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EE Times India - total search 121 articles sort by date sort by relevance
ADSL CO Driver Design And Thermal Resistance 2001-04-03
International IC - China 7 Conference Proceedings 151 In the last few years, the demand for high speed Internet access, LAN, and short distance data communication have been growing exponentially and growth is expected to continue through the year 2005.  
RapidIO and PCI Express: so similar, yet so different 2003-04-16
RapidIO and PCI Express: so similar, yet so different  
SuperHyway provides SoC backbone 2000-12-01
A step ahead of CompactPCI, Compact Packet Switching Backplane (cPSB) is emerging as a viable solution for interconnect problems.  
High-voltage devices simplify design of PoE powered device 2006-09-26
This paper provides an overview of the key system-level requirements and benefits one must consider when integrating high-voltage devices into a PoE powered device interface and power management controller.  
The multiple challenges and solutions to flash LED drivers 2008-03-31
The article discusses some of the problems and challenges in using flash LED drivers for mobile devices. Here are some suggestions on how to overcome and solve these obstacles in using these LED drivers.  
Increase switcher efficiency, reduce size 2008-08-04
Board layout differentiates a good switcher design from a bad one. Today's switching regulators and supplies are compact and powerful, but a major trade-off is their higher switching frequency that makes board design all the more difficult.  
Integrating functions in a DVD+RW video recorder 2004-03-16
Integrating functions in a DVD+RW video recorder  
Choosing the right data bus in industrial, automotive apps 2004-05-03
Choosing the right data bus in industrial, automotive apps  
Transient induced failure of miniature resistors 2000-12-01
Transient induced failure of miniature resistors the substrate, and can cause local hotspots that reach the melting-point temperature of the track material  
Overcome FPGA I/O pin assignment challenges 2009-03-13
Remove the pain from the pinout process with a mix of smart I/O planning and new tools.  
Simplifying LVDS Backplane Design In 3G Wireless Basestations 2001-04-03
The increasing demand for bandwidth is driving the communi-  
A/D conversion tutorial 2006-12-05
This article presents a concept-by-concept discussion through some common A/D parameters.  
RF SiP technology moves to wireless design mainstream(1) 2006-08-22
This article specifies the design challenges of RF SiP methodology and suggests a manageable, cost-effective solution.  
Spying on the GPS Snitch 2009-01-30
With the introduction of this GPS device, live tracking is now in the hands of the masses.  
SMD package for power MOSFETs 2009-04-09
Know the advantages of surface-mounted device packages over through hole ones for power MOSFETs.  


 
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