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Manufacturing/Packaging  

Effective interconnect space reduction formation

Posted: 16 May 2001  Print Version  Bookmark and Share Subscribe

Keywords: microvia  csp  pcb  rcc  bga 

[Summary of tips] Significant technical progress has been made with newly developed materials and with the introduction of new components, this evolution has become possible. This paper describes the benefits of using microvias.View the PDF document for more information.
 

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