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EE Times India - total search 1 Related Webinar Topics sort by date sort by relevance
Topic: Thermography Eases Prototype Test for PCBA Development
Sponsor: Fluke
Time: 2011-05-31 , 2011-05-31
Introduction: High temperature accounts for 55% of electronic product failures. In general, a 1℃ increase above the maximum limit can lead to 5% reduction in the product's reliability.
The second part in a series on thermography, this webinar teaches you how to: 1. Use a thermal imager to supplement routine tests by tools like oscilloscopes and multimeters. 2. Gain a better understanding of the load profile of components using a color-coded thermal profile. 3. Use a thermal imager to locate problems like short circuits or components in the absence of in-circuit or functional testing.
Engineers attending the webinar take away the knowledge and tools that aid better circuit design, lower power consumption and higher conversion efficiency.

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