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EDA/IP  

NanoStar & NanoFree 300µm solder bump wafer chip-scale package application

Posted: 16 Jun 2004  Print Version  Bookmark and Share Subscribe

Keywords: nanostar  nanofree  csp  chip scale package 

[Summary of tips] This app note provides the necessary design and reliability information to apply the NanoStar 300µm solder bump packages.View the PDF document for more information.
 
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