| 450mm debate rages on
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2008-07-21 |
| Fab-tool vendors telegraphed their position on 450mm, reiterating that the economics do not add up for the next-generation wafer size. |
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| Freescale exec: Simplify design complexity
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2009-02-25 |
| Freescale Semiconductor's Lisa Su expects a troubling trend if design complexity is not simplified. |
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| IC forecasts: 10 reasons to cheer or fear
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2010-03-24 |
| Although the chip sector seems to be on the up this year, there are still some concerns. Here are 10 reasons to cheer—and fear—about 2010. |
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| EUV litho for 22nm unlikely to take-off
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2010-06-14 |
| EUV comes closer to the technical specifications that would allow high volume manufacturing but its arrival time is unlikely to benefit the mass production of the 22nm node. |
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| Nanoimprint for HDDs still under wraps
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2010-03-04 |
| While nanoimprint has still not emerged in mainstream production in semiconductor fabs, the technology has been delayed even in perhaps its biggest potential market: HDDs. |
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| Logic chipmakers seek 32nm manufacturing breakthroughs
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2007-02-02 |
| Leading-edge logic chipmakers are scrambling to find manufacturing breakthroughs for the 32nm node and beyond. |
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| Novellus' CEO: IC market rebounds on real demand
|
2010-04-27 |
| The IC industry is set for a new and healthy three-to-four year growth cycle, according to Novellus CEO Rick Hill. |
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| GlobalFoundries, Mentor Graphics advance ICs
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2009-10-21 |
| Mentor Graphics has announced a multi-year EDA tools software and services agreement with GlobalFoundries. |
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| Cadence announces design tech for faster IC production
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2007-09-13 |
| Cadence has announced model-based, variation-aware design technologies that accelerates time-to-volume for advanced ICs and provides 'WYDIWYG' capability. |
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| ST unveils low-power 45nm CMOS platform
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2007-06-15 |
| STMicroelectronics has unveiled details of its 45nm CMOS design platform that has already been used to tape-out the design of a highly integrated 45nm demonstrator SoC device. |
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| Exec lists hurdles to fab tool recovery
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2010-01-14 |
| Here is the list of challenges for tool vendors as seen by Norm Armour, VP and general manager for Fab 2 at foundry upstart GlobalFoundries Inc at SEMI's Industry Strategy Symposium (ISS. |
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| EUV not ready for 22-nm node
|
2009-01-15 |
| EUV continues to suffer from reliability issues, lack of sources and other problems. |
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| Report: Samsung monopolises ASML litho supply
|
2010-02-15 |
| Samsung is monopolizing ASML Holding NV's supply chain by procuring a slew of 193nm scanners . |
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| Stencil technology unveiled for maskless SoC
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2009-10-06 |
| D2S' packed stencil technology furthers the eBeam Initiative's drive for design-to-manufacturing. |
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| HP to utilise silicon photonics on chip
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2008-05-16 |
| HP intends to use silicon photonics to connect blades, boards, chips and cores on the same chip. |
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| What to sort out in electronics in 2010
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2010-01-05 |
| EE Times editors list nettlesome issues they'd most like to see electronics engineers fix next year ranging from grand challenges of engineering to niggling nettles of consumer gadgetry. |
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| NEC, NEC Electronics unveil high-k CMOS tech
|
2006-06-26 |
| NEC Electronics and NEC have introduced a CMOS technology for system LSIs using design rules for 55nm and below. |
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| AMD, IBM move forward with EUV despite tool delay
|
2009-02-26 |
| AMD, IBM and others are pushing their efforts in EUV, developing a 22nm "test chip," with plans to do the same at the 15nm node. |
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| HP licenses nanoscale technology
|
2007-05-04 |
| Hewlett-Packard announced that it is licensing a technology that could enable a more powerful fabrication of semiconductor chips. |
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| Stanford dean provides CMOS, education outlook
|
2010-06-28 |
| James Plummer, dean of Stanford's school of engineering talks about the outlook for CMOS, engineering, education and globalisation. |
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| Team-up to develop co-optimised design solutions
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2009-02-27 |
| TSMC and Tela will also enhance the PowerTrim Service based on Blaze DFM's patented gate CD biasing technology. |
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| Nikon puts EUV litho on hold
|
2009-05-19 |
| Nikon's decision to delay the development of its EUV tools could give ASML a huge advantage. |
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| TSMC moves from 28nm to 20nm half-node
|
2010-04-15 |
| Taiwan Semiconductor Manufacturing Co. Ltd will give the 22nm "full node" a miss by moving on directly to the 20nm "half node" from the 28nm node. |
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| Are memristors ready for take-off?
|
2008-09-03 |
| With memristors, HP believes it has the right mix to leapfrog flash and other alternative memory technologies. |
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| TSMC plans 45nm wafers by Q3' 07
|
2007-05-16 |
| The 45nm foundry race could prove to be a painful and costly transition for foundry customers. |
|
| iPad 2 affected by supply chain disruptions
|
2011-03-22 |
| Problems with power supply, transportation etc. will disrupt iPad 2 production following the Japan quake, according to IHS iSuppli. |
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| Road map rethinks process reductions
|
2005-09-01 |
| The ITRS draft scraps nodes and embraces 'cycles' for more incremental transitions. |
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| Hynix joins IMEC's 32nm efforts
|
2007-05-28 |
| Hynix has collaborated with European research centre IMEC to tackle memory challenges at the 32nm and below process nodes. |
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| Mentor CEO contests pessimism in EDA
|
2009-02-06 |
| In a recently delivered speech, Walden Rhines of Mentor Graphics pointed to a bright future for EDA, despite the doom-and-gloom that surrounds the industry. |
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| Imec 'IBC' Si solar cells exceed 23% efficiency
|
2011-12-05 |
| Imec develops a high-efficiency baseline process for small-area interdigitated back contacts cells that aims at increasing the efficiency well above 20%. |
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Strange modes of transport and other "stuff"
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