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EE Times India - total search 254 articles sort by date sort by relevance
LTE antenna sol'n offers 2.5x faster 4G data rates 2010-03-09
SkyCross has combined its patented iMAT antenna technology for LTE to offer 2.5x faster 4G data rates, supports legacy wireless protocols and a small footprint.  
Single-feed MTM antenna integrates multiple bands 2010-03-08
Rayspan Corp. debuts single-antenna solution based on metamaterials (MTM) that integrates LTE, 3G, Bluetooth and GPS for mobile devices  
Power amp targets TD-SCDMA handsets 2010-03-03
The RF7234 and RF3266 PAs expand an industry-leading 3G product portfolio that accommodates all major RF architectures  
Power amp enables low battery current for 3G 2010-03-01
The Javelin JAV5001 power amplifier integrates complete circuitry for power regulation, PA bias, input and output matching and power control into a tiny 3mm x 3mm package.  
Smartphone HSPA+ sol'n measures < 600mm2 2010-02-26
Infineon has unveiled the XMM6260 platform an addition to its 3G slim-modem family which it touts is the smallest HSPA+ solution for 3G smart phones  
GPS receiver offers PCB footprint of 30mm² 2010-02-24
Broadcom Corp. has unveiled its single-chip GPS solution for mobile devices that is said to set new standards in performance and low power consumption.  
Multi-mode, multi-band PAs target smart phones, data cards 2010-02-22
Skyworks Solutions Inc.'s highly-integrated multimode power amplifier (PA) modules support up to five W-CDMA bands and are optimised for specific mobile data requirements.  
RF transceiver packs 12bit ADC, DAC 2010-02-19
Lime offers the LMS6002D multiband, multistandard RF transceiver IC that operates at user-selectable frequencies between 375MHz and 4GHz and is suitable for 3G, WiMAX, and LTE operation  
Ref design enables entry-level Android smart phones 2010-02-19
Infineon Technologies AG is offering the XMM6181 that offers OS support for Android and smart phone functionality for handsets with wholesale prices of between Rs.4,617.70 -Rs.6,926.55 ($100 -150).  
RF switches enable low-cost 3G smart phones 2010-02-19
RF Micro Devices has successfully qualified and released its first high-power RF CMOS switch using high-resistivity silicon substrates for next-generation 3G and 4G smart phones  
Android platform enables mass production of smart phones 2010-02-17
ST-Ericsson's debuts the U6715, Android platform that promises to significantly broaden the smart phone segment, making these advanced and customisable handsets affordable for the mass market.  
Multiprotocol LCP SoC eases migration to IP-based networks 2010-02-16
LSI Corp. has launched its next-generation link communication processor (LCP) d that enables any-to-any communications in wireless infrastructure.  
LTE UE cuts time-to-market for terminal devices 2010-02-09
Tata Elxsi debuts its 3GPP release 8-compliant LTE UE (User Equipment) protocol stack which enables reduced time-to-market of LTE terminal devices and silicon solutions.  
Single-chip transceiver delivers autodirection output 2010-01-22
Maxim Integrated Products has developed a single-chip fully-integrated AISG-compliant transceiver MAX9947 that packs a transmitter, receiver, and active filters into a 3mm x 3mm TQFN package.  
Smallest UARTs extend battery life in portable apps 2010-01-19
The tiny SPI/I²C UART promises cuts in space, power, cost  


 
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