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EE Times India - total search 348 articles sort by date sort by relevance

X-ray effects on Intersil FGA references	2010-06-23
Specific threats for X-ray radiation include PCB post-assembly inspection and airport luggage screening. Lesser threats include medical X-ray machines and airport carry-on X-ray
Dual foot print layout notes for DP83865 Gig PHYTER V and DP83847 DS PHYTER II	2004-06-17
This app note contains information needed to combine the 10/100 DS PHYTER II and the 10/100/1000 Gig PHYTER V on the PCB
Creating an external aperture file using an internal aperture file	2001-05-29
This application note describes how to create an external aperture file (.apr) from a PCB database that has an internal aperture table attached to it
Design and application guide for SG6859D	2009-11-03
This application note describes a design strategy for a high-efficiency compact flyback converter. Design considerations and mathematical equations are presented, as well as the guidelines for PCB layout
Design and application guide for SG6859D	2010-01-15
This application note describes a design strategy for a high-efficiency compact flyback converter. Design considerations and mathematical equations are presented, as well as the guidelines for PCB layout
Replacing a PowerCap module with a reflowable BGA module	2004-11-23
This app note demonstrates the conversion of an existing PCB design utilizing a NV SRAM PowerCap module to the equivalent NV SRAM single-piece reflowable BGA module
Using and understanding ports	2001-05-28
This application note describes the port feature in the ACCEL Schematic PCB design tool
Removing ERC and DRC error indicators	2001-05-28
This application note describes how to remove ERC and DRC error indicators from an SCH or PCB drawing after the ERC or DRC report has been generated
SG1577A layout guidelines	2010-02-23
This layout is important in high-frequency switching converter design. If designed improperly, PCB can radiate excessive noise and contribute to converter instability
Layout and design guidelines for the MC13883	2010-03-03
This application note describes guidelines for a PCB footprint for the QFN40 package used for the MC13883 integrated charger
i.MX layout recommendations	2009-10-01
This application note gives recommendations for PCB design to improve the behaviour of the signals and create more robust designs
Perform layer stacking	2010-12-28
To deal with PCB stacking layer changes one must maintain the trace impedances when copying an original design
Layout recommendations for the MC34848	2010-08-19
This application note provides general guidelines for laying out a proper PCB design in two-layers for the MC34848 device
Final Inch designs in PCIe apps	2009-03-12
Here's a measurement method applied to Final Inch designs and PCIe to help engineers deploy systems of two PCB cards mated through electrical connectors
Displaying alternate views of a symbol	2001-05-28
This application note describes a procedure that allows alternate views of a symbol for a component in a PCB design
Inverted F antenna for 868MHz, 915MHz and 955MHz ISM bands	2011-11-11
Read about a PCB antenna designed for operation in the 868MHz, 915MHz and 955MHz ISM bands
71M6511/71M6511H 2-Layer demo board quick start guide	2010-08-04
The TSC 71M6511/71M6511H demo board is used for evaluating the 71M6511/71M6511H device for single-phase electronic power metering applications on a two-layer PCB
Soldering Methods and Procedures for 1st and 2nd Generation Power Modules	2003-06-27
This application note is intended to provide guidance in utilizing soldering practices to make high quality connections of Vicor Power Modules to PCB
Printed Circuit Board identification using 1-Wire products	2002-11-26
This application note discusses how to implement PCB identification for plug and play capability using the company's 1-Wire devices
MC13892 layout guidelines	2010-04-27
This application note is intended to show good practices on how to layout the MC13892 PCB for a correct functionality of the whole system
Supporting two SD devices with a single SD bus host controller	2007-04-27
To fulfil the increasing demand of additional SD device by host manufacturers, the designers are using an embedded SD-based device such as a SanDisc iNAND Module to the hosts containing SD slots. The module is a BGA-packaged embedded product with an SD interface. It can be soldered directly to the PCB. Designers also have an option of adding an SD slot to a host with embedded iNAND. This application note explains the designers various options to incorporate an iNAND Module when the host controller does not support two SD interfaces
71M6521 demo board quick start guide	2010-09-17
The TSC 71M65121 demo board is used for evaluating the 71M6521D, 71M6521F and 71M6521B devices for single-phase electronic power metering applications on a two-layer PCB
Printed circuit board design for LSM1 VCOs	2001-06-04
This application note describes the pad footprint recommended for solder attachment and some of the electrical and thermal considerations to incorporate into the PCB design
PowerPAD thermally enhanced package	2010-01-27
This application note focuses on the specifics of integrating a PowerPAD package into the PCB design
How to clear Flash	2001-05-29
This application note describes how to use the clear flash command in the PCB Editor
Controlled impedance design and test	2001-08-27
This application note provides information to assist OEMs and PCB vendors to design and test motherboards that will meet a 28W (?0 percent) impedance specification
BGA (Ball Grid Array)	2000-11-30
This application note discusses the PCB layout guidelines and package-to-board assembly for a BGA package
Circuit refinements ensure quality audio in portable devices	2009-08-24
This article examines key parameters affecting headphone amp performance including: PSRR, turn-on transient suppression and PCB grounding
Designing a Hi-Speed USB host PCI adapter using the ISP1561	2010-04-30
This application note contains a description of the ISP1561 application schematics and the PCB design recommendations
6 PAK demo board	2002-05-09
This application note describes the 6 PAK demo board, a 4-inch PCB designed to easily demonstrate how a single 6-PAK controller and up to eight 6-PAK boost SIPs can convert 5V to any voltage from 1.8V to 3.6V and output up to 54A (6A per SIP

---total search 348 articles, total 12 pages, The 3 Page---

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EE Times Asia - total search 2442 articles

Efficient power electronics is key to widespread HEV adoption	2012-02-09
100V buck regulator features integrated MOSFETs	2012-01-30
DC/DC controller touts 95% efficiency at 2MHz	2012-01-24
Capacitive proximity detection paves way for vehicle convenience features	2012-01-23
Impact of 4Gbps FireWire on industrial apps	2012-01-18
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