| Via expands for COM Express compliance
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2008-04-17 |
| Taiwan-based Via Technologies develops its embedded device portfolio to include COM Express-compliant modules. |
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| Brocade, Intel to deliver next-gen server adapters
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2008-04-10 |
| Brocade and Intel have partnered to deliver next-generation server adapters that provide its storage networking software technology to deliver high-performance FCoE server connectivity. |
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| MIPS rolls licensable core for multiprocessing
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2008-04-03 |
| MIPS Technologies is rolling out its first licensable core geared for coherent multiprocessing which delivers 2,400 DMIPS running at 800MHz, besting the company's high end single-core 74K chip which delivers 2,000DMIPS. |
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| 8bit MCUs remains the industry's workhorse
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2008-04-01 |
| The new generations of super-powered processors get all the attention, but the humble 8bit MCU remains the industry's workhorse. |
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| Fingerprint sensors gain headway into consumer markets
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2008-02-28 |
| Though fingerprint authentication tech is gaining headway into the mainstream consumer market with the efforts of sensor developers, there is one major drawback: Most consumers are reluctant to use it. |
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| Server chipmakers prepare 10GbE for PCIe, virtualisation
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2008-02-15 |
| Server makers are hoping to be able to deliver a variety of networking, storage and clustering features on Ethernet for systems that can host multiple sessions at once, thanks to virtualisation tech. |
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| Source Code
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2008-02-01 |
| Looking for a way to generate motor speed profiles? Or writing a DSP algorithm for frequency analysis? Here's source code published in Embedded Systems Design and Embedded Systems Programming magazines from 1991. |
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| Virtual instrumentation increases productivity
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2008-01-16 |
| The trend of instrumentation moving towards software-based functionality puts India in a prime position to be one of the world's leading test platform providers. |
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| Server Trends for 2008
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2008-01-10 |
| Eddie Toh, Chairman of the Itanium Solutions Alliance, APAC Regional Committee discusses major server trends in 2008. |
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| Emerging mobile market enhances ARM, Intel rivalry
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2008-01-09 |
| A new rivalry has emerged in between ARM and Intel with ARM working to define a product category to sit in between the smart phone and the laptop while, Intel reckoning that it knows what will sit there and has been talking about the UMPC platform. |
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| EDA tools allow integrated die, package design
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2008-01-01 |
| The EDA industry is adapting to provide designers with tools that allow them to work on the entire system, not just parts that have different physical characteristics. |
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| Data transfer tech quadruple speed to 3.2Gbit/s
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2007-12-18 |
| A new set of specs for data transfer tech will quadruple top speeds to 3.2Gbit/s. Formally known as IEEE 1394, the technology is called FireWire by Apple Inc. and i.LINK by Sony Corp. |
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| Using deployment curve for devt strategy
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2007-12-17 |
| Using deployment curve as a tool for devt strategy encourages design teams to optimise code reuse, ensuring devt efficiency through all development steps, thus increasing the efficiency of the embedded design process. |
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| Converter makers compete to maximise light-load efficiency
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2007-12-03 |
| Given the importance of battery life to the end products' market success, high efficiency across the entire load range has become an increasingly crucial characteristic in today's step-down converters. |
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| TI boost its DSP speed to 1.2GHz
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2007-11-16 |
| TI has increased the speed of its DSP from 1GHz to 1.2GHz making it the fastest single- core DSP in the market, without changing the price of the chip. |
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| Industrial sensors perform precision measurements
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2007-11-16 |
| The devices being used in industrial apps are designed and manufactured not only by sensor specialists but also by semiconductor companies such as ADI, Dallas Semiconductor, Maxim and TI. |
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| Leadis boosts audio business with class G tech
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2007-11-14 |
| Jim Hauer, Leadis Technology's senior director for new business devt, talks about his company's patented class G amplifier technology, Gmax, and the company's product roadmap. |
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| Common Platform ups IC packaging investment
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2007-11-12 |
| The IBM-led Common Platform alliance plans to raise its investment in IC packaging tech to gain access to 32nm devices. |
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| 45nm designs face I/O planning, placement challenges
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2007-11-01 |
| With the move to the 45nm process node, more chip designs are going to be pad-limited, and die sizes will be directly affected by how I/Os are placed and sequenced efficiently.. |
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| UWB teams up with PCIe
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2007-11-01 |
| The convergence of UWB and PCIe in the notebook will drive high-performance wireless connections for PANs and other short-distance I/O applications. This article examines the trends |
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| Dealing with IP at smaller process nodes
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2007-11-01 |
| With the increasing demand for connectivity IP for high-speed serial buses, the IC tech require ultralow-power derivatives of high-performance logic manufacturing processes that enable production of very low-power SoCs for mobile platforms and small form-factor devices. |
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| Rivals advance towards core in processor battle
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2007-11-01 |
| In the processor battle between AMD and Intel, the question is who will make the more effective moves in the emerging game of identifying markets and creating the right mix of cores in a microprocessor to address them. |
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| ATCA proponents push to open up software features
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2007-10-26 |
| ATCA and its smaller formfactor cousin, MicroTCA (µTCA), now have a galaxy of higher-layer software and firmware coalitions working in concert for open telecom standards. |
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| Start-up aims to pack storage farm in server
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2007-10-23 |
| Start-up Fusion-io has released a novel memory card, which packs 80 to 640Gbytes of NAND flash on a PCI Express card, aiming to replace both hard drives and traditional solid-state drives. |
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| Step-down converter manufacturers up efficiency
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2007-10-22 |
| Step-down converter manufacturers are employing a wide array of schemes to maximise the efficiency of their devices in light load. |
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| Program addresses novel IC packaging issues
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2007-10-18 |
| Two research centres have teamed up to establish an industrial affiliation program that targets novel packaging approaches designed to reduce the mechanical stress on the IC after packaging and assembly. |
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| FPGAs suit powertrain, safety apps in car
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2007-10-16 |
| Actel has expanded its ProASIC3 family with what it claims as the industry's first FPGAs qualified to Grade 1 of AEC-Q100, the Automotive Electronics Council's stress-test qualification for automotive ICs. |
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| Xilinx to develop India centre as global R&D hub
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2007-09-19 |
| Xilinx has announced initiatives to develop its India R&D centre, which will play a crucial role in the entire chain of global R&D activities including IP core development, software development and systems and applications. |
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| Mistral enables next-gen VPX-based solution
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2007-09-17 |
| Mistral Solutions has announced that it has launched a new era of switch fabric-based embedded computing in the Indian market by providing VPX based Single Board Computers and DSP engines. |
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| Structured ASICs- an attractive option for custom IC design
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2007-09-03 |
| Given the increasing NRE charges and long design schedules associated with deep-submicron standard-cell ASICs, the use of structured ASICs for custom IC design is an increasingly attractive option.. |
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Strange modes of transport and other "stuff"
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