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EE Times India - total search 248 articles sort by date sort by relevance
Microsoft calls for multi-core datacenter server SoCs 2011-02-01
Speaking at the Linley Tech Data Centre Conf., Microsoft's datacenter group engineer said that a new class of multi-core SoCs were required to drive lower-power servers in datacenters.  
Analogue still thriving 2011-01-28
Analysts who predict that there's no future for analogue ICs need to check out some new, innovative architectures for analogue-centric ICs that reveal that analogue I/O is very much alive and soaring  
Analyst: Intel lags ARM in mobile market 2011-01-14
Analyst thinks that Intel will find it difficult to penetrate the mobile market while software developers are increasingly focusing on ARM platforms.  
Green Hills CEO urges secure virtualisation 2010-12-10
Dan O'Dowd, CEO, Green Hills Software stresses on the need for security in virtualized computing environments where the danger of uncontrolled hacks exploiting non-secure devices and drivers lurks.  
People Power launches energy monitoring for durables 2010-12-01
People Power Co. has launched remote energy monitoring and device control tools that it is licensing to manufacturers of durable goods.  
PCI-SIG announces PCIe Spec 3.0 2010-11-25
The PCIe Base 3.0 spec announced by the PCI-SIG doubles the interconnect bandwidth over the PCIe 2.0 spec to achieve bandwidth near 1GByte/s in one direction on a single-lane configuration.  
Xilinx employs stacked silicon tech for multi-FPGA 2010-11-03
This platform approach allows to overcome the boundaries of Moore's Law and offer electronics manufacturers unparalleled power, bandwidth and density optimisation for the large-scale-integration of their systems, says Xilinx.  
Stage is ready for PCM 2010-10-27
Phase-change memory (PCM) is touted as the best candidate to continue the scaling of NVM as it blends the attributes of NOR- and NAND-type flash memory, EEPROM memory, and DRAM.  
IBM product lines include Mellanox switch systems 2010-10-22
IBM's iDataPlex and Intelligent Cluster product lines will now integrate Mellanox Technologies Ltd's IS5000 line of 108 and 324-port modular 40Gbit/s InfiniBand switches with robust latency performance.  
Software tops network engineer concerns 2010-10-04
Software tops the list of concerns for network systems developers who want better tools for debugging multi-core processors and supporting virtual I/O  
Oracle shopping for chip firms 2010-10-01
EE Times editors furnish a list of likely chip manufacturers for Oracle Corp.  
Apple extends A4 chip to non-computer products 2010-09-07
In a move that reduces hardware and software design and manufacturing costs, Apple Inc. has extended the usage of the A4 microprocessor to its latest iPod Touch and its re-launched AppleTV product apart from the iPad and iPhone 4.  
Trio team on wireless SerDes for LTE, 4G market 2010-08-12
MoSys, Radiocomp and GDA Technologies have teamed to deliver a complete end-to-end wireless SerDes connectivity solution designed for the 3GPP long term evolution (LTE) and 4G cellular base station component market.  
Micron to bring phase-change memory to the fore 2010-07-30
Micron Technologies Inc. will push the phase-change memory technology, first likely to be applied in solid-state disk drives before inclusion in mobile phones.  
Engineers discuss 3D chip standard 2010-07-19
A group of about 60 engineers gathered at a Semicon West 2010 in San Francisco took the first crack at outlining standards needed for 3D silicon chips including address design, yield and cost problems.  
Innovasic, Micrel develop industrial Ethernet ref platform 2010-07-13
Innovasic Semiconductor and Micrel Inc. partnership rolls out a reference platform for industrial Ethernet connectivity.  
TI adopts new packaging tech for 45nm devices 2010-07-09
Texas Instruments is adopting an emerging technology called fine-pitch copper pillar flip-chip for packaging devices at the 45nm/40nm nodes and below.  
Analyst projects $8.5B in 2010 image sensor sales 2010-06-24
IC Insights predicts that growing demand for digital cameras, camera phones and machine vision will boost image sensor sales by 31 per cent this year to reach a record high of Rs.39,019.54 crore.  
DAC panel debates 3D TSV future 2010-06-23
A panel at the Design Automation Conference (DAC) debated on the roadmap for 3D through-silicon-via (TSV) interconnects.  
Elpida, PTI, UMC push 3D IC integration for 28nm 2010-06-23
Elpida Memory Inc., Powertech Technology Inc. (PTI), and United Microelectronics Corp. have reached a three-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm.  
Agilent tailors engineering solutions for educators 2010-06-22
Agilent Technologies have tailored four engineering solutions covering programming, RF design and telecommunications for university-level teaching.  
Cable, MIPS: Missing ingredients of Google TV 2010-05-26
Google TV misses two key ingredients in the form of cable TV providers who deliver most of the broadcast content and MIPS Technologies that powers many of the sets.  
Intel-powered Google TVs on the horizon 2010-05-24
Google has officially announced its GoogleTV initiative where all systems will be powered by Intel Atom-based processors.  
Open integration platform ups SoC realisation 2010-05-19
Cadence debuts its Open Integration Platform that has Cadence's mixed-signal (analogue and digital) design, verification and implementation products and solutions as its underpinning.  
Trade group links Ethernet, Infiniband 2010-04-21
Infiniband Trade Association took a step forward in the race towards converged networks, announcing the capability for layering Infiniband's low latency features on top of Ethernet.  
Virage Logics has sub-systems on its radar 2010-04-19
Virage Logic plans on a makeover as it intends on becoming a supplier of 'sub-systems' that can be quickly embedded in SoCs for its licensees instead of just a provider of a collection of IP cores.  
EDA still has growth option in automotives 2010-04-16
Mentor Graphics execs are of the opinion that automotives still holds out growth options for EDA with the advent of hybrid and electric vehicles.  
Intel, ARM widen battlefield at ESC 2010-04-14
Intel Corp. holds the top stop in the PC processor arena and ARM Holdings plc is the supplier of the leading processor architecture for mobile phones and the two are set to spar in a widened battlefield at ESC.  
IBM: Expect design rule explosion beyond 22nm 2010-04-12
IBM researcher Kevin Nowka described the physical design challenges beyond the 22nm node, emphasizing that sub-wavelength lithography has made silicon image fidelity a serious challenge.  
Tips for choosing virtualisation solution 2010-03-29
Here's a list of 10 important questions that can help an embedded system designer to choose the right virtualisation technology in their applications for cost savings, isolation and footprint reduction benefits.  


Max's Cool Beans

Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

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