Global Sources
EE Times-India
 DAC 2010 coverage   Academia on employability gap   VLSI Design Conference 2010
EE Times-India > EDA/IP
 
 
EDA/IP  

DFM guidelines for through-hole technology

Posted: 01 Jul 2001  Print Version  Bookmark and Share Subscribe

Keywords: dfm guidelines  through hole  pcb design  board assembly  component placing 

[Summary of tips] Everything you wanted to know about through-hole design for manufacturability (DFM) but were afraid to ask.View the PDF document for more information.
 

Comment on "DFM guidelines for through-hole tech..."
Comments:  
*  You can enter [0] more charecters.
*Verify code:
 
Highly Recommended Application Notes

Max's Cool Beans

Clive Maxfield Strange modes of transport and other "stuff"

Someone just pointed me at a YouTube video that claims to show the world's first e-powered multicopter flight...

 

Go to top             Connect on Facebook      Follow us on Twitter      Follow us on Orkut