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Electronic Engineering Sources

2010-04-16	Memristors: Next big thing in memory?
	Memristor, the fourth passive circuit element after resistors, capacitors and inductors, waits for a killer application to get it off the ground.
2010-04-13	Anna University bags TI Analog Design contest
	Texas Instruments awards Anna University, Chennai the wining spot in it's first ever Analogue Design contest for Indian universities while IIT-Madras and IIT-Delhi were placed second and third respectively.
2010-04-12	IBM: Expect design rule explosion beyond 22nm
	IBM researcher Kevin Nowka described the physical design challenges beyond the 22nm node, emphasizing that sub-wavelength lithography has made silicon image fidelity a serious challenge.
2010-04-12	Feature rich UHF ICs enable cost effective sol'n
	NXP unveils the UCODE G2iL and G2iL+ UHF chips that enable read ranges based on a simple, cost-effective single antenna solution.
2010-03-18	SunEdison to build largest solar plant of 72MW in Europe
	The Italian government has granted the final approval to SunEdison to develop and construct the largest photovoltaic solar power plant of 72MW near Rovigo in Northeastern Italy
2010-03-17	NTU, NI collaborate on wireless comms
	NTU and National Instruments (NI) are collaborating to develop the next-generation wireless communication technologies which are cheaper, faster, more reliable and more pervasive.
2010-03-12	Fuel-coated carbon nanotubes act as fuses
	MIT researchers are utilising fuel-coated carbon nanotubes as "fuses" for thermowave electrical power sources which ignites its fuel to produce electricity through a newly discovered technique.
2010-03-08	Wipro brings eco-friendly desktops
	Wipro InfoTech rolls out 100% recyclable toxin free desktops in India
2010-03-04	Apps processor targets next-gen e-reader
	Freescale debuts the i.MX508 applications processor specifically targeted for e-readers and is designed to deliver performance, energy efficiency and system cost savings.
2010-02-26	EC sets up task force for nanoscale memory project
	The European Commission has established a taskforce to design future microchip memories and the project is expected to last three years.
2010-02-26	Bridge ICs target mobile phones
	TAEC rolls out three bridge chips for handsets designed to help customers implement more advanced technologies in their mobile phone designs.
2010-02-22	Verification: Key to automotive apps success
	Many problems occur when hardware meets software, especially in automotive applications. As per Swapnil Sapre, MindTree, hardware verification methodologies is the key to success.
2010-02-04	Simulation tool boosts performance up to 100x
	Virginia Tech team's faster simulation tool for SystemC based hardware models bags the best paper award at the 15th Asia and South Pacific Design Automation Conference (ASP-DAC)
2010-02-04	Karnataka unveils semicon policy at ISA Vision Summit
	The government of Karnataka, in association with IT department and the India Semiconductor Association (ISA), rolled out the state semiconductor policy at the 5th ISA Vision Summit 2010.
2010-02-04	Future research avenues in EDA
	Prith Banerjee, senior VP of research and director HP Labs, highlighted promising avenues in EDA with live examples at the VLSI conference.
2010-02-02	ISA focuses summit vision on growth
	The India Semiconductor Association (ISA) kicked off Vision Summit 2010 focused on India Market¡ªMomentum for growth in the new decade.
2010-01-29	Chitkara University, Synopsys launch masters programme
	Chitkara university and Synopsys Inc. have in collaboration with Seer Akademi have jointly launched a Master of Engineering programme specialising in 'Microelectronic Systems'.
2010-01-25	NXP, Intrinsic-ID to create more secure chips
	NXP and Intrinsic-ID entered a collaborative agreement to license and deploy a hardware intrinsic security (HIS) solution in NXP's SmartMX security chip technology
2010-01-25	Intel, Carnegie Mellon work on chip packaging
	They have devised an RF heating technique for solder magnetic nanoparticle (MNP) composites that can sufficiently heat solders to cause reflow without placing computer chips in conventional ovens.
2010-01-21	Stage gets ready for 3D TV
	The consumer electronics industry dons a pair of stereo 3D glasses to look at its future. The left eye sees an opportunity to revive sagging TV and media revenues, the right eye sees a set of unresolved technical issues.
2010-01-13	Focusing on bottom-up innovation
	MindTree's Janakiraman believes this year will be the tipping point for demand that will require engineers to innovate specifically for the bottom of the pyramid in developing economies, like India and China.
2010-01-12	Recession forces focus on core competencies, costs
	Cadence president Lip-Bu Tan says the recent economic recession has focused semiconductor companies on core competencies and boosted collaborative efforts. EDA companies must deliver solutions to cut costs.
2010-01-11	KnS to spread Farnell services in India
	This strategic partnership with Kits n Spares brings forth Farnell's commitment to provide wide range of products and support the electronic design engineering communities in India.
2010-01-08	VLSI design conference pushes affordable tech
	The 23rd International Conference on VLSI Design and the 9th International Conference on Embedded Systems focuses on affordable technology for emerging markets.
2010-01-07	Microtune ships DTV tuners to Samsung
	Microtune's patented single-chip TV silicon tuners for DTVs are deployed by Samsung Electro Mechanical Co.
2010-01-06	2010 fearless semiconductor forecasts
	EE Times' Mark LaPedus offers his chip forecasts and other prediction for 2010.
2010-01-05	What to sort out in electronics in 2010
	EE Times editors list nettlesome issues they'd most like to see electronics engineers fix next year ranging from grand challenges of engineering to niggling nettles of consumer gadgetry.
2009-12-30	More opportunities open for India electronics design
	Consumption of technology has led to electronic system design opportunity in industrial, medical, transportation, and energy management fields in India.
2009-12-29	WD, NEC promote SuperSpeed USB standard
	USB 3.0 offers data transfer speeds up to 5Gbps, which is 10x faster than the previous high-speed USB 2.0 transfer speeds.
2009-12-28	VLSI conference tackles 2010 design challenges
	Dr. Mahesh Mehendale, general chair, International Conference on VLSI Design, talks about the event in 2010. Mehendale is director, Centre of Excellence for Digital Video, TI India, and the only TI Fellow in Asia.
2009-12-18	Rambus buys GLT's patents, technology
	This acquisition broadens Rambus' solutions for computing and consumer electronics.
2009-12-15	Ansys 12.1 tech builds more automation in product dev't
	Ansys Inc. has made available Ansys 12.1 technology to support customers in Simulation Driven Product Development. This latest release incorporates tools that further automate the product development process.
2009-11-25	Silicon-air batteries promise infinite shelf life, high energy
	Silicon-Air battery from Technion-Israel institute of technology can go on for thousands of hours without replacement.
2009-11-17	PaLFI device powers implantable medical apps
	The PaLFI device combines a low-frequency wireless interface with an SPI interface for ultrastable communication within a very well-defined activation/communication zone
2009-11-04	Intersil, Georgia Tech team on power ICs
	Intersil engineers and Georgia Tech students and faculty will focus on creating advanced power management circuit designs.
2009-11-04	Gold-snowflaked graphene makes better electronics
	Kansas State University researchers found that embedding gold on graphene can functionalise it by controlling its electronics properties.
2009-10-29	Increasing telematics spurs need to boost car security
	The rising complexity of a vehicle's electronic inner lifer and the increasing exposure to telematics and consumer electronics enforces a more open discussion on security issues.
2009-10-12	Premier Farnell ups focus on India electronics design
	Premier Farnell talked to EE Times India about its community web site "element14" and its plans to address the electronic design engineering community and the MRO marketplace in India.
2009-09-29	ArvinMeritor opens technical centre in India
	ArvinMeritor has established a technical centre which will lead the company's advanced product development initiatives.
2009-09-29	How virtualisation works
	To fully understand the performance implications of using virtualisation in your own designs, it helps to know the basic principles that make virtualisation hardware and software.
2009-09-29	Tiny oscillators handle -40¡ãC to +85¡ãC
	AVX Corp. has beefed up its SMD temperature compensated crystal oscillator (TCXO) series to include AEC-Q200 approved versions.
2009-09-28	Power devices cut out external current monitors
	Maxim's new flash configurable sequencers/monitors simplify power management and reduce power consumption.
2009-09-25	Wipro-NewLogic employees get political
	Aiming to make people more aware, the 61 employees of Wipro-NewLogic in Sophia Antipolis, France, first informed the press and are now trying to take their job-threatened situation political.
2009-09-24	'Thinnest' microSD card connector rolls
	Alps Electric has developed the SCHA series of microSD card connector for mobile phones and other compact digital devices.
2009-09-24	NXP, Skymeter sort out road user charging
	They will combine NXP's automotive telematics platform with Skymeter's billing applications and services.
2009-09-24	Improve system design testing processes with CMMI
	Requirements-based testing is widely viewed as a best practice according to corporate standards such as the Capability Maturity Model Integration (CMMI).
2009-09-23	Five steps to a solid firmware architecture
	Whether you're designing firmware architecture from scratch or launching a re-architecture effort, you can use this step-by-step process to get started on the right foot.
2009-09-23	Entropic, ViXS develop MoCA NAS ref design
	Entropic and ViXS are developing an advanced HD network attached storage reference design that enables premium content capture, storage and sharing over a MoCA home network.
2009-09-23	Rambus, Kingston team for multi-core computing
	Rambus and Kingston are collaborating to develop a threaded module prototype that uses DDR3 DRAM tech.
2009-09-23	Dev't board prototypes designs in a snap
	Altium rolls a new FPGA-based development board that eases instant prototyping of electronic designs.
2009-09-23	Cypress opens new PSoC lab at Bhubaneswar
	Cypress Semiconductor Corp. and Bhubaneswar Institute of Technology (BIT) have partnered to set up a Programmable System on Chip (PSoC) lab at Bhubaneswar.
2009-09-22	Aricent, Cavium team on LTE core solutions
	Aricent and Cavium Networks have entered into a development collaboration for LTE evolved packet core.
2009-09-22	MOSFET driver tips 60V for LCD backlights
	Toshiba America Electronic Components Inc. has announced a 60V power MOSFET driver for white LEDs.
2009-09-22	Execs tackle ASIC, FPGA design challenges
	The ASIC versus FPGA debate took an interesting turn, as executives from two design tool firms offered duelling keynote address on the virtues of and challenges facing FPGA-based and ASICs-based SoCs designs
2009-09-21	Wipro Infotech opens India tech innovation hub
	Wipro Infotech has established a technology innovation hub in Bangalore, which will work across technologies to develop innovative IT solutions.
2009-09-21	Ethernet faces demand, cost pressures
	In one of the central ironies of the Internet era, Websites and service providers are driving bandwidth requirements through the roof while pushing the system costs through the floor.
2009-09-18	Spectrum analyzer measures through Ku band
	Tektronix's new spectrum analyzer exceeds all the capabilities of the company's RSA6000 series.
2009-09-18	CMOS sensors enable customizable SNR performance
	Image sensor specialist e2v is set to ship by the end of this year a range of 1.3Mixel CMOS sensors targeting industrial applications and having embedded features.
2009-09-18	IBM helps smarten health care in Thailand
	Bangkok Hospital Group is teaming up with IBM to upgrade its patient care services.
2009-09-17	Samsung Electro-Mechanics receives RF4CE certification
	Samsung Electro-Mechanics announced that it has attained Zigbee RF4CE certification in Korea.
2009-09-16	40nm FPGA tailored for high-end digital apps
	Altera Corp. has extended its high-end density range of its 40nm Stratix IV E FPGAs to 820K logic elements (LEs).
2009-09-16	RF transceiver cuts need for SAW filters, LNAs
	Fujitsu Microelectronics America as unveiled what it claims to be the first 3G SAW-less transceiver.
2009-09-16	Magneti Marelli, ST sign electric vehicle memo
	Magneti Marelli and STMicroelectronics have signed a memorandum of understanding that extends the Formula 1 agreement between the two companies.
2009-09-15	Agilent, RS Components extend distribution pact
	Agilent Technologies Inc. has selected RS Components as a distributor of its test and measurement products in Asia.
2009-09-15	Denso, Freescale, TRW push auto bus standard
	The companies formed a DSI consortium that seeks to enhance the capability of DSI bus systems, expand apps.
2009-09-15	India technology centre gets Synopsys grant
	Synopsys named IIT-Kharagpur as the recipient of the Charles Babbage Grant.
2009-09-14	RF tuners support multiple mobile TV standards
	Analog Devices Inc. has beefed up its line-up of mobile TV RF product family with the introduction of what the company claims is the smallest terrestrial mobile TV RF tuners.
2009-09-14	Touch screen controllers handle multiple touches
	Atmel's maXTouch platform gives larger screens zoom, rotate, handwriting and shape recognition functions.
2009-09-11	3D TSV group boosts Singapore IC industry
	Singapore forms a 3D TSV consortium with industry players to push semiconductors into the next-generation.
2009-09-10	LSI, Aricent tie up for wired, wireless nets
	LSI Corp. and Aricent are expanding their strategic collaboration to accelerate the global deployment of wireless and wireline networking infrastructure and enterprise networking systems.
2009-09-10	Will Wipro exit semiconductor IP biz?
	R&D services provider Wipro Technologies has apparently decided to get out of the semiconductor IP business.
2009-09-09	600V MOSFETs ups reliability of resonant converters
	Fairchild's 600V Super-Junction MOSFETs touts that its low RDS(ON) and total gate charge brings 40 per cent lower Figure of Merit compared to the 600V SuperFET MOSFETs.
2009-09-09	Understanding automotive instrument cluster apps
	The complexity of vehicle electronics has significantly increased during the last 20 years. A large number of new functionalities require a significant amount of status information to be displayed to the driver.
2009-09-09	Freescale's Beyer: Recession is over
	Freescale Semiconductor CEO Rich Beyer declared the recession over and said the global semiconductor industry has reached the upside of its cycle entering 2H 09.
2009-09-08	Sony to turn on 3D viewing at home
	Sony Corp. revealed plans to lead the way in delivering new 3D viewing experiences by bringing 3D to the home in 2010.
2009-09-08	Atom companion PMIC fits automotive apps
	Dialog Semiconductor Plc and Harman Becker have developed the DA6001 power management IC as a companion device for the Intel Atom processor.
2009-09-08	Qualcomm, MTNL enhance 3G services in India
	MTNL and Qualcomm said they are jointly auditing MTNL's 3G network to improve customer experience.
2009-09-03	Sony, Hon Hai embark on LCD alliance
	Sony is forming a strategic alliance with Hon Hai Precision Industry Co. Ltd for the production of LCD TVs.
2009-09-02	Monitors enable 3Gbps SDI eye pattern display
	The new Tektronix waveform monitors offer 3Gbps SDI support, precise colour grading adjustments.
2009-09-02	Specialised PCBs meet medical device needs
	Electronic Interconnect announces PCBs that are specialised for medical device electronic assemblies.
2009-09-02	Switching regulator cuts quiescent current
	Linear's newest 700mA, 36V input step-down switching regulator features power-on reset and watchdog timer.
2009-09-01	Singapore moisture-resistant film research gets funding
	Applied Venture is investing in Singapore's Tera-Barrier Films on the development of a new moisture-resistant film that can extend the life span organic solar cells and flexible displays.
2009-09-01	Nanoparticle inks drive down solar cell costs
	Solar cells could soon be produced more at lower costs using nanoparticle "inks" that allow them to be printed like newspaper or painted onto the sides of buildings or rooftops to absorb electricity-producing sunlight.
2009-08-28	IDT, Immersion push haptics in digital apps
	Integrated Device Technology Inc. and Immersion Corp. are working together to drive the adoption of haptics in digital devices.
2009-08-28	Analogue IC reduces small engine emissions
	Freescale Semiconductor is offering a new analogue chip that could reduce emissions from small petrol engines.
2009-08-27	FPGAs tailored for wireless, wireline apps
	Lattice Semiconductor Corp. is sampling LatticeECP3(TM)-150 FPGA, the highest-density device in its high-value, low-power ECP3 mid-range FPGA family.
2009-08-27	New process makes inorganic LEDs more flexible
	Researchers claim to have developed a new process for creating ultrathin, ultrasmall inorganic LEDs that can be assembled into large arrays.
2009-08-26	PLL/synthesiser runs at 1,800-1,860MHz
	Crystek's new CPLL58-1800-1860 PLL/synthesiser is housed in a compact 15mm x 20mm x 4mm SMD package.
2009-08-25	Good management keeps MindTree, TI teams in sync
	Project management is critical to the success of the work conducted between MindTree in Bangalore, India, and Texas Instruments in Dallas, United States.
2009-08-25	Ethernet switch includes 24 1GbE link ports
	DTI's CSB4624 offers full IPv6 support, twenty-four 1GbE link ports and three 10GbE connections.
2009-08-24	Li-ion battery keeps stable voltage discharge
	Sony is offering a new type of Li-ion battery that promises higher power and longer life than the performance of traditional alkaline and Li-ion batteries currently on the market.
2009-08-24	Survey finds outsourced IC design slowdown
	2009 will be a make or break year for chip design service providers after the recession slowed the growth of outsourced chip design starts last year, according to a Gartner survey.
2009-08-21	HP CEO: Business is stabilising
	Hewlett-Packard Co.'s net profit fell considerably in Q3, but a financial analyst said the results bode well for semiconductor suppliers.
2009-08-20	GPS receiver ensures reliability in automotive apps
	Vincotech has beefed up its GPS receiver line-up by a variant specifically designed and manufactured to address requirements in the automotive industry.
2009-08-20	High-speed LDO delivers low supply current
	Torex Semiconductor Ltd is offering a new 700mA high-speed transient response low dropout regulator (LDO) with reverse current protection.
2009-08-19	Delhi undergrads bag Rs.73,272 with unmanned aircraft
	Undergraduate students from Delhi College of Engineering have won Rs.73,272 and Director's award for the best team effort for successfully demonstrating an unmanned aerial vehicle at the 2009 AUVSI annual student unmanned aircraft system competition.
2009-08-19	NI, SolidWorks team on mechatronics tool
	National Instruments and Dassault Systemes SolidWorks are working on a mechatronics tool for motion system design.
2009-08-19	Nanospears ups solar cell efficiency
	Microscopic, spear-shaped zinc oxide crystals on a silicon surface may produce more efficient solar cells.

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