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2010-04-16	Tessolve, DTS set to merge
	The Tessolve/DTS combination results in a comprehensive integrated hardware and software test solutions company that can support the largest and most diverse needs of IDMs and fabless companies.
2010-04-15	TSMC moves from 28nm to 20nm half-node
	Taiwan Semiconductor Manufacturing Co. Ltd will give the 22nm "full node" a miss by moving on directly to the 20nm "half node" from the 28nm node.
2010-04-12	Feature rich UHF ICs enable cost effective sol'n
	NXP unveils the UCODE G2iL and G2iL+ UHF chips that enable read ranges based on a simple, cost-effective single antenna solution.
2010-04-07	CNSE, Technic partner on R&D in solar cells
	The CNSE of the University at Albany and Technic Inc. have tied up in an R&D partnership to enable solar cell electroless plating.
2010-04-07	Self-powered nanosensors run on mechanical energy
	Researchers have created what they claim are the first self-powered nanometre-scale sensing devices that draw power from the conversion of mechanical energy.
2010-04-06	IM Flash hiring signals ramp-up for Singapore fab
	IM Flash Technologies LLCs has advertised dozens of jobs openings in Singapore signalling the ramp-up for the 300mm fab.
2010-03-31	Light capable of twisting nanoparticle ribbons
	University of Michigan engineers and their collaborators have demonstrated that light can twist ribbons of nanoparticles, a phenomenon that took them three years to believe.
2010-03-25	Power IC includes 5 programmable DC/DC converters
	Dialog Semiconductor Plc debuts the DA9057 system-level power management IC that has five on-board DC/DC converters to support 24bit stereo audio headphone playback on a 5mW power budget.
2010-03-19	3D PLDs pack 5.5MB RAM, 920 parallel I/Os, 44 PLLs
	Tabula Inc. has launched its ABAX family of 40nm 3D PLDs that enables high-performance, compute-intensive applications on a programmable platform at volume price points.
2010-03-18	Speciality foundries spread their wings
	The speciality foundries Dongbu, MagnaChip, TowerJazz and X-Fab are expanding with new capabilities or alliances.
2010-03-17	Process tech eases ASIC conversion
	Tier Logic Inc. has revealed a few details about a technology that employs a new processing change to build FPGA and ASIC products on a single die.
2010-03-08	Model-based design program targets industrial systems
	The Mathworks debuts the Simulink PLC coder that generates IEC 61131 structured text that enables model-based design for manufacturing and power generation equipment controlled by PLCs and PACs.
2010-03-08	Wipro brings eco-friendly desktops
	Wipro InfoTech rolls out 100% recyclable toxin free desktops in India
2010-03-08	Dual USB2.0 host/slave controller is programmable
	Future Technology Devices International (FTDI) has introduced a user programmable dual USB 2.0 host/slave intelligent SoC controller that supports up to 44 IO pins.
2010-03-05	MCU sub-system tipped flash-based FPGAs eases design
	Actel Corp. debuts the SmartFusion family of flash-based FPGAs with microcontroller sub-system that enables optimisation of hardware-software trade-offs "on the fly" without board-level changes.
2010-03-04	Apps processor targets next-gen e-reader
	Freescale debuts the i.MX508 applications processor specifically targeted for e-readers and is designed to deliver performance, energy efficiency and system cost savings.
2010-03-02	Intel, TSMC Atom partnership hits a roadblock
	Intel has no immediate plans to bring to market any Atom chips manufactured by TSMC, confirming a report that their partnership has hit a roadblock.
2010-03-01	Power amp enables low battery current for 3G
	The Javelin JAV5001 power amplifier integrates complete circuitry for power regulation, PA bias, input and output matching and power control into a tiny 3mm x 3mm package.
2010-02-26	Bridge ICs target mobile phones
	TAEC rolls out three bridge chips for handsets designed to help customers implement more advanced technologies in their mobile phone designs.
2010-02-24	Deserialiser bridge IC targets HD panels
	Toshiba Electronics Europe is offering a new deserialiser display bridge chip that is designed to help customers implement more advanced technologies in their handheld products.
2010-02-22	Verification: Key to automotive apps success
	Many problems occur when hardware meets software, especially in automotive applications. As per Swapnil Sapre, MindTree, hardware verification methodologies is the key to success.
2010-02-18	Novellus joins IBM, CNSE on 22nm process
	Novellus joins the ecosystem of semiconductor companies at CNSE's Albany NanoTech Complex that are working with IBM on the development of semiconductor process solutions for 22nm and beyond.
2010-02-12	Brazil steps up semiconductor efforts
	Brazil government reveals plans to promote semiconductor industry in the country at the opening of Latin America's first semiconductor fab.
2010-02-09	RFMD, Nujira team up for 4G broadband PA
	Nujira and RF Micro Devices Inc. have jointly developed a broadband power amplifier (PA) design that covers seven defined LTE frequency bands.
2010-02-04	Future research avenues in EDA
	Prith Banerjee, senior VP of research and director HP Labs, highlighted promising avenues in EDA with live examples at the VLSI conference.
2010-02-02	UV LEDs offer 385/405/415nm wavelengths
	From Lumex comes the QuasarBrite UV LEDs that provide a 10x longer lifespan, tight beam angle, enhanced durability and up to 50 per cent cost savings compared to alternative technologies.
2010-01-25	NXP, Intrinsic-ID to create more secure chips
	NXP and Intrinsic-ID entered a collaborative agreement to license and deploy a hardware intrinsic security (HIS) solution in NXP's SmartMX security chip technology
2010-01-19	South Korea counts on renewable energy
	New renewable energy will help the Korea government's 'Low Carbon, Green Growth' vision to achieve new employment and economic growth, and enable security of green energy supply and energy export resources.
2010-01-15	Better, greener life with less power
	Here is an insight into the eco-friendly, touch sensing and 3D display technologies which were exhibited at the Korea Electronics Grand Fair 2009
2010-01-14	Tech, tech practice to boost 2010 engineering success
	Mathworks India Pvt. Ltd managing director, Kishore Rao has identified parallel language, early verification with Model-Based Design as cornerstones of engineering success in 2010.
2010-01-13	ISS: Panelists ponder on IC manufacturing fate
	At SEMI's Industry Strategy Symposium (ISS), panellists agreed to disagree on the fate of IC manufacturing among other issues.
2010-01-11	China may achieve double IC production in 10 years
	SEMI report indicates that China's focus on narrowing the gap between its IC production and consumption could lead to doubling the country's global equipment and materials market in ten years.
2010-01-07	Microtune ships DTV tuners to Samsung
	Microtune's patented single-chip TV silicon tuners for DTVs are deployed by Samsung Electro Mechanical Co.
2010-01-06	2010 fearless semiconductor forecasts
	EE Times' Mark LaPedus offers his chip forecasts and other prediction for 2010.
2010-01-05	What to sort out in electronics in 2010
	EE Times editors list nettlesome issues they'd most like to see electronics engineers fix next year ranging from grand challenges of engineering to niggling nettles of consumer gadgetry.
2009-12-24	Compact ESD protection device offers lower clamping voltage
	The device provides a single channel of bi-directional ¡À30kV contact ESD protection in a very compact outline (0.6 mm x 0.3mm).
2009-12-23	Cosmic Circuits taps Cadence Virtuoso 6.1
	The Virtuoso 6.1 has boosted Cosmic's productivity and turnaround time by 30% over its previous flow.
2009-12-15	Ansys 12.1 tech builds more automation in product dev't
	Ansys Inc. has made available Ansys 12.1 technology to support customers in Simulation Driven Product Development. This latest release incorporates tools that further automate the product development process.
2009-12-11	New ISO/IEC standard to ensure effective software docs
	ISO has published a new standard to help testers and reviewers of software user documentation in their work.
2009-12-04	Memory test solution achieves up to 800Mbps
	The Magnum 2x test solution is capable of testing over 1280 devices in parallel.
2009-12-03	PCIe switch delivers high-end graphics for gamers
	PLX's PEX 8647 PCIe Gen 2 switch has been selected as high-performance, peer-to-peer connectivity solution on the ATI Radeon HD 5970 dual-GPU graphics cards.
2009-11-30	Sematech seeks collaboration, looks into fabless
	Sematech is exploring options to attract fabless companies into the fold and is hoping to expand its collaborative efforts with fab tool makers,
2009-11-17	PaLFI device powers implantable medical apps
	The PaLFI device combines a low-frequency wireless interface with an SPI interface for ultrastable communication within a very well-defined activation/communication zone
2009-11-13	Automakers wary about electric vehicles
	By 2020 only 5-8 per cent of all vehicles sold would be plug-in full-electric or hybrid.
2009-11-06	FPGAs promise power, space, cost savings
	Altera Corp. has released the latest Cyclone low-cost FPGA family, which adds support for mainstream serial protocols and offers a rich supply of logic, memory and DSP capabilities.
2009-11-02	RTC packs tuning fork crystal, oscillator
	Micro Crystal has launched a SMD package real time clock (RTC) that typically draws just 130nA @ 3V.
2009-10-19	64Gbit memory cards integrate 4X technology
	SanDisk Corp. has started shipping memory cards based on the company's X4 flash memory technology.
2009-10-09	Incap revs up India design unit
	Incap plans to extend its design operations in India, aiming to double its current design team of 15 people by 2010.
2009-09-16	40nm FPGA tailored for high-end digital apps
	Altera Corp. has extended its high-end density range of its 40nm Stratix IV E FPGAs to 820K logic elements (LEs).
2009-09-16	RF transceiver cuts need for SAW filters, LNAs
	Fujitsu Microelectronics America as unveiled what it claims to be the first 3G SAW-less transceiver.
2009-09-15	Denso, Freescale, TRW push auto bus standard
	The companies formed a DSI consortium that seeks to enhance the capability of DSI bus systems, expand apps.
2009-09-14	Touch screen controllers handle multiple touches
	Atmel's maXTouch platform gives larger screens zoom, rotate, handwriting and shape recognition functions.
2009-09-10	LSI, Aricent tie up for wired, wireless nets
	LSI Corp. and Aricent are expanding their strategic collaboration to accelerate the global deployment of wireless and wireline networking infrastructure and enterprise networking systems.
2009-09-08	Sony to turn on 3D viewing at home
	Sony Corp. revealed plans to lead the way in delivering new 3D viewing experiences by bringing 3D to the home in 2010.
2009-09-08	Atom companion PMIC fits automotive apps
	Dialog Semiconductor Plc and Harman Becker have developed the DA6001 power management IC as a companion device for the Intel Atom processor.
2009-09-03	Sony, Hon Hai embark on LCD alliance
	Sony is forming a strategic alliance with Hon Hai Precision Industry Co. Ltd for the production of LCD TVs.
2009-09-02	Monitors enable 3Gbps SDI eye pattern display
	The new Tektronix waveform monitors offer 3Gbps SDI support, precise colour grading adjustments.
2009-09-01	Singapore moisture-resistant film research gets funding
	Applied Venture is investing in Singapore's Tera-Barrier Films on the development of a new moisture-resistant film that can extend the life span organic solar cells and flexible displays.
2009-08-27	FPGAs tailored for wireless, wireline apps
	Lattice Semiconductor Corp. is sampling LatticeECP3(TM)-150 FPGA, the highest-density device in its high-value, low-power ECP3 mid-range FPGA family.
2009-08-13	Intel-Micron duo enters x3 NAND market
	Intel Corp. and Micron Technology Inc. have officially announced their first offering in the 3-bit-per-cell (x3) NAND arena.
2009-07-07	Nanomaterial measurement gets better
	SPAR technique removes systematic bias, noise and equipment-based artifacts from experimental data.
2009-07-07	Will LTX-Credence's new ATE strategy work?
	Mark LaPedus opines on the LTX-Credence's chances of competing against ATE big shots such as Advantest, Verigy and Teradyne.
2009-07-06	OEMs feel chip ban sting
	Systems makers may be beginning to feel the bite of a limited exclusion order banning the import of chips from six companies found to infringe two packaging patents of Tessera Technologies Inc.
2009-07-02	MosChip, IdealBT team up for NAS apps
	MosChip and IdealBT combine expertise to develop a complete solution for network attached storage.
2009-06-29	DSP delivers 3D acoustics
	A DSP employing new virtual surround SRS TruSurround HD/HD4 is launched by New Japan Radio.
2009-06-26	DSP tailored for audio systems
	New Japan Radio unveiled a DSP with equalising functions to address audio quality degradation.
2009-06-19	Solar facility for Q-Cells completed
	M+W Zander completed the construction of a new solar cell manufacturing facility for Q-Cells, Malaysia.
2009-06-19	TSMC moves to 28nm with SRAM cell
	TSMC claims it has developed the first functional 64-Mbit SRAM cell, based on its 28nm technology.
2009-06-12	PSoC devices boast enhancements
	Cypress has announced two programmable system-on-chips with improved analogue and digital performance.
2009-06-09	CEVA's good fortune: How long will it last?
	BDTI's Bier believes that the real worry for CEVA comes when the industry transitions from 3G to 4G.
2009-06-08	TSMC boosts R&D efforts
	TSMC is appealing to other integrated device makers and other stakeholders to share in R&D costs.
2009-05-29	Indian student helps solve SOFC flaw
	A materials science professor has invented an SOFC seal that could help bring efficient energy technology to market.
2009-04-28	Four-channel driver IC shrinks board size
	IR has introduced the IRS2093 for high performance Class D audio apps including home theatre systems.
2009-04-21	Team-up announces embedded SD/SDIO solution
	Eureka Technology and embWiSe announced a partnership of software and hardware solution to their customers.
2009-04-15	110-nm ASIC platform cuts NRE costs
	ON Semi has licensed 110nm process technology and associated IP from LSI to serve as the basis for a new ASIC platform.
2009-04-15	MIT method could lead to narrower chip patterns
	The researchers have found a way of harnessing an etching method to create a mask with etch lines just 36nm wide.
2009-04-06	Virus-built battery to power cars, electronics
	MIT researchers have engineered viruses to build both the positively and negatively charged ends of a Li-ion battery.
2009-04-02	Cypress names winners of PSoC design contest
	Cypress Semiconductor has announced the winners of its PSoC Innovator Design Challenge India.
2009-03-26	Nanocapacitors to store renewable energy
	Maryland NanoCentre researchers have developed new systems for storing electrical energy derived from alternative sources.
2009-03-24	Tool suite for electrical systems design
	Mentor Graphics announced the deployment of the CHS electrical systems design tool suite by a leading truck OEM.
2009-03-16	Intel still pushes China fab plan
	Intel has asserted that it remains on schedule to have its 300mm fab in China in production next year, denying industry rumours about the company calling off its plans for the facility.
2009-03-12	Xi'an HTDZ emerges as China's R&D hotbed
	With China pinning its plans for industrial transformation on electronics and IT, Xi'an is now working on becoming the nation's R&D hotbed.
2009-03-06	Image sensors come with integrated EDoF
	ST has developed the first quarter-inch optical format, 3Mpixel raw Bayer sensors with integrated EDoF capabilities.
2009-03-06	Litho vendors hit by R&D gap, lousy economy
	The lithography industry continues to be plagued by an R&D gap, technology delays, and, of course, the lousy economy.
2009-03-04	Consortium eyes Qimonda's PV biz
	Qimonda AG's photovoltaics activities in northern Portugal are reportedly being eyed by a German-Portuguese consortium that is already working on the funding.
2009-03-03	IBM, Applied, NanoCollege to co-develop 22nm process modelling
	IBM Corp. and Applied Materials Inc. will be working with the College of Nanoscale Science and Engineering (CNSE) of the University at Albany on process modelling technology for the manufacture of 22nm logic and memory chips.
2009-03-02	Experts express doubts about next-gen litho
	Next-generation lithography (NGL) technologies like EUV, maskless nanoimprint and advanced double-patterning continue to face a lot of difficulties, according to a panel at the SPIE Advanced Lithography conference.
2009-02-25	System improves yield, efficiency in solar cell production
	MKS Instruments introduces the Genesis Solar Yield Management System aimed at improving solar cell manufacturing.
2009-02-23	Made in India: DFM tool checks, analyses in single session
	Geometric's DFMPro integrated in the Pro/ENGINEER design environment targets designs that are difficult, expensive and almost impossible to manufacture.
2009-02-12	FPGAs with integrated 11.3-Gbps transceivers
	Altera's Stratix IV GT and Arria II GX 40-nm FPGA families join Stratix IV GX FPGAs and HardCopy IV GX ASICs.
2009-02-12	Handheld prototyping tool boasts new features
	The STM32 Primer2 has a colour touchscreen, joystick/push button, extension connector and pre-loaded sample apps.
2009-02-11	Start-up claims major breakthrough in RRAM
	The company is now looking for a manufacturing partner to bring its so-called "4DS memory" into mass production.
2009-02-11	Analysis: Plug-and-play IP goal still elusive
	Users still complain of the lack of standards and effective quality metrics that they say would help greatly in confidently selecting IP.
2009-02-09	'Programmable imperative' keeps Xilinx optimistic
	Xilinx executives Amit Dhir and Neeraj Varma share the company's view on the changing semiconductor landscape, the trends driving programmables' success despite the slow economy, and India as a "backbone" to their business.
2009-02-06	A/D converter IP-cores suit monitoring apps
	Cosmic Circuits has announced its portfolio of more than 20 cores A/D converters for monitoring applications.
2009-02-05	Quartus II software upgraded
	The 9.0 version includes full support for Altera's portfolio of transceiver FPGAs and HardCopy ASICs.
2009-02-04	Analysis: Is there a future for IBM Micro?
	The question begs an answer after IBM Corp. cut 1,200 jobs within its systems and chip units, following a significant drop in sales, product setbacks and a number of false starts in the sector.
2009-02-03	Renesas CEO retires amid losses, layoffs
	The world's largest MCU supplier changes executives as it deals with major losses brought on by the IC slump.
2009-01-29	Sematech launches green tech centre
	ISMI's ESH Technology Centre will be dedicated to develop green tech solutions for IC production.
2009-01-29	Ex-IBM exec cleared to join Apple
	Papermaster will start work as senior vice president of devices hardware engineering at Apple on April 24.
2009-01-23	Moser Baer ready to produce thin film solar modules
	The 40MW capacity line is the largest thin film solar line in India, boasts Moser Baer.
2009-01-21	Team-up to focus on advanced batteries
	University of Michigan has teamed up with GM to accelerate the design and testing of advanced batteries for electric vehicles.
2009-01-21	'Programmable broadband' has arrived for PC TV
	CrestaTech has demonstrated a "region-free TV," capable of receiving analogue or digital TV broadcast, radio and GPS signals.
2009-01-21	MEMS technology pushes ST to the top
	ST's sales of MEMS devices for portable and consumer devices surged to Rs.1,045.76 crore ($209 million) in 2008.
2009-01-21	Expanding efficiency with rapid prototyping
	Can rapid prototyping be seriously considered for reducing development time and costs and expanding market position?
2009-01-19	Synopsys CEO sees delays in 32-/28-nm era
	Economic factors could delay IC designs based on 32-/28nm processes, says Synopsys CEO Aart de Geus.
2009-01-09	Fab-tool, materials markets off to shaky start
	Based on the early returns, the fab-tool and electronic materials markets are off to a rough start in 2009.
2009-01-06	Japan still tough for foreign distributors
	The world's second-biggest economy is proving especially difficult for foreign electronic component distributors.

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