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RF Design Sources

2010-04-16	Tessolve, DTS set to merge
	The Tessolve/DTS combination results in a comprehensive integrated hardware and software test solutions company that can support the largest and most diverse needs of IDMs and fabless companies.
2010-04-14	WLED driver with dimmer control suits LCD panels
	From Micrel Inc. comes the MIC3263 six-channel WLED driver equipped with a flicker free dimming control scheme for LED brightness in small LCD panels.
2010-04-14	Wi-Fi packed FEMs target smart phones
	Microsemi Corp. expands its family of WLAN power amplifier (PA) solutions with the highly-integrated LX5553 802.11b/g/n FEM for the smart phone market.
2010-04-12	Integrated RF ICs target broadband apps
	Analog Devices Inc. has launched two RF ICs for broadband communications that integrate multiple functions and discrete devices into a single chip, reducing component count by a factor of four.
2010-04-07	Integrated GPS front-ends cuts need for external parts
	Avago Technologies debuts the ALM-2712 front-end module that packs LNA, pre- and post high-rejection FBAR filters and other RF matching components that cuts the need for external RF matching components.
2010-04-05	RF power amp targets defence apps
	BC Systems delivers Model RF40015, an RF power amplifier that targets defence applications with a blanking speed of <5s.
2010-04-01	AirHop, NetLogic work on small-cell 3G ref designs
	AirHop Communications and NetLogic Microsystems are working together to develop reference designs for small-cell heterogeneous 3G and 4G/LTE mobile networks.
2010-03-24	Designing an antenna for the M24LR64-R dual interface I2C/RFID device
	This application note aims to explain the basic principle of passive RFID; describe the basics of a 13.56MHz inductive antenna design; and provide guidelines for a successful integration¡ªfrom design to production.
2010-03-19	Mentor, ST partner on 32/20nm design solutions
	Mentor Graphics Corp. and STMicroelectronics have entered a broad-scoped collaboration three-year project, named DeCADE, to build on advanced design solutions for SoC development for digital and analogue design.
2010-03-18	RF front-ends reduce handset assembly costs
	RFMD has rolled out the RF7178 front-end module that offers full quad-band transmit performance (GSM850/EGSM900/DCS1800/ PCS1900) and four dedicated receive ports in a compact single-placement package.
2010-03-15	RF VSGs, VSAs suit multi-channel MIMO wireless apps
	National Instruments rolls out RF vector signal generators (VSGs) and vector signal analysers (VSAs) for multichannel MIMO RF design and test applications.
2010-03-12	RF range extender provides up to +149dB link budget
	Texas Instruments Inc. is rolling out a highly-integrated, cost-effective RF range extender that combines PA, LNA, switches for low-power wireless applications at 850MHz to 950MHz.
2010-03-11	MRF49XA radio utility program
	The MRF49XA Radio Utility Driver Program provides design engineers a development and testing platform for the MRF49XA 433/868/915MHz RF transceiver.
2010-03-10	Molex's Beijing set up targets mobile design
	Molex Inc. has opened a mobile product design facility located in Beijing, to provide front-end solution support for mobile antenna and connector designs.
2010-03-10	Foolproof Zigbee module eases app dev't
	The programmable XBee-PRO ZB from Digi International enables applications to be programmed directly on the module, eliminating the need and cost of a separate processor and reducing time-to-market.
2010-03-10	NXP's fab-lite movement gathers momentum
	Fab-lite movement gathers momentum at NXP with it closing down wafer fabs ICH in Germany and ICN5 in the Netherlands, and announcing plans to close ICN6 by early-to-mid 2011.
2010-03-05	Wireless MCUs designed for smart home apps
	Silicon Laboratories debuts Si10xx wireless microcontroller family with ultra low-power architecture and fast wake-up time (2¦Ìs) to extend battery life in both lithium and alkaline battery apps.
2010-03-03	TI: Mobile phones split architecture will rise
	Greg Delagi, senior VP and general manager of Texas Instruments' wireless terminals business unit believes that the so-called "split architecture" for handsets is set to rise.
2010-03-01	Smarter feature handsets on the cards
	Broadcom Corp.'s Robert Nalesnik talks about the trends in the mobile handset market, products and the company's strategies going forward.
2010-02-26	Smartphone HSPA+ sol'n measures < 600mm2
	Infineon has unveiled the XMM6260 platform an addition to its 3G slim-modem family which it touts is the smallest HSPA+ solution for 3G smart phones.
2010-02-25	Mephisto tools IMEC's green radios program
	In collaboration with Mephisto Design Automation (MDA), IMEC will use MDA's M-Design to develop mixed-signal reconfigurable radios for its green radios program.
2010-02-25	Audio sub-systems packs analogue bypass switch
	Maxim Integrated rolls out mono audio sub-systems that packs low-noise, analogue DPST audio switch which eliminates an external switch and reduces power usage as the Class D amplifier is bypassed.
2010-02-24	Buck-boost converter voltage range suits all PC card slots
	The LTC3127's input range of 1.8V to 5.5V is compatible with all types of PC card slots, USB and single-cell Li-ion or dual/triple-cell alkaline/NiCd/NiMH applications.
2010-02-24	GPS receiver offers PCB footprint of 30mm2
	Broadcom Corp. has unveiled its single-chip GPS solution for mobile devices that is said to set new standards in performance and low power consumption.
2010-02-22	Multi-mode, multi-band PAs target smart phones, data cards
	Skyworks Solutions Inc.'s highly-integrated multimode power amplifier (PA) modules support up to five W-CDMA bands and are optimised for specific mobile data requirements.
2010-02-19	Modem ref design targets high-speed mobile apps
	U-blox modem ref design packs base band processor, RF transceiver, antenna multiplexer and PA components to support eight bands of HSPA/UMTS/Edge/GPRS/GSM.
2010-02-19	RF transceiver packs 12bit ADC, DAC
	Lime offers the LMS6002D multiband, multistandard RF transceiver IC that operates at user-selectable frequencies between 375MHz and 4GHz and is suitable for 3G, WiMAX, and LTE operation.
2010-02-19	Ref design enables entry-level Android smart phones
	Infineon Technologies AG is offering the XMM6181 that offers OS support for Android and smart phone functionality for handsets with wholesale prices of between Rs.4,617.70 -Rs.6,926.55 ($100 -150).
2010-02-19	RF switches enable low-cost 3G smart phones
	RF Micro Devices has successfully qualified and released its first high-power RF CMOS switch using high-resistivity silicon substrates for next-generation 3G and 4G smart phones.
2010-02-18	Dual-band power amps offer low quiescent current
	Anadigics' AWC6323 dual-band CDMA power amplifier targets handsets and data cards.
2010-02-18	65nm quad-radio IC sol'n cuts cost by 30%
	Texas Instruments Inc. has rolled out its 65nm WiLink 7.0 single-chip solution, claimed to be the first radio IC offering to integrate WLAN 802.11n, GPS, FM transmit/receive and Bluetooth technologies.
2010-02-17	Trio works on LTE RF transceiver
	IMEC, Renesas Technology Corp. and M4S developed a 40nm transceiver with RF, base band and data converter circuits that is compatible with 3GPP-LTE amongst other wireless standards.
2010-02-16	Nujira forms OpenET alliance
	The new OpenET Alliance will cover both terminal and infrastructure applications, and membership is open to any company or organisation with an interest in this technology or its application.
2010-02-16	ST-Ericsson lists mobile handset trends for 2010
	In an exclusive with EE Times, ST-Ericsson senior VP and head of strategic planning Edgar Auslander lists what the company believes are the main mobile handset trends for 2010.
2010-02-16	Semiconductors transform modern day applications
	Arun Jain, director sales and marketing, Texas Instruments India highlights the impact of the semiconductor industry in fields of medical electronics and energy.
2010-02-11	MEMS combines angular rate, acceleration sensors
	The device is the latest contribution by Bosch's to the automotive industry's Electronics Stability Programme. Bosch is offering integrated inertial sensor modules that combine yaw rate and acceleration sensor stacked on an ASIC in a moulded SOIC16w package.
2010-02-09	RFMD, Nujira team up for 4G broadband PA
	Nujira and RF Micro Devices Inc. have jointly developed a broadband power amplifier (PA) design that covers seven defined LTE frequency bands.
2010-02-09	Power amp tailored for WiMAX mobile apps
	The AWT6283R delivers high linear output power, exceptional efficiency and consistent RF performance over the full 3.3GHz to 3.8GHz WiMAX frequency band.
2010-02-05	Optimism marks 2010 EDA forecasts
	EE Times lines up estimates and predictions of EDA gurus Walden Rhines, Gary Smith, and Joseph Borel for this year's EDA market.
2010-02-05	SkyCross, Altair collaborate on LTE sol'n
	The SkyCross iMAT MIMO antenna powered Altair FourGee LTE USB ExpressCard UE doubles up as a reference design and test platform
2010-02-05	Spectrum analyser packs touchscreen for ease of use
	Aeroflex's 3250 series spectrum analysers pack an optional 8GHz tracking generator to include testing on higher frequencies used for popular wireless applications..
2010-02-04	Using CC2591 front-end with CC2530/1
	The CC2530 is TI's second-generation Zigbee/IEEE 802.15.4 RF SoC for the 2.4GHz unlicensed ISM band. This application note describes how to implement the CC2530 and the CC2591 in the same design.
2010-02-04	Cypress joins Open Handset Alliance
	Developing a touchscreen device driver to support the Android mobile handset platform, Cypress Semiconductor Corp. has joined the Open Handset Alliance.
2010-02-03	HSPA+ RF transceiver boasts 28.8Mbps downlink rate
	Infineon Technologies AG is offering the SMARTi UE2 multi-band HSPA+/Edge/GPRS RF transceiver that integrates all LNAs and interstage filters.
2010-02-02	Infineon exec addresses IDM challenges in wireless sector
	At the recently-held VLSI conference, Hermann Eul, member of the management board, Infineon Technologies AG Deep delivered his keynote on deep sub-micron CMOS technology.

2010-01-29	Altair, Anadigics partner to spread LTE adoption
	The companies who have already delivered innovative solutions to the marketplace will now have Altair integrating Anadigics power amplifiers into an LTE USB ExpressCard.
2010-01-29	Using CC2591 front end with CC2520
	The CC2520 is TI's second generation Zigbee/IEEE 802.15.4 RF transceiver for the 2.4GHz unlicensed ISM band. CC2591 is a range extender for 2.4GHz RF transceivers, transmitters and SoC products from TI. This application note describes how to combine the CC2520 and the CC2591 in the same design.
2010-01-27	Setting the pace for next-gen cellular technology
	As the cellular industry moves to more powerful, flexible and sophisticated products, time-to-market remains vital while driving reductions in size, cost, complexity and test times.
2010-01-12	Broadcom, Foxlink, slash Bluetooth mice price
	The Broadcom SoC based Foxlink mouse design significantly reduces the cost of wireless mice.
2010-01-12	40Gbps receiver enables environment-friendly networks
	The DQPSK receiver increases the spectral efficiency, providing enhanced tolerance to both chromatic and polarisation mode dispersions.
2010-01-12	Dual-engine GPS chip enhances navigation accuracy
	The Atheros AR1520 includes two new features that deliver fast location fixes similar to an assisted GPS system, but without the need for network assistance.
2010-01-11	5GHz WLAN PA targets home wireless apps
	The power amplifier increases range and data throughput enabling OEMs to take advantage of the broad bandwidth available in the 5GHz unlicensed spectrum around the world.
2010-01-07	Microtune ships DTV tuners to Samsung
	Microtune's patented single-chip TV silicon tuners for DTVs are deployed by Samsung Electro Mechanical Co.
2010-01-06	2010 fearless semiconductor forecasts
	EE Times' Mark LaPedus offers his chip forecasts and other prediction for 2010.
2010-01-05	WLAN ref design achieves 600Mbps connection
	From Quantenna Communications Inc. comes a complete reference design based on its QHS600 IEEE 802.11n WLAN 4x4 multiple input, multiple output (MIMO) chipset.
2010-01-04	Beamformer modules speed up system level design
	Pentek's beamformer PCIe modules are designed to accelerate system level design and lower system cost.
2010-01-04	Then and now: The recession effect on design services
	Sankalp Semiconductor's CEO Vivek Pawar recounts the tough times during the recession last year and projects a bounce back in business during 2010.
2009-12-29	Mobile WiMAX software suite ups test time to 300%
	National Instruments debuts measurement software suite for mobile WiMAX as well as complies with other standards such as Fixed WiMAX, WLAN, GPS, and GSM/EDGE/WCDMA cellular standards.
2009-12-28	Sharp taps Cypress TruTouch sol'n for its mobile phones
	Cypress's flexible PSoC-based touchscreen solution enables multi-touch gesture capability in a 4.0-inch "half-XGA" LCD.
2009-12-22	Broadcom 40nm chip enables HD handsets
	Broadcom Corp. rolls out its first 40nm cell phone media processor capable of recording full 1080-progressive high-definition video.

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