| Mentor, ST partner on 32/20nm design solutions
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2010-03-19 |
| Mentor Graphics Corp. and STMicroelectronics have entered a broad-scoped collaboration three-year project, named DeCADE, to build on advanced design solutions for SoC development for digital and analogue design |
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| FormFactor opens wafer probe card facility
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2010-03-17 |
| FormFactor Inc. new manufacturing capability in Singapore is targeted to reduce product cycle times, and to diversify supply of the company's product components. |
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| Broadcom pushes Bluetooth for health devices
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2010-03-12 |
| Broadcom is expanding the Bluetooth ecosystem by including the Bluetooth Health Devices Profile (HDP) to its portfolio of Bluetooth SoC to enable mobile health devices |
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| Analysis: Why Atom-based SoCs are not hot?
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2010-03-03 |
| You would think an x86 core would be selling like hot cakes for a SoC design but it seems that no one is taking up Intel's offer to sell rights to an Atom core for SoCs made at TSMC |
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| Intel, TSMC Atom partnership hits a roadblock
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2010-03-02 |
| Intel has no immediate plans to bring to market any Atom chips manufactured by TSMC, confirming a report that their partnership has hit a roadblock. |
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| Open-Silicon, Virage team on low-power silicon
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2010-02-23 |
| Open-Silicon Inc. and Virage Logic are teaming up to enable the development of significantly lower-power silicon. |
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| Soitec mass produces SOI substrates for cell phones
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2010-02-22 |
| Soitec has fine tuned its HR-SOI process to stabilise the base wafer resistivity in order to meet all cellular electrical specifications and will now commence volume production of the SOI substrates. |
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| ArrayComm, CEVA team on LTE solution
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2010-02-18 |
| ArrayComm LLC and CEVA Inc. offer pre-optimised package of ArrayComm's full LTE eNodeB PHY on the CEVA-XC DSP core enables SoC developers to reduce programme costs and time to market |
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| GlobalFoundries, ARM offer 28nm process for wireless apps
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2010-02-18 |
| GlobalFoundries Inc. and ARM Holdings plc have detailed two 28nm manufacturing process technologies for wireless products. |
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| Infineon exec addresses IDM challenges in wireless sector
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2010-02-02 |
| At the recently-held VLSI conference, Hermann Eul, member of the management board, Infineon Technologies AG Deep delivered his keynote on deep sub-micron CMOS technology. |
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| ST owns iPad trademark
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2010-02-02 |
| French newspaper La Tribune reported that STMicroelectronics owns a registered trademark on "iPad," the same name Apple Inc. gave to the much-hyped tablet-style computer. |
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| ROHM licenses MoSys 1T-SRAM tech
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2010-02-02 |
| ROHM Co. Ltd has signed a major technology licence agreement for MoSys' 1T-SRAM embedded memory technology. |
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| Apple unveils iPad tablet
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2010-01-29 |
| Apple Inc. CEO Steve Jobs finally unveiled the much-awaited iPad, a tablet-style mobile computer, thinner and lighter than any laptop or netbook. |
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| Consultant pushes for international EDA roadmap
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2010-01-22 |
| Joseph Borel, ex-executive VP in central R&D at STMicroelectronics NV confirms that the EDA industry has a roadmap, but poses the question whether the EDA industry needs an international one. |
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| Role of VLSI in SATCOM applications
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2010-01-20 |
| K.S.Dasgupta from DECU, ISRO, highlighted VLSI's role in making better on-board satellite apps, ground systems and tele-medicine. |
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