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Intel to build Rs.11,030.00 crore wafer plant in China 2007-03-15
Intel Corp. has won approval to build a Rs.11,030.00 crore, 12-inch wafer plant in northern China for CPU chipsets, according to a statement issued from China's National Development and Reform Commission  
TSMC to step up 8inch fab production in Shanghai 2007-03-06
Industry sources reported that Taiwan Semiconductor Manufacturing Co. Ltd will ramp up the monthly capacity of its 8inch fab in Songjiang, Shanghai to 90,000 wafers by midyear. The Taiwan government allowed TSMC to process 0.18µm wafers at the company's mainland China facilities.  
IBM's eDRAM challenges Intel 2007-02-22
IBM Corp. has disclosed that it will be able to pack as much as 48MB of eDRAM on a processor or ASIC when its 45nm process technology comes online in 2008.  
eDRAM to cement IBM, AMD relationship 2007-02-21
IBM's new embedded DRAM technology is expected to boost the company's relationship with Advanced Micro Devices.  
Dell joins HyperTransport Consortium 2007-02-20
Dell Corp. has joined the HyperTransport Technology Consortium, a nonprofit organisation that develops, promotes and licenses HyperTransport technology, which is claimes to be the lowest latency, highest bandwidth chip-to-chip interconnect solution.  
IBM to put 48MB on next-gen microprocessor 2007-02-19
By combining techniques in process and circuit design, IBM believes it can put as much as 48MB of fast DRAM on a reasonably sized CPU when its 45nm technology becomes available in 2008  
Designing low-power multi-processor chips 2007-02-16
Power consumption is not something that can be achieved using a single technique. It calls for a combination of factors, including simplified system design, an efficient memory controller and the use of multiple processors that are optimised for specific tasks.  
Long way to go for multi-core processors 2007-02-16
2006 may go down as the year the electronics industry woke up to the full breadth and significance of the trend to multi-core processors.  
ARM CEO confirms 3 processors in iPhone 2007-02-09
The president and CEO of ARM Holdings plc, confirmed that "at least three" processor cores developed at his company are present within the iPhone from Apple Inc.  
High-speed interconnects carry data at 6Gbps 2007-02-02
A handful of high-speed interconnects are driving changes in how designers handle fast signals. The SPI-S from the OIF aims to carry data at 6Gbps and up between chips or boards in a communications system.  
SiCortex tips x86 ASIC for HPC cluster servers 2007-01-16
Start-up SiCortex settled on a custom system chip that integrates six MIPS Technologies 64-bit 5Kf cores running at up to 500MHz as well as a proprietary fabric switch architecture.  
ARM, eASIC announce processor IP deal 2007-01-08
Expanding its product offerings, fabless ASIC house eASIC Corp. has announced a deal with ARM Ltd. The partnership will enable a broad range of users to have access to ARM's 32-bit processor core on a configurable fabric.  
Multicore processors face a long road 2007-01-03
The year of 2006 may go down as the year the electronics industry woke up to the full breadth and significance of the trend to multicore processors.  
AMD opens Advanced Architecture and Tech Lab 2006-12-26
AMD has announced the formation of a new Advanced Architecture and Technology Lab led by Rich Witek, AMD corporate fellow and chief architectural officer.  
Intel, AMD clash on defining interconnects 2006-11-16
A battle royal is shaping up as archrivals Advanced Micro Devices Inc. (AMD) and Intel Corp. race to define interconnects for their next-generation multicore processors. The archrivals hope to use those links to weave separate webs of partnerships that will be keys to success in tomorrow's computer industry.  
IBM, Qimonda, Macronix plot storage tech roadmap 2006-11-06
IBM Corp. has partnered with Infineon spin-off Qimonda AG and Taiwan's Macronix International Co. Ltd on phase-change RAM. An upcoming technical paper from the trio will report success on the development of devices with features as small as 10nm.  
Mentor Graphics acquires Summit Design 2006-10-27
Mentor Graphics Corp. has acquired Summit Design for an undisclosed sum. The purchase gives Mentor an ESL line-up that includes C language design, synthesis, verification, and code coverage.  
GCT Semicon licenses ARM processor for digital mobile TV 2006-10-18
GCT Semiconductor has licensed ARM's ARM926EJ-S processor for its next-gen reference designs focused on digital mobile TV and emerging 4G wireless technologies.  
ST, Freescale extend automotive design programme 2006-10-18
Freescale Semiconductor and STMicroelectronics (ST) have extended their joint design programme aimed at accelerating innovation in the automotive industry.  
Intel to use Nokia's HSDPA modules in its mobile platform 2006-10-04
Nokia announced that it has developed a version of its HSDPA connectivity module that Intel will use in the next iteration of Centrino targeted at PCs.  
AMD, Intel face off on quad core 2006-09-28
Industry rivals AMD and Intel will face off over quad-core processors this week as each side tries to position itself as leading the race for multi-core x86 processors.  
Conferences reveal growth in flash memory security 2006-09-26
Future-generation flash memory devices will benefit from drive architectures that improve performance and data security while improving systems integration, in advances shown at several storage media conferences.  
Mobile Technika selects GIPS solution 2006-08-22
Mobile Technika has selected the VoiceEngine Multimedia from GIPS to improve voice quality for its SME customers.  
Sierra Design offers alternative to traditional P&R solutions 2006-08-09
Sierra Design Automation has recently that announced Olympus-SoC is positioned to offer physical IC designers an alternative to traditional P&R solutions.  
Apple, PC notebooks might be in danger to wireless attack 2006-08-04
A prominent security researcher recommends turning off wireless cards until the too many holes in the Apple Computer and Microsoft operating systems can be fixed.  
Spansion, SanDisk to tackle security of mobile systems 2006-08-01
Spansion and SanDisk are using different approaches to tackle the growing need for security in mobile systems.  
PCIe shifts gear into v2.0 2006-06-13
The 2.5Gbps PCI Express interconnect is slowly shifting gears into a 2.0 version.  
VIA extends processor licensing agreement with ARM 2006-06-09
VIA Technologies Inc. has extended its agreement with ARM Ltd by licensing the ARM926EJ-S and ARM968E-S processors.  
Altera FPGAs power XtremeData system 2006-06-08
Altera Corp. has announced that XtremeData has chosen Altera's Stratix II FPGA device for their XD1000 FPGA co-processing solution.  
SigmaTel to provide SoC solution to Creative audio players 2006-06-06
SigmaTel Inc. has announced that it will provide its portable audio STMP3600 SoC solution to Creative's portable audio players.  


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