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EE Times India - total search 472 articles sort by date sort by relevance
Automotive MCUs get flexible 2008-06-17
A flexible microcontroller is cost-effective and may be specified exactly to customer requirements.  
EDA still software challenged, says analyst. 2008-06-16
Founder and chief analyst for Gary Smith EDA said at DAC that software development is still the biggest challenge in SoC design.  
Implement an FPGA ASIC prototype 2008-06-16
ASIC designers think they can best meet their requirements by prototyping the functional equivalents of their designs as FPGAs.  
Can compute-farms solve the problem on parallel programming? 2008-06-13
Compute-farms raises a question on the probability on making progress on the general parallel programming problem.  
Synopsys define 'first' low-power verification methodology 2008-06-05
Synopsys has collaborated with ARM and Renesas Technology to define the industry's first low-power verification methodology  
TSMC introduces 40-nm design flow 2008-06-05
TSMC is set to roll out its latest design methodology for IC production at the 40-nanometer node.  
Planarity flow qualified for TSMC's IC manufacturing 2008-06-03
Mentor Graphics' calibre model-based planarity flow has qualified for TSMC's 65 and 40nm processes.  
Aeroflex, Innowireless team up for 3GPP LTE 2008-05-30
Aeroflex and Innowireless have formed a partnership to accelerate 3GPP LTE development.  
Agilent to show innovations in DAC 2008-05-29
Agilent will participate in the Design Automation Conference to showcase its latest signal integrity design and RFIC verification innovations  
Outsourced IC design starts grew by 20% 2008-05-27
Chip design outsourcing starts has grown by 20 per cent in 2007, reports Gartner Inc.  
VeriSilicon joins Power Forward Initiative 2008-05-14
VeriSilicon has joined the Power Forward Initiative and plans to offer CPF-based design solutions.  
GSA sees fabless future for chips industry 2008-05-07
GSA chairman predicts the dominance of the fabless model in the semiconductor industry.  
IP experts agree rules need to be modified 2008-04-22
Government needs to overhaul the overarching patent system and industry needs to hammer out new practices at silicon, software and system levels, according to speakers at the Intellectual Property Symposium.  
Photomask verification for 45nm logic masks 2008-04-22
Brion Technologies and DNP have successful demonstrated a model-based photomask verification on critical 45nm logic masks  
Indian firms eye tie-ups to drive business 2008-04-04
A number of Indian electronics companies are embracing the philosophy that they must find partners to help conceive and design new products as quickly as possible.  
Springsoft to acquire Novas shares 2008-04-04
Springsoft and Novas have signed an agreement for Springsoft to acquire all the outstanding shares of Novas that it does not already own.  
Synplicity announces acquisition by Synopsys 2008-03-31
Synplicity has announced it has signed a definitive agreement to be acquired by Synopsys.  
Real deal on Synopsys' Synplicity buyout 2008-03-25
Synopsys has inked an agreement to acquire Synplicity for Rs.315.83 ($8) cash per share.  
Synopsys qualifies its IC compiler 2008-03-20
Synopsys has announced the qualification of its IC Compiler that offers designers an assured path to design- rule-correct physical implementation  
Magma participates as technical member in SOI consortium 2008-03-12
Magma has joined the SOI Industry Consortium as a technical member, joining 20 other companies from across the electronics industry covering a spectrum of users, enablers, suppliers and manufacturers.  
PrimeYield LCC enables litho-clean tapeout 2008-03-05
Synopsys, Inc has announced that LGE has successfully discovered and fixed lithography hotspots in its HDTV application chipset using Synopsys' PrimeYield LCC.  
Synopsys collaborates with Fujitsu for virtual platform technology 2008-03-04
Synopsys has announced collaboration with Fujitsu to provide advanced virtual platform technology to customers as a Fujitsu Cedar- ESL services provider.  
VLSI trends: Scaling CMOS to its limit 2008-02-16
Over 1,000 technologists, researchers, experts and students converged in the city of Hyderabad on Jan. 5, 2008 to attend the VLSI Conference. Dipti Agarwal reports.  
EDA tools aid in drug design 2008-02-12
EDA industry veterans have said that techniques used for chip design can be adopted for new drug discovery and development.  
Rockwell Collins to set up design centre in Hyderabad 2008-02-11
US-based Rockwell Collins is opening its first engineering design centre outside of the US at Hyderabad in October this year, reports Times of India.  
ARC boosts mobile multimedia SoC design 2008-02-01
ARC International is refining a devt platform that claims to change the way mobile multimedia systems are designed. The company also announced an initiative that offers startups up to Rs.3.95 crore ($1 million) in seed funding.  
Toshiba deploys Cadence ultraslim simulator 2008-01-31
Cadence has announced that Toshiba has deployed its Virtuoso UltraSim full-chip simulator for reliability analysis at 65nm and below to help ensure high performance and improve yield and quality of devices.  
Trio offers UPF-based low-power EDA tools 2008-01-24
Magma, Mentor and Synopsys have developed Accellera?s UPF 1.0 standard-based EDA tools with enhanced key low-power capabilities.  
Xilinx CEO shares his plans, challenges 2008-01-17
Xilinx's new CEO sheds light on his plans in his first year in office, ponders on where the FPGA industry is heading and shares the best advise his predecessor have for him.  
EDA continues its gradual shift out of N. America 2008-01-17
The latest EDAC figures show that chip and electronic design industry is continuing its gradual shift out of N. America. However, most of the EDA revenue continues to come presumably from China and India.  


Max's Cool Beans

Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

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