| Leadis boosts audio business with class G tech
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2007-11-14 |
| Jim Hauer, Leadis Technology's senior director for new business devt, talks about his company's patented class G amplifier technology, Gmax, and the company's product roadmap. |
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| TI invites 3 China universities for leadership program
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2007-11-05 |
| TI has invited three universities in China to work with TI and TI Leadership Universities on future TI signal processing-funded programs. |
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| Embedded-sensor tech lets ICs sense surroundings
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2007-11-02 |
| ChipSensors has unveiled an embedded-sensor tech that may be used to create miniature yet conventional sensors, with the IC implementing the MCU and a wireless transmitter to send collected data off-chip. |
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| Dealing with IP at smaller process nodes
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2007-11-01 |
| With the increasing demand for connectivity IP for high-speed serial buses, the IC tech require ultralow-power derivatives of high-performance logic manufacturing processes that enable production of very low-power SoCs for mobile platforms and small form-factor devices. |
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| MIPS-Chipidea merger transforms SoC design
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2007-10-16 |
| MIPS technologies acquisition of Chipidea is seen as a step to enter the customer's SoC design process early in the cycle and to offer customers standard blocks that combine digital and analogue. |
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| Analogue device makers address car OEMs' needs
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2007-10-16 |
| Analogue device makers are flooding the market with analogue chips that meet automotive OEMs' requirements while adhering to the auto environment's space limits. |
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| TI acquires portable power mgmt IC supplier
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2007-10-12 |
| TI has acquired Powerprecise Solutions to boost its development of power-management solutions and to address complex battery power challenges. |
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| Thermal tech addresses power mgmt issues in IC packaging
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2007-10-11 |
| Nextreme claims that its thermal copper pillar technology will solve the overheating problem with modern flip-chips, by studding the backside of flip-chips with solder bumps that can transfer heat out of the chip. |
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| Leadis acquires Nuelight IP to beef up AMOLED
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2007-10-10 |
| Leadis Technology has acquired IP from Nuelight that improves manufacturing yields by correcting non-uniform brightness without increasing backplane complexity in its active-matrix OLED display drivers. |
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| Synopsys acquires Sandwork Design
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2007-10-05 |
| Synopsys has acquired a provider of analogue and mixed-signal verification solutions to provide a comprehensive environment for verification and debug |
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| IIT researchers develop new digital module testing tech
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2007-09-20 |
| A team of researchers at the IIT, Kharagpur have developed new approach for testing digital modules embedded in mixed-signal VLSI circuits |
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| EE Times-China ACE Awards 2007 open for nominations
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2007-09-20 |
| In order to recognise progressive semiconductor companies who inspire innovation among China?s electronics engineers, Global Sources' EE Times-China has opened nominations for its second ACE Awards in mainland China. |
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| Intersil opens Hyderabad design centre
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2007-09-19 |
| Intersil has opened a new design centre in Hyderabad to accelerate its product initiatives in analogue-mixed signal and power management products to bring innovative products to market faster |
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| TI explores smaller niche purchases in analogue
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2007-09-10 |
| TI CEO said that his company prefers to direct its resources at smaller acquisitions in the analogue sector because of the synergies that can quickly result. |
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| NXP takes fab lite route
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2007-09-10 |
| Since moving out from under the wing of Philips a year ago, NXP has been reducing the amount of chip production it outsources, albeit for tactical rather than strategic reasons, said NXP CEO. |
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| MIPS may acquire a DSP core company
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2007-09-04 |
| After the acquisition of Chipidea Microelectronica, MIPS CEO John Bourgoin hinted on the need of the DSP core for data planes. |
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| MIPS acquires analogue IP firm Chipidea
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2007-08-29 |
| MIPS Technologies has acquired analogue IP firm Chipidea Microelectronica as a move to strengthen its position and expand its customer base, making MIPS "the second largest design IP vendor" in the world. |
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| EDA Tech discusses new technologies
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2007-08-29 |
| EDATF, a key technical and networking resource for the EE community, provided a platform to exchange ideas and preview upcoming technologies in EDA and identify the complete and practical solutions to tackle today's design challenges. |
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| Cadence-Clear Shape merger minimises yield loss
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2007-08-21 |
| Cadence has acquired Clear Shape to deliver manufacturing awareness and lithographic correctness for all layers in an IC from transistor through interconnect in all design domains. |
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| Is changing analogue market on the rise?
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2007-07-17 |
| Despite doubts of workability, integration and testing of analogue IP, the analogue and mixed-signal IP market grew 34 per cent in 2006, accounting for 16 per cent of the overall design IP market, reports Gartner |
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| Faraday's UR-IP Centre to offer high-end mixed-signal IPs
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2007-07-12 |
| Faraday, along with Afa Technologies, Chip Advanced Technology, and SMedia Technology, has started UR-IP Centre to provide high value-added mixed-signal IPs |
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| Synopsys, UMC collaborate on 65/90nm connectivity IP
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2007-07-05 |
| Synopsys has collaborated with UMC to port its DesignWare USB 2.0, PCI Express, SATA and XAUI PHY semiconductor IP to UMC's 90nm and 65nm technologies. |
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| Euro fabs turn to niche apps to avoid TSMC
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2007-07-02 |
| TSMC's two-pronged strategy to roll out a series of 45nm manufacturing process variants and to invest in 180nm manufacturing is putting increasing pressure on its European competitors. |
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| Call for energy efficiency forces industry's hand
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2007-07-01 |
| The next big thing is perhaps not a device or an application but a design awareness of achieving energy efficiency. The convergence of an increasing number of features on portable devices is challenging the best of engineers to balance features with lower power consumption. |
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| TSMC, Cadence partners on 65nm wireless design flow
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2007-06-28 |
| Cadence has collaborated with TSMC to produce a new TSMC 65nm RF process design kit (PDK) compatible with the new Cadence Virtuoso custom design platform. |
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| Broadcom ready to handle next-gen handset market
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2007-06-08 |
| Broadcom has attributed its 3G base band market success to its broad IP portfolio and unique mixed-signal communications expertise |
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| Indications: Angstrem to partner AMD in 130nm fab
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2007-06-08 |
| Despite finalising AMD as its equipment layout experts, Russian chipmaking firm JSC Angstrem has declined to confirm the source of its forthcoming 130nm CMOS process. |
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| Russian fab teams up with U.S. firm to import 130nm process
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2007-06-07 |
| JSC Angstrem has planned to divide the company into two parts, one for foundry and one for design, Angstrem-T and Angstrem-M, respectively. |
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| Low power challenges push for system-level EDA
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2007-06-01 |
| It is logical and imminent that the power format standard will evolve to address the current gaps in low-power design. However, how soon the CPF and UPF camps will find common ground for agreement is anyone's guess. |
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| Mentor, UMC address AMS needs
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2007-05-30 |
| Mentor Graphics and UMC have collaborated to develop a mixed-signal design flow that includes an integrated environment for design capture, data management and verification |
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Strange modes of transport and other "stuff"
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