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EE Times India - total search 551 articles sort by date sort by relevance
Mentor, ST partner on 32/20nm design solutions 2010-03-19
Mentor Graphics Corp. and STMicroelectronics have entered a broad-scoped collaboration three-year project, named DeCADE, to build on advanced design solutions for SoC development for digital and analogue design  
FormFactor opens wafer probe card facility 2010-03-17
FormFactor Inc. new manufacturing capability in Singapore is targeted to reduce product cycle times, and to diversify supply of the company's product components.  
Broadcom pushes Bluetooth for health devices 2010-03-12
Broadcom is expanding the Bluetooth ecosystem by including the Bluetooth Health Devices Profile (HDP) to its portfolio of Bluetooth SoC to enable mobile health devices  
Analysis: Why Atom-based SoCs are not hot? 2010-03-03
You would think an x86 core would be selling like hot cakes for a SoC design but it seems that no one is taking up Intel's offer to sell rights to an Atom core for SoCs made at TSMC  
Intel, TSMC Atom partnership hits a roadblock 2010-03-02
Intel has no immediate plans to bring to market any Atom chips manufactured by TSMC, confirming a report that their partnership has hit a roadblock.  
Open-Silicon, Virage team on low-power silicon 2010-02-23
Open-Silicon Inc. and Virage Logic are teaming up to enable the development of significantly lower-power silicon.  
Soitec mass produces SOI substrates for cell phones 2010-02-22
Soitec has fine tuned its HR-SOI process to stabilise the base wafer resistivity in order to meet all cellular electrical specifications and will now commence volume production of the SOI substrates.  
ArrayComm, CEVA team on LTE solution 2010-02-18
ArrayComm LLC and CEVA Inc. offer pre-optimised package of ArrayComm's full LTE eNodeB PHY on the CEVA-XC DSP core enables SoC developers to reduce programme costs and time to market  
GlobalFoundries, ARM offer 28nm process for wireless apps 2010-02-18
GlobalFoundries Inc. and ARM Holdings plc have detailed two 28nm manufacturing process technologies for wireless products.  
Infineon exec addresses IDM challenges in wireless sector 2010-02-02
At the recently-held VLSI conference, Hermann Eul, member of the management board, Infineon Technologies AG Deep delivered his keynote on deep sub-micron CMOS technology.  
ST owns iPad trademark 2010-02-02
French newspaper La Tribune reported that STMicroelectronics owns a registered trademark on "iPad," the same name Apple Inc. gave to the much-hyped tablet-style computer.  
ROHM licenses MoSys 1T-SRAM tech 2010-02-02
ROHM Co. Ltd has signed a major technology licence agreement for MoSys' 1T-SRAM embedded memory technology.  
Apple unveils iPad tablet 2010-01-29
Apple Inc. CEO Steve Jobs finally unveiled the much-awaited iPad, a tablet-style mobile computer, thinner and lighter than any laptop or netbook.  
Consultant pushes for international EDA roadmap 2010-01-22
Joseph Borel, ex-executive VP in central R&D at STMicroelectronics NV confirms that the EDA industry has a roadmap, but poses the question whether the EDA industry needs an international one.  
Role of VLSI in SATCOM applications 2010-01-20
K.S.Dasgupta from DECU, ISRO, highlighted VLSI's role in making better on-board satellite apps, ground systems and tele-medicine.  


 
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