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EE Times India - total search 248 articles sort by date sort by relevance
CE apps to drive IC demand 2006-12-08
Rambus Inc.'s top executive sais that consumer electronics (CE) now drives chip demand and it's proving to be the most demanding customer of all.  
AIT granted lead frame U.S. patent 2006-12-06
Advanced Interconnect Technologies (AIT) was granted U. S. patent number 7,129,116 for developing a process for the manufacture and use of partially patterned lead frames with near-chip scale packaging lead-counts.  
Indian designers show high interest in Rapid I/O 2006-12-05
Interest in Rapid I/O specifications is growing in India as more designers sign up for conferences on how to implement the spec. Based on registration totals for recent meetings, interest here may outpace that in the United States. Nearly 120 engineers registered for a recent event here compared to 55 at a similar event in Boston  
Intel, AMD clash on defining interconnects 2006-11-16
A battle royal is shaping up as archrivals Advanced Micro Devices Inc. (AMD) and Intel Corp. race to define interconnects for their next-generation multicore processors. The archrivals hope to use those links to weave separate webs of partnerships that will be keys to success in tomorrow's computer industry.  
Data I/O, Intel's flash group offer integrated solutions 2006-11-14
Data I/O Corp. has partnered with Intel's Flash Memory Group to offer integrated solutions, based on the companies' expertise in automated programming solutions and flash memory, reducing time-to-market and facilitating easy adoption and manufacturing for customers  
Embedded FPGA targets 65nm 2006-11-07
Claiming to be already delivering the densest embedded FPGA (eFPGA) at the 90nm manufacturing node, M2000 SA is in the process of preparing FPGA IP targeting 65nm designs.  
Enhanced FPGA targets compute-intensive apps 2006-11-06
Capitalizing on expiring FPGA patents and an accelerating shift of FPGAs into data-path processing, Velogix is developing a high-performance programmable-logic platform to run the billions of operations each second needed by applications like video and imaging, test and measurement, and communications.  
IBM, Chartered, Samsung license ARM's 45nm tech 2006-10-31
Common Platform technology business partners IBM, Chartered Semiconductor Manufacturing and Samsung Electronics Co. Ltd have licensed ARM's proprietary products for 45nm LP process technology.  
Selecting linear regulators for appropriate applications 2006-10-30
Designers determine whether a certain type linear regulator is appropriate for the application based on dropout voltage, ground current and stability-compensation method requirements.  
Start-up Gear6 to announce novel RAM cache scheme 2006-10-20
Start-up Gear6 will announce a novel concept for boosting performance in the data centre with rackable RAM cache systems that sit on an Ethernet network.  
Xilinx opens development centre in Hyderabad 2006-10-10
Xilinx Inc. has announced the opening up of its development centre in India, located in a 3065.80 square metre facility in CyberPearl, Hyderabad.  
Sun Micro's 'server-on-chip' opens road to universal I/O 2006-10-03
Sun Microsystems Inc. will pack native PCI Express and 10GbE interfaces onto its next-generation Niagara processor.  
Intel develops teraflop programmable processor 2006-09-28
Intel disclosed details of its terascale research silicon programme, including the development of the world's first programmable processor said to deliver 1Tflops/s.  
NI, BAE, PMI to develop PXI Express-based instrument 2006-09-22
BAE Systems, National Instruments (NI) and Phase Matrix Inc. (PMI) have formed a joint initiative to develop a PXI Express-based synthetic instrument for military and commercial RF and microwave applications.  
Synopsys, SMIC jointly develop ref design flow 3.0 2006-09-07
Synopsys Inc. and SMIC have jointly developed and deployed reference design flow 3.0.  
Cadence, Mentor battle over high-speed IC design 2006-09-01
Lack of standards for simulating chip interconnects as they scale up to 5Gbps and beyond has pitted Cadence and Mentor in fight for competing solutions.  
IBM, Chartered, Infineon, Samsung announce first ICs on 45nm 2006-08-31
IBM, Chartered Semiconductor, Infineon Technologies and Samsung disclosed that they have developed their first functional chips based on a low-power, 45nm process technology.  
National reduces sales outlook by 6% for Q1 2006-08-24
National Semiconductor Corp. has lowered its revenue outlook for Q1, and now anticipates that revenue for the quarter will be down approximately six per cent sequentially from Q4.  
Intel achieves 20Gbps signalling rates, reports SiliconPipe 2006-08-18
Researchers at Intel Corp. have achieved 20Gbps signalling rates over flexible circuit traces between chips, said SiliconPipe Inc.  
Chip packaging delivers 30% reduction in thickness 2006-08-03
Freescale Semiconductor Inc.'s proprietary redistributed chip packaging technique delivers about a 30 per cent reduction in packaged-die area and thickness.  
GDA design centres support market diversification 2006-08-01
GDA Technologies Inc. announced an increased investment in the range of Rs.14 to Rs.23 crore in its India operations in January 2006.  
BiTMICRO, Kilopass sign corporate license agreement 2006-07-19
Kilopass Technology and BiTMICRO Networks, a maker of intelligent flash solid-state disc (SSD) solutions, announced that they have signed a corporate license agreement.  
I2C bus to get speed makeover 2006-07-17
Royal Philips Electronics have upped the speed of the venerable I2C serial bus by 250 per cent, thus improving data transfer speeds as well as response to control commands.  
Spansion, Data I/O collaborate on automated flash memory programming 2006-06-20
Data I/O and Spansion collaboration allows Spansion to license Data I/O software for automated flash memory programming in the production of wireless, consumer and automotive appliances  
PCIe shifts gear into v2.0 2006-06-13
The 2.5Gbps PCI Express interconnect is slowly shifting gears into a 2.0 version.  
Advantech, Congatec, Ampro form XTX standard alliance 2006-06-09
Embedded platform providers Advantech, Congatec and Ampro Computers have announced an alliance to help promote the XTX standard for computer on modules.  
Tundra announces its host bridge inclusion in VadaTech PrPMC module 2006-05-30
Tundra Semiconductor Corp. has announced that Tundra Tsi109 Host Bridge will be integrated into the VadaTech PMC710 PrPMC module.  
10Gb Ethernet gains with board, chip designs 2006-05-01
NetXen's programmable dual-port 10Gbit server card and Broadcom's 20-port 10GbE chip for stackable switches are expected to speed up the slow shift to 10GbE.  
ARM, TSMC enter long-term IP agreement for 65nm, 45nm 2006-04-24
ARM and TSMC are extending their long-term relationship to development of a new suite of ARM Advantage products in support of TSMC's 65nm and 45nm G processes.  
Vivace plans to release HD media processors 2006-04-20
Vivace Semiconductor Inc. has announced plans to roll out media processors that can play high-definition video while consuming less than half a watt of power.  


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Clive Maxfield Strange modes of transport and other "stuff"

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