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EE Times India - total search 190 articles sort by date sort by relevance

Parallel design technology revolutionizes circuit board	2004-08-02
The technology enables concurrent progress on a common database, automatically synchronizing changes - a first in the EDA industry.
Improve ESD protection in cellphones	2005-10-03
Dual clamping claims to bring better electrostatic discharge immunity compared to current single ESD-protection diodes
Outlining operation principles of PhotoMOS relays	2003-06-02
The characteristics, architecture, and typical circuit of the PhotoMOS relay control circuit, as well as ways to ensure reliability in use are discussed in this article.
Serial ATA: Designing for high-speed storage	2005-03-16
Designing with SATA requires a new way of thinking for everyone. Here are layout rules to ensure a working implementation
LVDS pre-emphasis boosts cable performance	2005-05-16
Moving streams of data over copper cables can be done more cost-effectively without lagging in performance
Design Trends and EDA Tools: China & Taiwan	2002-10-01
This joint study by EE Times?sia and Gartner Dataquest conducted in the year 2002 reveals information on the latest design trends in China and Taiwan. The white paper is the result of a survey conducted by EE Times?sia on China- and Taiwan-based electronics design community across industries.
10Gbps serial data over copper backplanes - a reality	2003-11-17
The communications industry has all the building blocks to create a system that can deliver aggregate bandwidth of tens of terabit-per-second efficiently brought about by the availability of 10Gbps NRZ serial technology.
Address SI issues in high-speed board design	2007-03-16
This article discusses some of the SI challenges and the factors associated with high-speed interface designs that are enabled with key features of a RapidIO switch.
Wire gauging the traditional trace	2001-09-16
This technical article presents a "how to" approach to determine the relationships that can be derived between trace area and wire gauge.
Effective interconnect space reduction formation	2001-05-16
Significant technical progress has been made with newly developed materials and with the introduction of new components, this evolution has become possible. This paper describes the benefits of using microvias.

---total search 190 articles, total 7 pages, The 7 Page---

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EE Times Asia - total search 2442 articles

Efficient power electronics is key to widespread HEV adoption	2012-02-09
100V buck regulator features integrated MOSFETs	2012-01-30
DC/DC controller touts 95% efficiency at 2MHz	2012-01-24
Capacitive proximity detection paves way for vehicle convenience features	2012-01-23
Impact of 4Gbps FireWire on industrial apps	2012-01-18
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