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Researchers claim cheaper technique to 65nm node 2007-04-03
Researchers at the Georgia Institute of Technology and Focal Point Microsystems announced 3D multi-photon lithography, a technique that claims to enable a cheaper, easier way to pattern at the 65nm node  
Toshiba explores 450mm fab, EUV litho tech 2007-10-08
Apart from exploring several new chip-production tech, Toshiba is also in talks with lithography partner Nikon and ASML Holding NV about the EUV technology  
Opinion: e-beam critical to semiconductor manufacturing 2010-09-23
D2S Inc. CEO Aki Fujimura discusses the role of electron beam lithography in the future of semiconductor manufacturing and is of the opinion that all leading-edge designs will require e-beam technology  
TSMC joins CEA-Leti's IMAGINE programme 2009-07-08
Taiwan Semiconductor Manufacturing Co. and French semiconductor research institute CEA-Leti signed an agreement for TSMC to join a programme assessing maskless lithography for IC manufacturing  
Synopsys, Nikon to develop 45nm solutions 2006-09-22
Synopsys Inc. and Nikon Corp. have joined forces to develop and deliver advanced lithography software models and DFM-enabled lithography manufacturing solutions for 45nm and below  
Experts express doubts about next-gen litho 2009-03-02
Next-generation lithography (NGL) technologies like EUV, maskless nanoimprint and advanced double-patterning continue to face a lot of difficulties, according to a panel at the SPIE Advanced Lithography conference  
Nikon dismisses report on EUV delay 2009-05-20
Responding to an analyst, Nikon says that its EUV lithography programme is still alive and well  
Vienna to host nano-imprint litho seminar 2005-09-12
Photomask vendor Photronics has said it will host a seminar on nano-imprint lithography during the Micro- and Nanoengineering Conference in Vienna, Austria, on Sept. 21  
Soaring prices hinder Canon's litho dreams 2009-09-23
The end could be near for Canon Inc.'s lithography efforts, as the company is reportedly mulling plans to cease future, high-end scanner development, according to sources  
Is TSMC switching to Nikon? 2010-01-08
In a surprise move, TSMC has procured a new 193nm immersion lithography scanner from rival Nikon Corp., according to sources  
Nissan Chemical, Sematech join forces on EUV research 2011-01-13
Nissan Chemical and Sematech have joined forces to cooperate on advanced adhesion enhancing materials in extreme UV lithography for 22nm chips  
EUV light source achieves breakthrough output 2010-04-28
Japan's Extreme Ultraviolet Lithography System Development Association (EUVA) claims to have achieved the highest output for EUV light source at 104W  
EVG, IME partner on TSV process for 3D IC 2010-07-13
This joint development is set to enhance IME's 3D IC research and development capabilities in wafer bonding, lithography and chip stacking for 200-mm and 300-mm through-silicon via (TSV) process development  
Nikon outlines litho plan 2010-03-02
Nikon outlined its lithography roadmap that includes a revised roadmap for extreme ultraviolet (EUV) lithography  
Intel plans inverse litho due to EUV delay 2007-06-25
With the possible delay of its extreme ultraviolet lithography, Intel disclosed that it is developing a DFM technology that could extend optical scanners to the 22nm node  
TSMC reveals litho roadmap at SPIE conference 2009-03-03
TSMC has disclosed its lithography roadmap at the SPIE Advanced Lithography conference, saying it is still backing maskless technology  
Analyst: ASML, Nikon to share 22nm litho biz 2010-03-23
At 22nm, Intel will continue to use 193nm immersion lithography from two suppliers as per Arete Research analyst Jagadish Iyer  
CEA-Leti welcomes ST to e-beam litho programme 2010-01-21
The programme allows companies to assess a maskless lithography infrastructure for IC manufacturing and the use of Mapper Technology for high-throughput  
Intel takes 193nm litho to 15nm 2009-06-23
Intel claims that it has pushed 193nm immersion lithography down to 15nm—at least in the lab  
Photoresist market gets boost from litho tools 2009-04-28
The trend towards advanced 193nm DUV lithography tools is affecting the market shares of photoresist suppliers  
Canon keeps mum on litho nanoimprint 2010-03-18
An analyst believes that Canon's 'great white hope' in lithography rests with an undisclosed relationship with nanoimprint lithography vendor Molecular Imprints Inc  
ASML pushes EUV litho for 2012 2009-10-12
ASML offered a rough road map for extreme ultraviolet (EUV) lithography systems that could be ready for commercial use in late 2012  
Toshiba, AIST team to up accuracy of optical litho 2010-02-24
Toshiba and the AIST have partnered to jointly develop a mask pattern optimising technology that improves the accuracy of lithography for LSIs by approximately 20 per cent  
Litho woes pulling down semicon industry 2007-04-16
The lithography world has suddenly turned upside-down as the industry gets socked by a double whammy: The window of opportunity is slowly closing on EUV lithography for IC production, but the most likely alternative—a version of 193nm immersion—is proving expensive  
Nikon vows comeback with double-patterning 2009-12-15
Nikon Corp. plans to regain share in the lithography market with in the upcoming double-patterning era  
Sun critiques NAND flash industry 2009-08-18
Sun Microsystems Inc. Michael Cornwell technologist scolded the NAND flash industry, saying vendors are ignoring the needs of the enterprise and moving towards the "lithography death march  
ASML, Nikon tie in litho equipment market 2005-12-14
For 2005, preliminary data indicates that ASML of the Netherlands will retain the lead in revenues with a 53.2 per cent share of the Rs.2,20,08 crores ($4.8 billion) market for new lithography tools, up from a 50.3 per cent share in 2004, according to The Information Network  
EUV delay makes alternatives a reality 2010-03-01
EUV lithography is delayed again and is now targeted for chip production at the 16nm half-pitch node, leaving the industry to face the dreaded double-patterning or some variation of the technology  
Sematech shows progress on EUV at 22 nm 2008-08-14
Sematech demo a way of using EUV lithography to define silicon devices with a half-pitch resolution of 22 nm  
IBM, Toppan focus on ArF immersion litho for 14nm 2011-01-20
IBM and Toppan Printing Co. Ltd of Japan will focus their joint development efforts on ArF immersion lithography for the 14nm logic technology node  


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