| NEC's 55nm process reduces power consumption
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2005-12-07 |
| NEC has developed a 55nm node process named UX7LS that will employ immersion lithography and higher dielectric constant (high-k) material |
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| Intel faces more obstacles in EUV litho
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2009-02-25 |
| ...We are pushing hard on EUV," said Intel's director of lithography. But the chip giant sees more "technical gaps" in the technology |
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| Nikon to ship two prototype EUV tools to Intel, Selete
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2007-02-28 |
| Nikon Corp. here outlined its roadmap in the extreme ultraviolet (EUV) lithography arena and disclosed plans to ship two prototype tools by year's end |
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| Intel Capital invests in EUV source venture
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2006-01-27 |
| Seeking to accelerate the development of extreme ultraviolet lithography, Intel Capital has invested in Germany's Xtreme Technologies |
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| E-beam direct-write litho to be here only by 2015
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2010-03-12 |
| Even with multiple development efforts on e-beam direct-write lithography underway, one prominent lithography researcher warns that production tools are still a minimum of five years away |
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| Litho vendors hit by R&D gap, lousy economy
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2009-03-06 |
| The lithography industry continues to be plagued by an R&D gap, technology delays, and, of course, the lousy economy |
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| IBM: Expect design rule explosion beyond 22nm
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2010-04-12 |
| IBM researcher Kevin Nowka described the physical design challenges beyond the 22nm node, emphasizing that sub-wavelength lithography has made silicon image fidelity a serious challenge |
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| NAND suppliers: Litho bars NAND scaling
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2007-08-24 |
| Lithography vendors, according to NAND flash suppliers, cannot keep up with the breakneck pace of NAND, which is leading the process-technology curve in semiconductors |
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| 22-nm SRAM cells made with EUV litho
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2009-04-27 |
| IMEC has presented the first functional 22-nm CMOS SRAM cells made using EUV lithography |
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| PrimeYield LCC enables litho-clean tapeout
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2008-03-05 |
| Synopsys, Inc has announced that LGE has successfully discovered and fixed lithography hotspots in its HDTV application chipset using Synopsys' PrimeYield LCC |
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Anticipating nanometer design issues
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2005-11-16 |
| Manage a growing array of issues arising from the use of nanometer process technology and subwavelength lithography |
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| Researchers score advances in nanowire research for litho replacement
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2007-04-02 |
| HP Lab and a trio of academic labs have scored advances that will make it easier to use nanowires as a replacement for lithography in semiconductor manufacturing, potentially taking chipmaking to the angstrom scale |
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| AMD, IBM announce results of 45nm IC project
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2006-12-14 |
| IBM and AMD have announced the early results of the use of immersion lithography, ultralow-K interconnect dielectrics and multiple enhanced transistor strain techniques on 45nm microprocessor process generation, at the International Electron Device Meeting early this week |
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| Nikon opens litho training center
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2005-11-22 |
| Nikon Corp. has officially opened a new lithography-tool training center in California |
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| EUV photoresist developed for 20nm
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2009-11-19 |
| Toshiba Corp. touts a photoresist suitable for use with EUV lithography and proved its viability in the first 20nm generation process technology |
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| Luminescent gains litho win with SMIC
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2005-10-07 |
| Chinese foundry Semiconductor Manufacturing International Corp. is to evaluate Inverse Lithography Technology (ILT) products from Luminescent Technologies Inc., a provider of lithography enhancement systems for 65-nanometer and more advance manufacturing processes |
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| E-Shuttle explores use of maskless tools
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2008-06-03 |
| E-Shuttle Inc. is exploring the future use of next-generation maskless tools from Mapper Lithography NV |
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| Analysts see further delay in 450mm, EUV, TSVs
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2010-01-25 |
| IC Insights forecasts more delays for two emerging and key IC manufacturing technologies: 450mm and extreme ultraviolet (EUV) lithography |
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| U.K. researchers refine LED manufacturing process
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2008-01-09 |
| Researchers at Glasgow University have used nanoimprint lithography to directly imprint the holes onto the LEDs, which they claim could make way for the solid-state light to replace incandescent light-bulb within three years |
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| R&D consortia remain vital in IC equipment growth
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2009-09-10 |
| Chip equipment R&D spending is set to be slashed, with an Rs.38,891.69 crore decline seen over the next five years, according to market tracker Gartner. |
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| SoC devt in 45nm: Challenges, opportunities for Indian engineers
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2008-11-10 |
| Indian engineers need to develop holistic system-level approaches for tackling complex 45nm issues. Skills need to be broadened to include virtual prototyping, IP modelling and manufacturing-aware design, in addition to RTL2GDS. |
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| Fab tool vendors expect challenging year
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2008-01-21 |
| Fab-tool vendors expect challenging year for the semiconductor equipment industry. |
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| Aprio, Pyxis collaborate on DFM routing technology
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2006-07-11 |
| Aprio Technologies Inc. and Pyxis Technology has announced the integration of Aprio's Halo-Quest and associated DFM View into the DFM-routing technology from Pyxis. |
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| eBeam initiative signs up six more members
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2010-03-01 |
| eBeam Initiative adds six members into its fold including GlobalFoundries and Samsung Electronics. |
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| Intel delays EUV litho
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2010-02-25 |
| Intel Corp.'s yet again delays it extreme ultraviolet (EUV) plans in favour of extending its 193nm immersion to the 11nm logic node. |
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| Samsung, TSMC tip breakthroughs at ISSM
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2005-09-09 |
| At next week's International Symposium on Semiconductor Manufacturing (ISSM), Samsung, Taiwan Semiconductor Mfg Corp. and other leading-edge chip makers are expected to disclose at least some of the secrets behind their respective semiconductor manufacturing efforts. |
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| Sematech seeks collaboration, looks into fabless
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2009-11-30 |
| Sematech is exploring options to attract fabless companies into the fold and is hoping to expand its collaborative efforts with fab tool makers, |
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| Opinion: Fab automation crisis
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2009-05-26 |
| This is the worst downturn in the history of semiconductor equipment. Most would agree about that but what individual sector is the worst? |
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| ITRI's 3D consortium welcomes SUSS MicroTec
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2009-10-01 |
| SUSS MicroTec pitches its 300mm technology to the Advanced Stacked-System Technology and Application Consortium. |
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| ASML, TEL join hands on advanced litho tools
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2006-12-07 |
| Tokyo Electron Ltd (TEL) and ASML Holding NV are joining forces to develop next generation R&D and manufacturing tools. As a first step, the companies will optimise equipment performance for R&D and high-volume production for 45nm and future technology node processes. |
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