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EE Times India - total search 167 articles sort by date sort by relevance
Opinion: e-beam critical to semiconductor manufacturing 2010-09-23
D2S Inc. CEO Aki Fujimura discusses the role of electron beam lithography in the future of semiconductor manufacturing and is of the opinion that all leading-edge designs will require e-beam technology.  
Start-up specialises in FPGA-based prototyping technology 2010-08-17
InPA Systems Inc., a start-up emerges out of stealth mode today to flaunt a new technology that it has developed which compresses integration time from weeks into days.  
Aava designs open mobile platform with AWR tools 2010-08-09
Aava Mobile has used AWR Corp's design suite, Microwave Office to design its open mobile device platform.  
EU project streamlines embedded system design 2010-08-04
The EU's SPEEDS (SPEculative and Exploratory Design in Systems Engineering) project has resulted in the definition of a design methodology, process and tool environment for model-based safety-critical embedded systems.  
Motorola details Droid design challenges 2010-06-24
Iqbal Arshad at Motorola Mobile Devices Inc. recalls how his company being eight years behind its competitors pooled all its strength to innovate itself out of possible oblivion as a mobile device provider.  
ExaScience lab set up in IMEC Belgian facility 2010-06-10
Intel Corp., IMEC and five Flemish universities have set up the Flanders ExaScience Lab to develop software to run on Intel-based future exascale computer systems  
Intel targets high-computing apps with 50-core processor 2010-06-02
Intel is targeting high-performance computing applications with its "Knights Corner" many-core processor that integrates over 50 cores using a 22nm process.  
Cadence buys Denali 2010-05-17
Cadence Design Systems Inc. will acquire Denali Software Inc. for Rs.1,454.58 crore ($315 million) in cash  
Avnet, Xilinx co-develop FPGA DSP dev't kit 2010-04-26
Avnet, Xilinx co-developed DSP development kit based on Virtex-6 FPGA devices provides up to a 10x productivity advantage and an easier entry point for using FPGAs for DSP.  
Trade group links Ethernet, Infiniband 2010-04-21
Infiniband Trade Association took a step forward in the race towards converged networks, announcing the capability for layering Infiniband's low latency features on top of Ethernet.  
Dassault software drives InnerPulse defibrillators 2010-04-16
InnerPulse chooses Dassault Systèmes' Abaqus finite element analysis (FEA) software from the SIMULIA to assist in development of their technology designed in SolidWorks CAD software  
What ails the EDA industry? 2010-04-15
Oasys Design Systems executive chairman Sanjic Kaul details challenges and its solutions for the EDA industry.  
EU project to cool IC designs draws electronic firms 2010-04-08
EU-funded Therminator research project aims to enhance existing EDA solutions to enable designers to address temperature issues more effectively using their existing design flows.  
Duo combine forces for model based design workflow 2010-03-31
The MathWorks and Mentor Graphics have come together to provide guidance on an integrated workflow for DO-254 compliance using model-based design.  
SunPower gets grant for PV research project 2010-03-31
SunPower Corp. has received approximately Rs.6.93 crore ($1.5 million) in grants to research how to facilitate high levels of distributed photovoltaic (PV) penetration into the utility distribution system.  
Magma, Chengdu ICC open joint IC design lab 2010-03-15
Magma Design Automation and Chengdu ICC (CDICC), have established a joint IC design lab to help IC design companies meet the demands of the international semiconductor market.  
EC sets up task force for nanoscale memory project 2010-02-26
The European Commission has established a taskforce to design future microchip memories and the project is expected to last three years.  
Duo provides training programmes for India engineers 2010-02-12
Honeywell partners Equinox to provide specialised training programmes for process engineers and chemical engineering students in India.  
Optimism marks 2010 EDA forecasts 2010-02-05
EE Times lines up estimates and predictions of EDA gurus Walden Rhines, Gary Smith, and Joseph Borel for this year's EDA market.  
Simulation tool boosts performance up to 100x 2010-02-04
Virginia Tech team's faster simulation tool for SystemC based hardware models bags the best paper award at the 15th Asia and South Pacific Design Automation Conference (ASP-DAC  
Infineon exec addresses IDM challenges in wireless sector 2010-02-02
At the recently-held VLSI conference, Hermann Eul, member of the management board, Infineon Technologies AG Deep delivered his keynote on deep sub-micron CMOS technology.  
Outlook: Cloud computing will redefine information, process use 2010-01-28
Vipin Gupta at Empyra.com Inc. tells Vivek Nanda the next decade will redefine how we use and build information technology driven processes. He talks about the challenges and opportunities facing the cloud computing market.  
Fujitsu, A*STAR partner on petascale computing 2010-01-22
Fujitsu and A*STAR have formed an R&D partnership to develop advanced applications technologies for petascale computing.  
Tech, tech practice to boost 2010 engineering success 2010-01-14
Mathworks India Pvt. Ltd managing director, Kishore Rao has identified parallel language, early verification with Model-Based Design as cornerstones of engineering success in 2010.  
Partners to collaborate on processor compiler tools 2009-12-15
Lattice Semiconductor Corp. and Beyond Semiconductor will work together on the development of compiler tools for Lattice's soft processors.  
Why voltage-aware verification strategy counts 2009-11-25
Low-power designs are here to stay. A more robust verification strategy is to incorporate a voltage-aware, assertion- and coverage-based verification strategy that includes extensive power-on-reset and firmware tests.  
Intel Exascale R&D centre rises in France 2009-11-23
Intel has committed to support and create the European Exascale Computing Research Centre with French R&D organisations.  
3D Web development critical to HPC growth 2009-11-20
Justin Rattner, chief technology officer at Intel, said that the needs of the 3D Web hold the key to the growth of high-performance computing.  
Global conference series makes a pit stop at India 2009-11-17
EE Times-India caught up with Rahul Arya, marketing and technical sales director at Cadence Design Systems (I) Pvt. Ltd, to discuss India's domestic semiconductor industry and to find out what Indian engineers should expect at the CDNLive!.  
New method detects chip flaws during design 2009-09-01
A new method that harnesses an electronics failure simulation technique enables engineers to detect design flaws resulting in cracks, fractures and interface faults before chip fabrication  


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