Global Sources
EE Times-India
 Outlook 2010   VLSI Design Conference 2010   Cornerstone of success in 2010
EE Times-India > Manufacturing/Packaging
 
 
Manufacturing/Packaging  

Solder paste process control for CSPs and 0201s

Posted: 16 Jan 2003  Print Version  Bookmark and Share Subscribe

Keywords: csp  pcb  aoi  ict  critical parameter 

[Summary of tips] This technical article discusses a more effective strategy to improve first pass yields and prevent defects from occurring in CSPs and 0201s.View the PDF document for more information.
 

Comment on "Solder paste process control for CSP..."
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Highly Recommended Application Notes

Max's Cool Beans

Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut