Transient induced failure of miniature resistors
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2000-12-01 |
| Transient induced failure of miniature resistors the substrate, and can cause local hotspots that reach the melting-point temperature of the track material |
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| Maximise high-speed signal integrity, Part 3
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2009-04-02 |
| Know the things to look for when shopping for electronics and ICs to address signal integrity and signal equalisation. |
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| A novel SBU dielectric and coating system
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2001-11-01 |
| This technical article describes a novel dielectric coating system as well as a new material that enhances thin foil use and via plugging. |
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| The ramifications of component selection
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2001-08-16 |
| Need to know what is the most important electrical specification for a connector or IC package? This article looks at what is generally the hardest problem in component selection. |
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| Maximizing voice quality across 3G nets
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2004-08-02 |
| Integration of echo cancellers in the gateway delivers superior voice quality in 3G networks. |
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| Integrating GPS receivers with passive antennas
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2003-12-01 |
| The impact of the direct integration of passive antennas on the GPS system performance is analyzed. The low-gain low noise radio front-end stage, the low levels of inter-system interference and the optimum loading of the analog-to-digital converter enabled the direct connection between the GPS radio and the passive antenna with high sensitivity. |
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| Closing the loop on ESD
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2001-08-16 |
| This article updates you on the recent advances that allow you to network ESD protection products together so that crucial ESD data can be automatically acquired and analyzed. |
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| HDI and microvia design for high-performance
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2001-06-08 |
| High density-interconnect (HDI) printed circuits are now being designed in ever increasing quantities. This article focuses on the high-speed industrial systems for HDI. |
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| Solder masks: Examining rules of thumb
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2001-02-01 |
| Learn the plane facts about cuts in power planes and solder mask on surface layers. |
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| Dimensioning and tolerancing
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2001-07-01 |
| Engineers should maximize the use of GD&T to acquire the economic and technical advantages on engineering drawings and design. |
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| Better ground wiring in DC/DC converters
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2003-06-16 |
| Know the proper copper trace pattern and placement of components when designing printed wiring board. |
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| Practical DFT leads to highly testable ASICs
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2001-06-01 |
| Combine classic design-for-test methodologies, such as scan and BIST, with practical DFT, to clear the path to a highly testable design |
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| DFM guidelines for through-hole technology
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2001-07-01 |
| Everything you wanted to know about through-hole design for manufacturability (DFM) but were afraid to ask. |
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| Modular component design reuse
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2001-05-01 |
| To meet the challenges of product development in the technology age, it is essential that firms adopt the principles of modular design components to provide a more streamlined design process in developing PCBs. |
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| High-speed boards meet PCIe challenge
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2008-07-16 |
| PCI Express currently serves as the most widely used GPIO interconnect for a wide variety of computing and communications platforms. Point-to-point serial differential links, as adopted by PCIe, is now being widely recognised as a suitable alternative for high-speed data transfer applications. |
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| Addressing signal integrity in backplane interconnects
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2005-07-18 |
| Signal integrity is a basic requirement in deploying higher speed communications links and services |
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| Direct plate processing for PCBs
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2001-02-01 |
| Is direct-plate processing really as robust as electroless copper? Here is a detailed evaluation. |
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| Co-design methodology for system interconnect
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2004-05-17 |
| This article outlines a co-design methodology supported by a unique platform that enables design and analysis of the electronic system interconnect from IC to IC, across packages, connectors, backplanes and PCBs. |
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| Solder paste process control for CSPs and 0201s
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2003-01-16 |
| This technical article discusses a more effective strategy to improve first pass yields and prevent defects from occurring in CSPs and 0201s. |
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| Validate EMC design rules with 3D simulation
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2001-07-16 |
| This article provides an overview of EMC- and 3D-analysis tool capabilities that can enhance an your design's performance. |
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| Guide to rapid prototyping of capacitive sensors
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2008-08-21 |
| This article demonstrates practical techniques to build and assess various physical configurations of capacitive switch sensors. |
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| Differential Hall ICs under aggressive conditions
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2004-09-16 |
| Learn how Infineon combined two Hall cells, a differential amplifier and evaluating circuitry on a single chip. |
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| Connectorless probes simplify digital design
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2004-08-16 |
| With connectorless probes, designers can probe their signals without having to compromise board space or signal integrity. |
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| Modelling for accurate Serdes design
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2007-12-16 |
| This paper describes an algorithmic modelling methodology that gives you flexibility in modelling your serial I/O device accurately while providing you with all the IP protection you need. |
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| Speeding up internal data pipe connection
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2002-07-16 |
| The emerging 10Gbps specification promises to solve some tricky design headaches, particularly in chip-to-chip and interboard communications. |
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| Efficiently extract heat from heat sinks
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2005-04-18 |
| Find out how much heat can be extracted from a heat sink to examine parameters that impact thermal performance |
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| Package efficiency: A boost to power MOSFETs
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2003-04-16 |
| DirectFET technology has radically reduced package resistance and inductance, and facilitated a large reduction in the thermal resistance. |
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| How to maintain registration of buildup microvias
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2001-06-01 |
| The key to building up multiple microvia-layer circuits is the registration of the microvias and the conductor pattern of the microvia layers. |
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| Design Trends and EDA Tools: China & Taiwan
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2003-09-18 |
| This joint study by EE Times?sia and Gartner Dataquest conducted in the year 2003 reveals information on the latest design trends in China and Taiwan. The white paper is the result of a survey conducted by EE Times?sia on China- and Taiwan-based electronics design community across industries. |
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| Integration drives embedded HW, SW development
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2005-01-03 |
| Effective integration of hardware and software flows leads to a reduction in late design errors while improving overall efficiency. |
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Strange modes of transport and other "stuff"
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