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EE Times India - total search 72 articles sort by date sort by relevance

GUC, Tensilica announce processor partnership	2006-02-24
Global Unichip Corp. has disclosed that it will create hardened versions of Tensilica's Diamond Standard Series processors for TSMC foundry for technologies at 0.13µm and below.
Outsourcing: Navigating a maze of decisions	2006-02-16
The cheapest, fastest and best way to finish your chip design may be to get somebody else to do it. A complex web of providers, both domestic and offshore, will be happy to help. But successfully outsourcing IC design takes careful planning, strong project management and a realistic set of expectations.
IP reuse needs a verification strategy	2005-12-22
The concept of reuse seems simple and easy in theory, but there are a number of obstacles that design and verification teams must address to be successful.
Partnership aims SoC designs in Greater China	2005-12-21
ARC Int.'s and Global Unichip's new partnership aimed at speeding time-to-market for Greater China's increasing number of fabless start up companies attacking the digital audio IC market.
Faraday customers take up low-power platform	2005-12-06
Faraday announced the successful adoption of its low-power platform solution, PowerSlash, by three ASIC customers.
Synopsys, UMC partner on low power 90nm reference flow	2005-11-23
EDA giant Synopsys Inc. and Taiwanese foundry United Microelectronics Corp. (UMC) Monday (Nov. 21) announced the availability of a 90nm reference design flow that is said to be optimized for low-power system-on-chip (SoC) designs.
16bit MCU portfolio targets performance, cost goals	2005-11-21
In the advent of more complex electronic design requirements from customers for increased speed, efficiency and performance, chipmakers jumped on the 32bit bandwagon for microcontroller-intensive applications.
Denali spreads new word in ESL mart	2005-10-03
With a missionary zeal to establish standards and design methodologies, Denali Software leaps into the ESL market.
Platform partners integrate design-for-manufacturing	2005-09-23
IBM, Chartered Semiconductor Mfg and Samsung Electronics Co. Ltd have entered into an initial set of solutions for their cross-fab, common design-for-manufacturability (DFM) initiative. The multi-faceted effort, which includes participation by electronic design automation (EDA) and DFM tool suppliers, is expected to offer a series of rules, models and utility kits that provide new levels of predictability and control to achieve working silicon faster and yield ramp more efficiently.
Engineers write up SystemC TLM concepts	2005-09-01
Engineers at STMicroelectronics claim that SystemC transaction-level modeling will be the next SoC design methodology.
Flexing ARM for disruptive change	2005-09-01
Warren East left Texas Instruments Inc. to join core maker ARM Holdings plc in 1994, when the U.K. company was small enough to worry about whether it could pay the salaries at the end of the quarter.
Mosaid, UMC, team on DRAM controller IP	2005-08-12
Foundry United Microelectronics Corp. is working with Mosaid Technologies Inc. to develop Double Data Rate and DDR2 synchronous DRAM memory controller intellectual property core for use with or UMC's 90nm and 130nm manufacturing process, Mosaid said.

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EE Times Asia - total search 404 articles

Hardware/software co-dev't with emphasis on software	2012-02-06
Impact of 4Gbps FireWire on industrial apps	2012-01-18
Address 4G issues with SystemVue	2011-12-23
Identifying the 4G PHY architecture design challenges	2011-12-20
Layout software speeds up chip finishing	2011-12-07
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