tower Semiconductor has adopted a thermally assisted switching magnetic random access memory from Crocus Technology into its 130nm CMOS manufacturing process. |
| 2010-09-09 | PSoC Creator IDE supports low-power design Cypress Semiconductor Corp. enhances the PSoC Creator Integrated Development Environment (IDE) to ease the creation process for developers. |
| 2010-07-26 | Hynix speeds up 40nm DRAM migration Hynix Semiconductor Inc. reported record sales for Q2 2010 and disclosed that it will be focusing on accelerating migration to the 40nm-class process in its DRAM business. |
| 2010-07-16 | Foundries set the stage for 28nm war It's a great time to be a fabless company as top foundry players set the stage for a market share battle and a corresponding drop in wafer pricing. |
| 2010-05-31 | IMEC China, Huali to collaborate on advanced chip tech IMEC China has signed a joint development project on 65nm CMOS process with semiconductor company Huali. |
| 2010-05-04 | NetLogic to now partner TSMC on 28nm NetLogic's next-generation knowledge-based processors, multi-core processors and 10/40/100Gbit PHY will now include TSMC's NEXSYS 28HP (28nm high performance) semiconductor process node. |
| 2010-04-15 | TSMC moves from 28nm to 20nm half-node Taiwan Semiconductor Manufacturing Co. Ltd will give the 22nm "full node" a miss by moving on directly to the 20nm "half node" from the 28nm node. |
| 2010-03-24 | Novellus, IBM partner on 3D TSV Novellus Systems and IBM Corp. are collaborating on a process to enable the 3D integration of multiple semiconductor chips in advanced product applications for low power small form factors. |
| 2010-02-26 | Toshiba, Fujitsu form JV in China Toshiba Corp. and Nantong Fujitsu Microelectronics Co. Ltd will form a manufacturing joint venture in China for the semiconductor back-end process of test and assembly. |
| 2010-02-18 | Novellus joins IBM, CNSE on 22nm process Novellus joins IBM, CNSE on 22nm process |
| 2010-02-05 | Renesas completes MCU production facility Renesas Technology Corp. has completes a new facility to increase microcontroller production capacity at the back-end process plant of Renesas Semiconductor (Beijing) Co., Ltd. (RSB), in Beijing, China. |
| 2010-01-13 | Qualcomm, TSMC join forces for 28nm process Qualcomm, TSMC join forces for 28nm process |
| 2010-01-07 | A519HRT HART modem This application note describes a demo circuit that permits a user to implement a highway addressable remote transducer (HART) slave or master interface between a microprocessor and a process loop using the ON Semiconductor A5191HRT HART modem IC. |
| 2009-11-30 | STBP120 over-voltage protection device To reduce the power consumption, size and cost of electronic devices, most semiconductor components are manufactured using a "low voltage" process, resulting in a maximum operating voltage of 7V or even less |
| 2009-11-10 | TSMC still faces 40nm yield issues Taiwan Semiconductor Manufacturing Co. Ltd still struggles with the yield issues of its 40nm process. |
| 2009-10-28 | MagnaChip rolls 30V 0.11µm process MagnaChip rolls 30V 0.11µm process |
| 2009-10-16 | 54nm 1Gbit DDR3 saves power Hynix Semiconductor Inc. debuts its second-generation 1Gbit DDR3 built on 54nm process technology. |
| 2009-09-08 | 28-/32nm roadmap ups TSMC biz outlook Taiwan Semiconductor Manufacturing Co. Ltd continues to see a surge in business as it solidifies its process roadmap. |
| 2009-09-07 | Understanding digital potentiometer resistor variations This application note discusses how process, voltage, and temperature affect the Resistor Network’s characteristics and specifications. |
| 2009-09-03 | Cadence, GlobalFoundries ink software deal Cadence and GlobalFoundries have formed a software and services agreement for advanced semiconductor design. |
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