| Rising software complexity dictates FPGA-based prototyping
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2007-11-01 |
| The growing use of multicores is adding to the tremendous growth of software used in an ASIC or SoC, further increasing their complexity. What does this trend toward increased software mean for the overall design process? |
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| Dealing with IP at smaller process nodes
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2007-11-01 |
| With the increasing demand for connectivity IP for high-speed serial buses, the IC tech require ultralow-power derivatives of high-performance logic manufacturing processes that enable production of very low-power SoCs for mobile platforms and small form-factor devices. |
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| Addressing the challenges of process node transition
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2007-11-01 |
| In the transition to 45nm, reaching node availability, readiness and adoption has become significantly more complex |
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| Full- and Hi-Speed USB 2.0 device controller debuts
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2007-10-09 |
| Altera Corp. has introduced a complete USB 2.0 Hi-/Full-Speed device controller solution that consists of a soft IP core, software and class drivers, and SLS' Snap-On PHY daughtercards. |
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| Agilent develops 3D EM stimulator
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2007-10-04 |
| Agilent has developed a planar 3D electromagnetic simulator designed to expand the accuracy and range of passive circuit libraries, including parasitic models and entire circuits. |
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| Researchers display future PC interface tech
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2007-10-01 |
| Researchers showcased future technologies of computer interfaces and graphics including a locomotion interface for virtual environments, a virtual video recording system and multitouch displays among others. |
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| Key specs for SRD transceivers
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2007-10-01 |
| As low-power wireless technologies compete for dominance in replacing wires and cable in home networking, automation and sensor systems, the importance of short-range radio transceivers has grown. |
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| Tower offers to support India chip manufacturing groups
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2007-09-28 |
| Israeli fab is in talks with SemIndia and HSMC to bring to their cooperation an offering which includes special areas such as CMOS sensors found in mobile phones, automotive and medical apps. |
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| Chipmakers explore virtual world market
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2007-09-25 |
| Intel is determined to be among the first to rally the industry around the devt of standards and tech that would one day make it possible to move user-generated content from one virtual world to another. |
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| Firms address 65nm FPGA design verification
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2007-09-24 |
| Xilinx has partnered with Cadence, Mentor and Synopsys to define and implement new verification flows for ultrahigh-density designs of 65nm FPGAs and new emerging FPGA architectures. |
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| Chip makers, EDA vendors set up DFM coalition
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2007-09-21 |
| The Silicon Integration Initiative (Si2) has announced that top chip makers and EDA tool vendors have established a coalition to add DFM parameters to existing design flow. |
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| IIT researchers develop new digital module testing tech
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2007-09-20 |
| A team of researchers at the IIT, Kharagpur have developed new approach for testing digital modules embedded in mixed-signal VLSI circuits. |
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| Synopsys, SiSoft develop signal integrity analysis solution
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2007-09-17 |
| Synopsys and SiSoft have integrated SiSoft's Quantum-SI tool and Synopsys' HSPICE simulation solution to deliver robust timing and signal integrity analysis for package and PCB design |
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| AMD, Qimonda launch joint chip simulation project
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2007-09-06 |
| AMD and Qimonda have launched a joint chip simulation project that includes modeling and simulation at the physical level and refers to materials, architectures and manufacturing processes |
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| Using emulation for system level sign-off
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2007-09-04 |
| Today EDA vendors are hard at work extending the range of tools supporting sign-off to meet the changing landscape introduced with the nanometre age. |
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| ESC, EDA&T-Taiwan showcased Asia's faster uptake on software, IP
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2007-08-29 |
| The ESC-Taiwan and EDA&T-Taiwan shows seemed a testament to Asia's faster uptake on software and IP industries, given semiconductor industry's evolution and software?s increasing stakes in it. |
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| Software, IP solutions dominate ESC-Taiwan, EDA&T-Taiwan
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2007-08-29 |
| Software and IP solutions took the centerstage at this year's ESC-Taiwan and EDA&T-Taiwan show in Taipei last August 23-24. |
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| Cadence, Mentor team to standardise OVM
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2007-08-22 |
| Cadence and Mentor Graphics have partnered to standardise on OVM that promises to deliver a tool-independent solution for designers and verification engineers that promotes data portability and interoperability. |
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| Xilinx, EDA giants address 65nm FPGA verification
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2007-08-17 |
| Xilinx has collaborated with three major EDA companies to define and implement new verification flows to maximise productivity for ultrahigh-density designs targeting today's 65nm FPGAs. |
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| Cadence, SMIC jointly develop RF design solution
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2007-08-06 |
| Cadence has joined hands with SMIC to develop RF design solution that will help chip designers in China to design and deliver high-quality RF devices. |
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| UK trade dept awards CDT to develop EDA for organic apps
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2007-07-19 |
| A consortium of CDT and Silvaco has been granted Rs.2.04 crore ($500,000) to extend the use of EDA software to organic semiconductor materials and accelerate the dvlt of low-cost fabrication techniques for organic displays. |
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| Multicore shakes up EDA industry
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2007-07-16 |
| The EDA vendors accept that though multi-core platforms provide much-needed compute power as transistor counts soar at 65nm and below, but they can prove a cause of concern for legacy apps that could be difficult or even impossible to parallelise. |
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| SoftMEM's tools add MEMS to EDA software
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2007-07-03 |
| SoftMEM's toolsets, when integrated with existing EDA tool sets, enables EEs to co-design electronics-with-MEMS chips without having to have the deep MEMS knowledge of a guru. |
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| TSMC, Cadence partners on 65nm wireless design flow
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2007-06-28 |
| Cadence has collaborated with TSMC to produce a new TSMC 65nm RF process design kit (PDK) compatible with the new Cadence Virtuoso custom design platform. |
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| BEL delivers spacecraft components to ISRO
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2007-06-19 |
| BEL has delivered two Flight Model Travelling Wave Tubes (TWTs) that are Space-Qualified Components used on board Communication Satellites to ISRO. |
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| Renesas develops SOI SRAM tech for 32nm, beyond
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2007-06-14 |
| Renesas is hoping to extend operation margins by controlling the body potential of SRAM component transistors individually in line with SRAM operations such as writes and reads. |
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| UMC, ARM partnership offers 65nm SOI solutions
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2007-06-12 |
| The successful tape-out of a test chip built with ARM SOI libraries on UMC's 65nm SOI process represents the next step towards mainstream adoption of nanometer SOI technology. |
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| Agilent expands design platform tech
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2007-06-08 |
| Agilent Technologies is planning to increase investments in RF/microwave design and simulation technologies to provide a full spectrum of software tools to designers |
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| IC designers analyse DFM tools
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2007-06-01 |
| IC design experts believed that DFM is best addressed through design rules, preverified blocks and improved standard-cell libraries, said the experts. |
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| Mentor, UMC address AMS needs
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2007-05-30 |
| Mentor Graphics and UMC have collaborated to develop a mixed-signal design flow that includes an integrated environment for design capture, data management and verification. |
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Strange modes of transport and other "stuff"
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