| Microsoft aims for a more structured software dvlpt process
|
2007-09-03 |
| According to Microsoft Corp. many new and revised programming languages are in development that will act as key enablers for the emerging parallel hardware architectures that are driven by multicore processors |
|
| Lattice cracks $10 price barrier for low-cost FPGAs
|
2007-09-03 |
| Lattice Semiconductor has reduced production volume prices for industry's first low-cost serdes-capable FPGAs to as low as Rs.402.46 ($9.95) for the 20k-LUT LatticeECP2M-20. |
|
| DTV chip market revenue to double by 2011
|
2007-08-20 |
| The boom in DTV sales in the coming year is expected to generate huge opportunities for IC suppliers due to doubling of revenue from shipments of DTV chips in next five years, according to iSuppli Corp. |
|
| PCI group sets 8GT/s bit rate for PCIe 3.0
|
2007-08-10 |
| The PCI Special Interest Group has finally set 8GT/s as the bit rate for the PCIe 3.0 version. |
|
| Altera unveils JEDEC DDR3 SDRAM standard
|
2007-07-18 |
| Altera Stratix III FPGAs' compliance with the JESD79-3 JEDEC DDR3 SDRAM standard supports 1.5V, low-power supply voltage of DDR3 memory, yielding about 30% system power reduction. |
|
| OPTi sues 8 companies over Compact ISA-Bus patent
|
2007-07-09 |
| OPTi Inc. has filed a patent infringement lawsuit against eight companies for making, selling and offering products related to two U.S. patents entitled, "Compact ISA-Bus Interface". |
|
| Analysts reveal iPhone components
|
2007-07-03 |
| The mass interest in the iPhone is a combination of Apple marketing, an interesting and interactive user interface, and the ability to integrate iTunes, Semiconductor Insights analyses. |
|
| MagnaChip applies CUP tech to cut chip size
|
2007-06-25 |
| MagnaChip announced it has successfully applied CUP technology to its foundry business processes to further reduce semiconductor chip sizes. |
|
| Intel adds details to Itanium road map
|
2007-06-18 |
| Intel plans to roll out the Itanium and Xeon CPUs along with a common south bridge I/O chip, all using a new high-speed interconnect, by next year |
|
| Industry tackles approach to DFM, DFY issues
|
2007-06-18 |
| Experts from chip, EDA and foundry companies ask whether it's better to deal with DFM and DFY issues at tape-out or minister to the design starting at the register transfer level. |
|
| Intel reveals details of multi-core R&D
|
2007-06-15 |
| Intel Corp. has revealed more details about its research into the future of multi-core processors without mentioning about the appearance of the advances in its commercial products. |
|
| UMC, ARM partnership offers 65nm SOI solutions
|
2007-06-12 |
| The successful tape-out of a test chip built with ARM SOI libraries on UMC's 65nm SOI process represents the next step towards mainstream adoption of nanometer SOI technology. |
|
| TSMC's supports 45nm design with reference flow
|
2007-06-07 |
| TSMC's latest design methodology Reference Flow 8.0 claims to increase yields, lower risks and improve design margins. |
|
| Triumvirate boosts use of flash in PCs
|
2007-06-04 |
| Dell, Intel and Microsoft have collaborated on a standard for NAND flash module controllers for use in notebooks and desktops. |
|
| Error-correcting code memory combats PC crashes: MS
|
2007-05-22 |
| A Microsoft white paper suggests desktop and notebook computers to adopt error-correcting code (ECC) memory to prevent system crashes from single-bit memory errors. |
|
| High-speed optical transceiver enables low-cost optics
|
2007-05-17 |
| Moving towards harnessing the speed of light to transmit data to an electronic interface flawlessly, IBM has introduced a prototype optical-transceiver chipset. |
|
| Memory interface boosts I/O bandwidth by 10x
|
2007-05-09 |
| HyperLink NAND, a new memory interface from Mosaid, will reportedly increase I/O bandwidth in flash by more than 10 times that of today's devices |
|
| Cell-mainframe hybrid to handle virtual world simulations
|
2007-05-02 |
| IBM and Hoplon Infotainment collaborate to integrate the Cell Broadband Engine in mainframe to create a hybrid capable of handling a new generation of "virtual world" applications, such as the 3D Internet. |
|
| Cell-mainframe hybrid handles 3D simulations
|
2007-04-30 |
| IBM and Hoplon Infotainment collaborate to integrate the Cell Broadband Engine in mainframe to create a hybrid capable of handling a new generation of "virtual world" applications, such as the 3D Internet. |
|
| TSMC's IP plans worry providers
|
2007-04-25 |
| Providers are concerned about the impact on their IP as well as the chances of company's migration to a more ASIC-like business model. |
|
| Intel platform improves performance of Internet-connected devices
|
2007-04-20 |
| Intel plans to launch its mobile platform next year to boost performance and energy efficiency in notebooks and other Internet-connected devices. |
|
| Qimonda teams up with Advantest team on GDDR5 testing
|
2007-04-19 |
| Qimonda AG is joining forces with Advantest to deliver a cost-efficient high volume test solution for GDDR5 graphics DRAM devices. |
|
| Fujitsu's new 300mm fab starts operation
|
2007-04-12 |
| Fujitsu Ltd. has begun operating its second 300mm wafer fab for 65nm chip fabrication. Volume shipments will begin in July. |
|
| TSMC starts 45nm process
|
2007-04-11 |
| TSMC has rolled out its 45-nm process technology for foundry customers, with plans to enter production as early as September 2007. |
|
| TSMC to start running 55nm prototyping service this May
|
2007-03-29 |
| Taiwan Semiconductor Mfg Co. Ltd will start running its 55nm process technology on a prototype basis in May, initially planning to offer it on a bi-monthly basis. |
|
| Signal-integrity issues trouble multi-gigahertz era
|
2007-03-16 |
| Engineers want a new bag of tricks to manage signal integrity as data rates soar into multi-gigahertz territory. |
|
| PCIe spec extends 'outside the box'
|
2007-02-13 |
| PCI-SIG has released the PCIe external cabling 1.0 specification, which extends the PCIe interconnect architecture 'outside the box.' |
|
| NSC revises revenue forecast
|
2007-02-12 |
| National Semiconductor Corp. has revised its revenue outlook for the third fiscal quarter ending Feb. 25 due to lower-than-expected shipments of display products over the holiday season in its Asian distribution channel. |
|
| SiCortex tips x86 ASIC for HPC cluster servers
|
2007-01-16 |
| Start-up SiCortex settled on a custom system chip that integrates six MIPS Technologies 64-bit 5Kf cores running at up to 500MHz as well as a proprietary fabric switch architecture. |
|
| PCI-SIG enhances PCIe ver 2.0
|
2007-01-16 |
| The PCI-SIG is making progress on feature extensions to its latest 2.0 spec that could enhance system performance as well as smooth a path for accelerators and storage devices riding the interconnect. |
|
Strange modes of transport and other "stuff"
|
|
|IIC-China
|
|
|Electronic Components|Computer Products|Trade Show Center
|Site Feedback|Site Map|Help|About Us|Contact Us|Terms of Use|Privacy Policy|Security Commitment