PCB compatibility using ST92185/195 in SDIP42/56 packages
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2004-11-30 |
| This app note explains how to design a PCB to be compatible between ST92185, ST92195 and ST92T195 devices in both SDIP42 & SDIP56 packages |
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TV hardware design rules, PCB compatibility with ST92196/186
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2004-11-30 |
| This app note discusses how to design a PCB between ST92E196 or ST92T196 (SDIP56 package) and ST92186 (SDIP42 and SDIP32 packages) microcontrollers |
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RS232 adapter board for the ACL PCB
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2008-09-03 |
| This document includes the necessary information for the population of the ACL adapter PCB |
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PCB layout of WirelessUSB LP transceiver
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2009-03-31 |
| Here are guidelines for PCB layout design and manufacture of the WirelessUSB LP transceiver chip |
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PCB layout for BGA packages
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2009-07-09 |
| This article provides a brief overview of PCB layout considerations when working with BGA packages |
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Care and handling of axial lead or SM diodes for testing and PCB mounting
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2001-09-11 |
| This application note suggests some guidelines about the proper handling of Microsemi's axial lead or SM diodes for testing and PCB mounting |
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Soldering guidelines for module PCB mounting
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2004-12-03 |
| This app note provides general guidelines for PCB second level interconnect design when assembling with Anadigics' module products |
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| C8051FXXX PCB design notes
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2007-04-27 |
| This application note includes tips and techniques for a successful PCB design. It provides the solution to various design problems such as noisy and distorted analogue measurements, error-prone digital communications, latch-up problems with port pins, excessive EMI, and other undesirable system behaviour |
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Simple Switcher PCB Layout Guidelines
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2002-11-08 |
| This application note discusses quick-set rules for simple switcher PCB layout |
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STMPE811 PCB design guideline
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2009-09-18 |
| This application note provides information on the design of a PCB for the STMPE811 touchscreen controller, the power connection, routing of the touchscreen tracks and the configuration of some pins |
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Soldering the QFN stacked die sensors to a PCB
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2010-02-12 |
| This application note aims to describe suggested methods of soldering sensor QFN devices to a PCB for both automotive and consumer applications |
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Optimum PCB and stencil layout for leadframe MLPs
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2001-06-04 |
| This application note details the proper guidelines for the layout of a PCB and stencil for a 6-by-4mm MLP (M/A-COM Leadless Package |
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| Four- and six-layer, high-speed PCB design for the Spartan-3E FT256 BGA package
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2007-04-27 |
| This application note focuses on a low-cost, four- to six-layer, high-volume PCB layout for a Spartan-3E FPGA in the FT256 1mm BGA package. Useful for design engineers, managers and PCB layout staff familiar with SI related design issues, this note also reviews the impact of high-speed signals and signal integrity (SI) considerations for low layer count PCB layouts. The information is also applicable to the equivalent FG256 package and can be used to optimise board layout for other devices and packages |
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ESG89001 Electro Magnetic compatibility and printed circuit board (PCB) constraints
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2002-11-08 |
| This application note discusses how to get a PCB functioning properly, by outlining the various constraints involved including EMC and EMI |
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Importing text from a file into ACCEL SCH or PCB
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2001-05-28 |
| This application note describes a procedure that can be used to import small text files into ACCEL PCB or SCH using the Windows clipboard and the place text command in ACCEL |
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