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EE Times India - total search 17 articles sort by date sort by relevance
LTE: Lacking Test Equipment? 2009-02-26
LTE is next big thing in mobile broadband, but design engineers working on it have their work cut out for them in testing devices and infrastructure.  
Advances in OCT imaging herald medical innovations 2011-06-24
The trend for future generations of OCT medical imaging technology will include portable OCT and the deployment of multi-core DSPs to enable shorter imaging times and higher resolution images.  
Microchip aims to 'elbow out' MCU rivals 2009-04-17
Microchip hopes to expand its product lines amid a growing crisis in the MCU and overall IC supply chain.  
Startup touts all-CMOS, single-die global mobile TV chip 2007-09-21
MediaPhy will sample what it claims as the "all-CMOS, single-die worldwide mobile TV chip" developed by its engg team in India by integrating the RF and baseband sections using a 130nm RF CMOS manufacturing process at TSMC.  
Reduce non-stationary noise in handsets 2008-07-10
A factor affecting voice quality is noise; thus, any means of suppressing noise provides a potential differentiator for handset makers.  
Will WiMAX and LTE camps settle in multi-mode? 2008-06-18
After a couple of years of verbal skirmishing, there are signs that the WiMAX and LTE camps may be seeking a negotiated settlement.  
CEVA DSP core gets ThreadX RTOS support 2010-11-08
Express Logic's ThreadX RTOS now boasts of support for CEVA-TeakLite III DSP core, which is targeted at SoCs in consumer, mobile, networking, and office automation applications.  
Freescale chooses Mentor for AltiVec engine 2011-09-09
Freescale revises AltiVec technology built into its QorIQ AMP series of multi-core processors with Mentor Graphics' software library of advanced mathematical and signal processing functions.  
WiMAX opens range of design options 2005-12-05
There is not one WiMAX market, but a portfolio of distinct niches--each with a different technology or set of requirements.  
Cadence bestows VLSI design awards 2010-11-23
Cadence declared the winners of its fifth annual Design Contest for Bachelor's and Master's level students from institutes that participate in the Cadence University Programme.  
CEVA powers Sunplus Blu-ray SoCs 2009-08-20
Sunplus Technology has tapped the CEVA Inc.'s CEVA-TeakLite-III DSP core for its next generation STB, HDTV and Blu-ray disc chipsets.  
RFEL, RDE offer complex high-speed FPGA 2005-09-19
U.K.-based signal-processing specialist RF Engines Ltd (RFEL) and Germany's leading defense technology company Rheinmetall Defence Electronics (RDE) GmbH have released details of a recently signed contract.  
Instrument developers blend digital, RF test techniques 2007-09-14
Instrument developers are responding to the need for cross-cultural approaches to testing, created by changes in both RF communications and digital bus structures.  
AVLSI Consortium reveals projects underway 2007-04-26
IIT-Kharagpur's AVLSI Consortium met in March to review the status of current projects. EE Times India reports on the areas of industry-academia collaboration under the aegis of the consortium.  
TI unveils floating point DSC for greener industrial apps 2007-10-18
TI released an indigenously developed new floating-point DSC for energy-efficient industrial market at ESC-India.  
Smart antennas enhance 802.11n, mesh networks 2008-03-16
802.11 wireless mesh network technology can help ISPs roll out wireless broadband services with minimal up-front investments. Properly implemented mesh has the capability to self-organise and self-configure.  
Configurable processors reduce power dissipation 2005-11-16
The design of portable and battery-powered products calls for taking a different approach. Read on.  


Max's Cool Beans

Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

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