- Article
(24) -
Forum
(0) -
Blog
(0)
total search24 articles
sort by relevance
sort by date
| 2011-08-01 | What the next transistor will be like Here's a comprehensive discussion on the race is on to redefine the transistor. |
| 2010-05-28 | Cadence, IBM team on high performance IPs Cadence Design Systems, Inc. and IBM have signed an agreement to develop DDR PHYs, memory controllers, and protocols such as PCIe and Ethernet under 32-nanometer silicon-on-insulator. |
| 2010-04-05 | Graphene optical link suits 300nm to 6µm bandwidth IBM Research demonstrated an optical link using a graphene photodetector fabricated on a silicon-on-insulator (SOI) substrate that achieves 6.1mA/W at 1.55µm. |
| 2009-09-29 | 32bit CMOS processor suits control-plane apps Applied Micro Circuits Corp. is offering a CMOS-based, 32bit processor, built around IBM Corp.'s Power Architecture. |
| 2009-09-24 | IBM unveils eDRAM for fastest SOI chip IBM has made a prototype of what it claims is the smallest, densest and fastest dynamic memory device. |
| 2009-07-16 | Soitec, IBM push 22nm for 3D ICs Soitec Group and IBM Corp. have partnered to pioneer 22nm node silicon wafer substrate and bonding techniques that will enable wafer-level, 3D integration technology for next-generation ICs. |
| 2009-03-20 | SOI consortium reveals focus areas for '09 SOI Industry Consortium's key areas of focus for this year include IP, low power, and the fabless community. |
| 2009-01-23 | Using synchronous rectification, feedback controller Read about GreenChip TEA1761, a synchronous rectifier controller ICs for switched mode power supplies. |
| 2008-11-12 | IBM claims first 45nm SOI foundry service IBM's Microelectronics Group claims the industry's first 45-nm, silicon-on-insulator foundry offering. |
| 2008-08-21 | Memory designs to rely on FBCs FBC technology enables three to four times the bits compared with traditional embedded memory in cache designs. |
| 2006-09-26 | High-voltage devices simplify design of PoE powered device This paper provides an overview of the key system-level requirements and benefits one must consider when integrating high-voltage devices into a PoE powered device interface and power management controller. |
| 2007-08-01 | 45nm ASIC integrates embedded DRAM, SOI tech IBM Corp. has developed what it claims as the world?s first ASIC based on 45nm tech that combines embedded DRAM and silicon-on-insulator technologies. |
| 2007-07-23 | Atmel unveils low-cost half-bridge driver IC Atmel Corp. has introduced the low-cost fully protected hex half-bridge driver with integrated power stages that features 4kV ESD protection. |
| 2007-07-20 | LIN2.0 SBCs suit upto 40V ops Atmel has introduced new highly integrated LIN system basis chips that are optimised for operations up to 40V for apps in harsh environments. |
| 2007-06-12 | Power modules offer lowest junction-to-case resistance Infineon Technologies' new CiPoS modules claim to offer the industry's lowest junction-to-case resistance, which increases output current by up to 20 per cent. |
| 2007-06-12 | ARM to sample verification IP for on-chip comms ARM plc will start sampling its lead partners AMBA Adaptive Verification IP for on-chip communication during the third quarter. |
| 2007-03-19 | IBM moves to 65nm for Cell processor IBM has started making its Cell processor on a 65nm silicon-on-insulator process at its East Fishkill, New York plant, moving from a 90nm process to achieve higher speeds and lower power. |
| 2007-01-25 | Freescale joins IBM tech alliance for semicon R&D Freescale Semiconductor and IBM announced that Freescale will join the IBM technology alliance for joint semiconductor research and development. The agreement includes CMOS and silicon-on-insulator technologies and advanced semiconductor research and design enablement transitioning at the 45nm generation. |
| 2006-11-07 | ARM acquires SOI tech company for Rs.1.5 crore ARM has acquired the Physical IP based on silicon-on-insulator technology company SOISIC with net assets of around Rs.1.47 crore. |
| 2006-11-01 | Soitec, ARM ink SOI agreement Soitec has entered into a joint-development agreement with ARM to support the future development of SOI libraries for the fabless/foundry arenas. |
| 2006-04-26 | Chartered to supply CPU products for Xbox 360 Chartered has signed an agreement with Microsoft for manufacturing CPU products for the Xbox 360 game consoles. |
| 2006-01-31 | Intel discloses details of 45nm process Intel Corp. has disclosed the initial details of its 45nm process. Dubbed P1266, the process incorporates copper interconnects, low-k dielectrics, strained silicon and other features. |
| 2006-01-16 | Silicon wafers, SOI post strong growth Silicon wafers and silicon-on-insulator (SOI) technologies are moving up and to the right. Driven by 300mm technologies, the worldwide silicon wafer market is projected to see strong growth over the next few years. |
| 2005-09-29 | Soitec, SEZ to speed industrialization of strained SOI substrates The Soitec Group and the SEZ Group have initiated a joint development program (JDP) intended to speed the industrialization of next-generation strained silicon-on-insulator (sSOI) substrates. |
--- total search 24 articles, total 1 pages, The 1 Page ---
1
Most Popular Articles
Search EE Times India
Max's Cool Beans
Strange modes of transport and other "stuff"
Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...
