Wire gauging the traditional trace
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2001-09-16 |
| This technical article presents a "how to" approach to determine the relationships that can be derived between trace area and wire gauge. |
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| Integrating GPS receivers with passive antennas
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2003-12-01 |
| The impact of the direct integration of passive antennas on the GPS system performance is analyzed. The low-gain low noise radio front-end stage, the low levels of inter-system interference and the optimum loading of the analog-to-digital converter enabled the direct connection between the GPS radio and the passive antenna with high sensitivity. |
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| 10Gbps serial data over copper backplanes - a reality
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2003-11-17 |
| The communications industry has all the building blocks to create a system that can deliver aggregate bandwidth of tens of terabit-per-second efficiently brought about by the availability of 10Gbps NRZ serial technology. |
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| DFM guidelines for through-hole technology
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2001-07-01 |
| Everything you wanted to know about through-hole design for manufacturability (DFM) but were afraid to ask. |
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| Solder masks: Examining rules of thumb
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2001-02-01 |
| Learn the plane facts about cuts in power planes and solder mask on surface layers. |
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| Dimensioning and tolerancing
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2001-07-01 |
| Engineers should maximize the use of GD&T to acquire the economic and technical advantages on engineering drawings and design. |
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| Better ground wiring in DC/DC converters
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2003-06-16 |
| Know the proper copper trace pattern and placement of components when designing printed wiring board. |
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| Design Trends and EDA Tools: China & Taiwan
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2002-10-01 |
| This joint study by EE Times?sia and Gartner Dataquest conducted in the year 2002 reveals information on the latest design trends in China and Taiwan. The white paper is the result of a survey conducted by EE Times?sia on China- and Taiwan-based electronics design community across industries. |
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| Efficiently extract heat from heat sinks
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2005-04-18 |
| Find out how much heat can be extracted from a heat sink to examine parameters that impact thermal performance |
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| Co-design methodology for system interconnect
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2004-05-17 |
| This article outlines a co-design methodology supported by a unique platform that enables design and analysis of the electronic system interconnect from IC to IC, across packages, connectors, backplanes and PCBs. |
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| How to maintain registration of buildup microvias
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2001-06-01 |
| The key to building up multiple microvia-layer circuits is the registration of the microvias and the conductor pattern of the microvia layers. |
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| HDI and microvia design for high-performance
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2001-06-08 |
| High density-interconnect (HDI) printed circuits are now being designed in ever increasing quantities. This article focuses on the high-speed industrial systems for HDI. |
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| Guide to rapid prototyping of capacitive sensors
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2008-08-21 |
| This article demonstrates practical techniques to build and assess various physical configurations of capacitive switch sensors. |
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| Direct plate processing for PCBs
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2001-02-01 |
| Is direct-plate processing really as robust as electroless copper? Here is a detailed evaluation. |
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| Modular component design reuse
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2001-05-01 |
| To meet the challenges of product development in the technology age, it is essential that firms adopt the principles of modular design components to provide a more streamlined design process in developing PCBs. |
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