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EE Times India - total search 16 articles sort by date sort by relevance

Too many analogue foundries	2008-12-29
The odds for analogue foundries' survival aren't looking good as vendors face an IC market downturn.
ST-Ericsson lists mobile handset trends for 2010	2010-02-16
In an exclusive with EE Times, ST-Ericsson senior VP and head of strategic planning Edgar Auslander lists what the company believes are the main mobile handset trends for 2010.
Pulsic lyric router integrated in AWR design suite	2006-07-24
Applied Wave Research and Pulsic have announced that Pulsic's Lyric Automatic Routing system is now integrated into AWR's Analogue OfficeR 2006 design suite for analogue and RFIC design.
ST exec set to pilot European Platform on Smart Systems	2010-10-15
Carmelo Papa, the executive VP and general manager of ST's Industrial and Multisegment Sector, will hold the reins of European Platform on Smart Systems (EPoSS) as its chairman. Carmelo Papa, the executive VP and general manager of STMicroelectronics ST's Industrial and Multisegment Sector, will hold the reins of the European Platform on Smart Systems (EPoSS)as its chairman. He was chosen at the EPoSS General Assembly and Annual Forum, held October 7-8 at the Instituto Superior Tecnico in Lisbon, Portugal.
European firms bond on greener electronics	2010-06-17
European IC and electronic firms have bonded on the ENIAC project that is designed to enhance their competitiveness in developing new products and technologies that are at the forefront of energy efficiency.
IBM, ST team on next-gen process tech	2007-07-26
ST-IBM collaboration on the dvlt of next-gen process tech will give them technical solutions to address and conquer the strategic challenges and ensure time to market of competitive products.
TSMC moves to 28nm with SRAM cell	2009-06-19
TSMC claims it has developed the first functional 64-Mbit SRAM cell, based on its 28nm technology.
UWB teams up with PCIe	2007-11-01
The convergence of UWB and PCIe in the notebook will drive high-performance wireless connections for PANs and other short-distance I/O applications. This article examines the trends.
Infineon exec addresses IDM challenges in wireless sector	2010-02-02
At the recently-held VLSI conference, Hermann Eul, member of the management board, Infineon Technologies AG Deep delivered his keynote on deep sub-micron CMOS technology.
Ansoft simulation software accepted into Cadence Program	2006-07-12
Ansoft Corp. has announced that its Nexxim, the company's circuit simulation software for high-performance IC design and signal-integrity analysis, has been accepted into Cadence's Connections Program.
Cadence CEO discusses emerging trends in semicon design	2006-12-06
Michael J. Fister, president and CEO, Cadence Design Systems Inc., says that's as design complexity across custom ICs, digital ICs, PCB and packaging increases, a holistic level of capabilities are now required from semiconductor design and EDA companies alike.
AltaSens opts Berkeley's software for HD sensors	2011-12-02
AltaSens adopts Berkeley's AFS platform to design its HD CMOS image sensors.
TI's Omap processor gets break in Moto design win	2007-03-16
Motorola and TI recently inked a deal to expand their 3G and WiMAX collaborations—a move that should resuscitate TI's Omap base band processor family.
VCs puzzled over future investments	2009-04-22
Xilinx CEO Moshe Gavrielov said it was all over: Venture capital would not return to the semiconductor industry.
TSMC boosts R&D efforts	2009-06-08
TSMC is appealing to other integrated device makers and other stakeholders to share in R&D costs.
Low-power radio chip mimics human ear	2009-06-08
MIT's RF cochlea could enable wireless devices capable of receiving cell phone, Internet, radio and television signals.

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