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EE Times India - total search 104 articles sort by date sort by relevance

PMC module includes dual Virtex-5 FPGAs	2009-05-21
Pentek has introduced its latest PMC module, the Model 7156 dual channel transceiver.
Sign-off flow shortens design cycle	2009-04-23
TSMC has unveiled a mixed-signal/RF design kit as well as a foundry-specific integrated sign-off flow.
Power, noise integrity platform rolls	2009-04-22
Totem is the first power and noise integrity platform for analogue and mixed-signal designs
Platform delivers faster verification	2009-04-13
Synopsys Inc. has unveiled the latest generation of its Discovery Verification Platform.
Tiny DSCs take digital power to mainstream apps	2009-04-01
Microchip has released the first seven of its next-generation 16-bit dsPIC digital signal controllers.
Broadcom platform enables low-cost IP phones	2009-03-18
Broadcom has announced a scalable IP communications design platform featuring 65nm IP communications processors
Duo develops 45-nm HDMI receiver IP	2009-03-09
The MIPS-NXP partnership has resulted in an HDMI 1.3 receiver core implemented in 45-nm silicon.
Prototyping hardware suite cuts devt time	2009-03-06
National Instruments has introduced a CompactRIO controller and five new FPGA-based chassis.
A/V interface for surveillance systems unveiled	2009-03-03
Gennum has developed an A/V interface for professional and industrial applications such as video security and surveillance systems.
ARM develops low gate-count core for low power apps	2009-02-25
The Cortex-M0 processor core could enable ARM and its licensees to engage in applications reliant on energy efficiency.
Made in India: 802.11n wireless sensor module	2009-02-20
Redpine Signals is now sampling a wireless sensor module that provides all the control and wireless functionality required to build and deploy wireless sensor nodes.
A/D converter IP-cores suit monitoring apps	2009-02-06
Cosmic Circuits has announced its portfolio of more than 20 cores A/D converters for monitoring applications.
16bit MCU extends battery life	2009-02-06
The MAXQ610 extends battery life in low-power apps and operates from a 1.7V to 3.6V voltage range.
ICs answer H.264/AVC compression issues	2008-11-26
From digital TVs to portables, the H.264/AVC next-generation video compression standard is becoming mainstream.
Media processor offers H.264 at D1 resolution	2008-11-20
TI has announced its newest digital media processor based on DaVinci technology, the TMS320DM357.
Start-up rolls spice-accurate analogue simulation	2008-11-04
Gemini Design Automation has unveiled a fast SPICE-accurate simulation technology.
Gemini unveils simulation technology	2008-10-24
Gemini claims to have developed a simulator that achieves breakthroughs in both speed and accuracy.
IP provider is now fabless chip vendor	2008-10-23
Samplify has changed its business model with the announcement of its first silicon products
Mobile WiMax SoC supports three base stations	2008-10-06
Fujitsu's mobile WiMAX base station SoC targets all three base station platforms with a single SoC.
Compass IC features three-axis magnetic sensors	2008-09-29
Honeywell has developed a 3-axis compass IC in a chip-scale package.
EDA platform trims design time in half	2008-09-17
Agilent has introduced SystemVue 2008, an EDA platform for electronic system-level design.
Development kits simplify video equipment design	2008-09-12
National has unveiled the industry's first 3G-SDI and video clocking daughter card development kits.
Cadence addresses issues in IC package, SiP	2008-08-27
The SPB 16.2 due November contains additions focused on addressing current and emerging chip package design challenges.
IP cores suit mobile apps	2008-08-18
MIPS introduced the industry's first 40nm USB PHY IP core and first USB-certified 1.8v 45nm USB PHY IP core
Software radio modules boast speed, accuracy	2008-07-31
Pentek Inc. introduces a new family of rugged software radio modules with its GateFlow FPGA IP cores
IVR system to test VoIP quality of experience	2008-07-15
Integrating Tektronix' IVR system with a service provider's existing customer care system will improve mean time to repair (MTTR).
DECT solution combines DOCSIS 3.0 chipset	2008-05-28
Infineon has released a DECT solution combined with a DOCSIS 3.0 chipset for the deployment of next-generation VoIP services operating over DECT 6.0.
Speakers-on-a-chip target hi-def audio apps	2008-05-26
Conexant Systems introduces a line of speakers-on-a-chip aimed at high-definition audio and voice applications.
Software radio module carries 256 channels	2008-05-08
Pentek has introduced a high performance, high-resolution software radio module that delivers 256 channels.
Synopsys unveils 5 GHZ silicon core	2008-05-01
Synopsys' 5 GHz silicon core for PCI Express 2.0 caught designers' attention after its release.

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EE Times Asia - total search 2 articles

FPGA-based starter kit accelerates design cycle	2010-04-06
Reference design claims lower LCD TV costs	2006-03-10
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