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EE Times India - total search 109 articles sort by date sort by relevance
Industry joins forces for network test, automation 2010-03-18
Communications and networking companies have formed Network Test Automation Forum (NTAF) to promote interoperability between test tools and to simplify lab automation efforts  
Sanyo adopts DFT MAX to improve test quality 2006-11-24
Synopsys Inc. has announced that Sanyo Semiconductor Co. Ltd has adopted the Synopsys DFT MAX scan compression automation solution to further increase the test quality of its digital designs  
Industry tackles approach to DFM, DFY issues 2007-06-18
Experts from chip, EDA and foundry companies ask whether it's better to deal with DFM and DFY issues at tape-out or minister to the design starting at the register transfer level.  
Magma preps DAC demonstrations 2006-07-18
Magma will demonstrate the capabilities of its Talus IC implementation system, methods for minimizing power consumption, and DFM capabilities integrated in the design flow at next week's DAC.  
Silicon Image picks Agilent's equipment for HDMI testing 2007-01-29
Silicon Image Inc. has selected Agilent Technologies's equipment for HDMI CTS 1.3a source and sink compliance testing and characterisation in its HDMI Authorised Test Centre  
Agilent, Sequans agreement supports mobile WiMAX equipments 2007-05-28
Agilent and Sequans Communications has collaborated to work on pre-validating the Agilent PCT system, and on the speed-optimisation of RF power-calibration and production-test systems for both fixed and mobile WiMAX modules  
LTE: next stage of WCDMA air interface? 2007-04-16
The test-and-measurement community must help ensure a smooth migration to LTE so that pitfalls associated with past rollouts of next-gen cellular networks can be avoided  
NTAF releases network interoperability specs 2011-06-10
The NTAF releases the first set of specifications that will enable software and hardware from multiple vendors to automatically and seamlessly recognise and communicate with each other in network test labs  
Future of EDA industry not too bright, says Magma exec 2006-11-13
The future of the EDA industry is not too bright, unless it enables chip design of even greater complexity with fewer engineers, thus helping the IC industry deal with the problem of lower profitability.  
Rohde & Schwarz T&M portfolio speeds up LTE rollout 2011-02-18
Rohde & Schwarz presents a wide portfolio of T&M equipment at the Mobile World Congress in Barcelona to aid the rapid deployment of LTE-FDD and TD-LTE.  
Magma licenses ATPG to LogicVision 2009-02-10
The agreement enables LogicVision to accelerate the expansion of its product portfolio.  
SEMI releases 11 tech standards 2007-02-20
SEMI has published 11 technical standards for the semiconductor, flat panel display and MEMS manufacturing industries. The new standards include a guide for equipment data acquisition, a test method for evaluation of line-edge roughness and linewidth roughness, and a communications specification for the MECHATROLINK protocol  
MindTree adopts Mentor's verification platform 2010-06-29
MindTree has joined Mentor Graphics' Questa Vanguard Programme and adopted a verification flow based on Mentor's Questa functional verification platform and the Open Verification Methodology.  
Chip designers satisfied with IC verification environments 2006-12-21
Sixty per cent of chip designers say they are satisfied with their IC verification environments according to a survey of more than 600 engineers sponsored by hardware-assisted verification provider EVE.  
Midsize motherboards diversify 2008-06-02
Midsize motherboards diversify, ranging from about 40-50-inch2, the activity centers primarily on 6.7-inch x 6.7-inch Mini-ITX and 5.75-inch x 8-inch EBX motherboards.  
India rushes to the frontline 2005-09-07
India has long remained in the shadows of the global economy, but this year, the rigid nation's economic growth rate is one the fastest in the world. In-Stat projects India's electronics market to grow at a CAGR of 23 percent to reach $40 billion in value by 2010.  
Analysis: Is fab tool downturn over? 2010-01-08
Is the fab tool downturn over? Due to a resurgence in the memory chip market and increased spending by foundries, semiconductor industry capital spending will reach nearly Rs.156,854.47 crore this year.  
IBM targets Rs.11,000 crore Indian cloud market 2011-06-01
IBM Corp. launches the SmartCloud Enterprise aimed at this year's Rs.2,232.14 crore ($500 million) Indian public cloud market as well as the projected Rs.11,160.71 crore ($2.5 billion) market in 2015.  
IC tool makers reluctant to gear up for 450mm wafers 2007-07-25
The semiconductor equipment community and chipmakers are debating over the funding of next-generation fab tools, driven by Sematech's plan to hasten the industry's move to 450mm wafers.  
Mentor Graphics provides memory test soln for ARM cores 2010-11-09
Mentor Graphics Corp. has teamed up with ARM to provide an automated memory test and repair solution for ARM embedded memories and processor cores  
Agitar opens India unit in Bangalore 2006-08-09
Agitar Software has set up a unit in India called Agitar Software India Pvt. Ltd headquartered in Bangalore.  
Magma, Chengdu ICC open joint IC design lab 2010-03-15
Magma Design Automation and Chengdu ICC (CDICC), have established a joint IC design lab to help IC design companies meet the demands of the international semiconductor market  
NI shops with Rs.429 crore to build RF portfolio 2011-05-25
National Instruments plans expanding its platform into the RF domain with agreements to acquire AWR, a high-frequency EDA supplier, and Phase Matrix, an RF/microwave components and software vendor.  
ISA, Cadence discuss low power design 2006-12-20
India Semiconductor Association (ISA) organised a panel discussion on low power design on December 12, at the Leela Palace Bangalore, in collaboration with Cadence Design Systems Inc.  
SystemC TLM standard released for public review 2006-12-08
Taking a step towards the interoperability of SystemC transaction-level models, the Open SystemC Initiative (OSCI) has released a draft SystemC Transaction-Level Modelling (TLM) 2.0 kit for public review. A public review period extends through February 2007.  
Radio waves deliver X-ray vision 2009-10-29
Radio tomographic imaging with radio transmitters can track people moving behind solid walls and this can be used as a basis for safety, tracking and alarm systems.  
Agilent, Innowireless partner on LTE 2010-05-13
The partnership will strengthen Agilent's leadership position in LTE test and measurement  
SoftMEM's tools add MEMS to EDA software 2007-07-03
SoftMEM's toolsets, when integrated with existing EDA tool sets, enables EEs to co-design electronics-with-MEMS chips without having to have the deep MEMS knowledge of a guru.  
Atrenta to visit India for design closure seminar 2009-01-15
Atrenta Inc. has announced a worldwide Design Closure Stimulus Package seminar series.  
PV solar power systems to become cheaper 2011-08-22
Fraunhofer researchers will present new methods for making solar cells cheaper and more efficient at the European Photovoltaic Solar Energy Conference, in Hall B4G, Stand C12 from September 5-9 in Hamburg.  


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Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

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