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EE Times India - total search 248 articles sort by date sort by relevance
TI DSP powers next-gen video infrastructure products 2005-09-08
As the delivery of HD video broadcast becomes more and more prevalent worldwide, products featuring Texas Instruments Inc. (TI) digital signal processing technologies are deploying to the market today.  
The changing face of automotive ECU design 2005-09-01
Designers are moving away from MCUs and microprocessors and into programmable logic devices.  
Marvell buys storage IC unit for $225 million 2005-08-30
Expanding its efforts in storage, Marvell Technology Group Ltd announced a definitive agreement to acquire the hard disk and tape drive controller semiconductor business of QLogic Corp. for $225 million in cash and stock.  
Broadcom bares 3G RAID architecture at IDF 2005-08-24
Broadcom Corp. is demonstrating what it claims to be the first SAS/SATA RAID-on-Chip (RoC) device with integrated PCI Express (PCIe) host bus architecture support at the ongoing Intel Development Forum 2005 (IDF) in San Francisco.  
Intel to unveil next-gen processor architecture at IDF 2005-08-17
Intel Corp. is expected to announce its next-generation architecture for multicore microprocessors at the Intel Developer Forum in San Francisco next week.  
Telairity discusses H.264 processor at Hot Chips 2005-08-17
Telairity Semiconductor Inc. has launched a microprocessor for high-definition video encoding at the Hot Chips 17 conference in Stanford, California, the company said.  
X-EMI readies chips to cut EMI by 20 dB 2005-08-11
A startup with roots in the network-processor company SiTera Inc. has demonstrated a unique solution to electromagnetic interference problems at a vertical EMI show in Chicago.  
Media gateways set challenges for developers 0200-12-26
Media gateway developers, manufacturers and service providers face the challenge of lowering cost and shortening time-to-market as consumers demand for more advanced applications at an unprecedented pace.  

EE Times Asia - total search 3253 articles
Developing automatic test systems for extended duty 2012-02-10
TSMC to roll 3D IC assembly service next year 2012-02-06
Hardware/software co-dev't with emphasis on software 2012-02-06
Analog switches tout up to 200V operating voltage 2012-02-06
Advances in 3D-IC testing 2012-02-03
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